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AMD XC3S250E-4VQG100C
- Part No.:
- XC3S250E-4VQG100C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 100-TQFP
- Datasheet:
-
XC3S250E-4VQG100C.pdf
- Description:
- IC FPGA 66 I/O 100VQFP
- Quantity:
- Payment:
- Shipping:
Inventory:8,381
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Product details
Overview
XC3S250E-4VQG100C from AMD (formerly Xilinx) is a Spartan-3E FPGA with 250K system gates, 480 logic cells, 128 KB of total block RAM, and configured for -4 speed grade in a 100-pin VQFP package. It targets low-cost embedded control, industrial I/O bridging, and digital peripheral interface logic.
For engineers reviewing the XC3S250E-4VQG100C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (66 user I/Os), single-ended LVCMOS/LVTTL support, internal 1.2 V core voltage, and JTAG boundary-scan compliance for production testability.
Technical Context
The XC3S250E-4VQG100C implements a configurable logic fabric based on 4-input LUTs and flip-flops, with dedicated carry logic for arithmetic functions. It integrates twelve 18×18 multipliers and supports distributed RAM up to 16 bits wide per LUT.
Configuration is performed via master serial mode using an external PROM or through JTAG boundary-scan. The device includes Digital Clock Managers (DCMs) capable of frequency synthesis, phase shifting, and duty-cycle correction - supporting input clocks from 12 MHz to 200 MHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 480 - provides combinational and sequential logic capacity for small-to-medium control state machines |
| System Gates | 250,000 - indicates overall logic density suitable for peripheral interface and glue logic replacement |
| User I/O Pins | 66 - supports parallel bus interfacing, GPIO expansion, and sensor/actuator control in compact layouts |
| Block RAM | 128 KB - enables FIFO buffering, lookup tables, and small data storage without external memory |
| DCM Units | 4 - allows independent clock domain management for multiple peripherals with jitter tolerance ≤ ±100 ps |
| Core Voltage | 1.2 V - requires dedicated low-noise regulation; reduces dynamic power vs. older 1.8 V FPGA families |
| Speed Grade | -4 - guarantees timing closure at 333 MHz maximum I/O toggle rate and 250 MHz internal clock frequency |
Pinout & Package
XC3S250E-4VQG100C is housed in a 100-pin Very Thin Quad Flat Pack (VQFP) with 0.5 mm pitch, 14 × 14 mm body size, and exposed pad for thermal dissipation. Pin assignment follows Xilinx Spartan-3E family standard layout.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PIN_1 (T1) | PROGRAM_B | Active-low configuration initiation signal; pulled high internally, must be driven low to reset configuration |
| PIN_2 (U1) | INIT_B | Open-drain status output indicating configuration progress; high = ready, low = busy or error |
| PIN_3 (V1) | CCLK | Configuration clock input; drives internal shift register during master serial mode loading |
| PIN_4 (W1) | DIN | Serial configuration data input; synchronous to CCLK rising edge in master serial mode |
| PIN_5 (Y1) | TCK | JTAG test clock input; required for boundary-scan testing and in-system programming |
| PIN_6 (AA1) | TMS | JTAG test mode select; controls TAP controller state transitions |
| PIN_7 (AB1) | TDI | JTAG test data input; feeds instruction/data registers during scan operations |
| PIN_8 (AC1) | TDO | JTAG test data output; serially shifts out captured or computed test results |
Key Features
| Feature | Design Value |
|---|---|
| Embedded Multipliers | Twelve 18×18-bit signed/unsigned multipliers enable real-time filtering and motor control math without external DSP |
| SelectIO Technology | Supports LVCMOS, LVTTL, PCI, and SSTL standards - simplifies interface to legacy microcontrollers and memory devices |
| Digital Clock Manager (DCM) | Four DCMs provide jitter-reduced clock synthesis, phase alignment, and frequency doubling for mixed-signal synchronization |
| Configurable Logic Blocks (CLBs) | Each CLB contains two slices with four LUTs and eight flip-flops - optimized for pipelined datapaths and finite-state machine encoding |
| Boundary-Scan Support | IEEE 1149.1-compliant JTAG chain enables board-level test, debug, and in-field reconfiguration |
Applications
| Industrial PLC I/O Expansion | Legacy Bus Interface Bridge |
|---|---|
Use Scenario: Adding isolated digital I/O channels to programmable logic controllers using existing 24 V DC field wiring. IC Role / Device Role / Timing Role: FPGA acts as protocol-transparent I/O mapper with real-time signal conditioning and debounce logic. Use Value: Enables reuse of legacy HMI and ladder logic software while extending channel count without MCU firmware changes. | Use Scenario: Interfacing an 8-bit microcontroller with a 16-bit SRAM or ISA-style peripheral via level-shifted address/data bus. IC Role / Device Role / Timing Role: Timing-critical bus translator implementing wait-state insertion and address decoding. Use Value: Eliminates discrete glue logic chips and reduces PCB layer count by consolidating address latching, strobe generation, and bus arbitration. |
| Motor Control Feedback Processor | Medical Sensor Signal Preprocessor |
Use Scenario: Capturing quadrature encoder signals and analog current feedback from BLDC motor drivers in closed-loop servo systems. IC Role / Device Role / Timing Role: Real-time counter and ADC interface controller with deterministic interrupt latency under 200 ns. Use Value: Provides sub-microsecond timing resolution for commutation timing and overcurrent fault response, improving torque ripple and safety margin. | Use Scenario: Conditioning and time-stamping analog outputs from ECG, EEG, or pulse oximetry sensors before transmission to host MCU. IC Role / Device Role / Timing Role: Synchronized multi-channel sample-and-hold controller with digital filtering and packet framing logic. Use Value: Reduces host CPU load by offloading baseline drift correction and noise suppression, enabling lower-power host operation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S500E-4VQG100C | 500K gates, 948 logic cells, same package and pinout - higher density but identical I/O and DCM architecture | Suitable for designs requiring additional state machines or larger FIFOs without board redesign | Select when future scalability or added peripheral integration is anticipated within same footprint |
| LFE5U-25F-8MG285C | 25K LUTs, 1.2 V core, 100-pin CABGA - newer architecture with embedded SERDES and lower static power | Better suited for USB 2.0 or MIPI-CSI2 interface consolidation where transceivers are needed | Choose for new designs prioritizing power efficiency and integrated high-speed I/O over legacy toolchain compatibility |
Compared with XC3S250E-4VQG100C, the XC3S500E-4VQG100C offers direct density upgrade path with zero layout change, while the LFE5U-25F-8MG285C delivers modern low-power features and transceiver capability at the cost of Vivado-only tool support and no ISE compatibility.
Availability
XC3S250E-4VQG100C is available at Aetrix Electronics and suitable for industrial automation, medical device manufacturing, and legacy system refurbishment requiring stable component supply and long-term obsolescence mitigation.
Supply support for XC3S250E-4VQG100C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains the Spartan FPGA product line for cost-sensitive, high-volume embedded applications.
The Spartan-3E family was designed for non-volatile, low-gate-count logic replacement in industrial control, test equipment, and consumer electronics where ISE toolchain compatibility and mature silicon reliability are critical.
FAQ
What is the maximum operating frequency supported by XC3S250E-4VQG100C?
The XC3S250E-4VQG100C is rated for a maximum internal clock frequency of 250 MHz and a maximum I/O toggle rate of 333 MHz, as defined by its -4 speed grade. These values assume proper PCB layout, decoupling, and timing constraints applied during ISE synthesis and place-and-route. Actual performance depends on design complexity and routing congestion.
Does XC3S250E-4VQG100C support JTAG boundary-scan testing?
Yes, XC3S250E-4VQG100C fully supports IEEE 1149.1 JTAG boundary-scan for production test and in-system programming. Pins TCK, TMS, TDI, and TDO are dedicated for this function and operate independently of configuration mode. The JTAG chain can also be used to configure the device when no external PROM is present.
What configuration methods are supported by XC3S250E-4VQG100C?
XC3S250E-4VQG100C supports master serial (via CCLK/DIN), slave serial, JTAG, and boundary-scan configuration modes. Master serial is most common for standalone operation using an external SPI PROM. JTAG is used for development, debugging, and field updates. Configuration bitstreams are stored in external memory and loaded at power-up.
Can XC3S250E-4VQG100C operate with 3.3 V I/Os while using 1.2 V core voltage?
Yes, XC3S250E-4VQG100C uses dual-supply architecture: 1.2 V for core logic and 3.3 V (or 2.5 V/1.8 V) for I/O banks. Each bank is independently configurable for LVCMOS, LVTTL, or other standards. Proper bank voltage assignment and I/O standard selection in ISE are required to avoid contention or damage.
Is XC3S250E-4VQG100C still in active production?
XC3S250E-4VQG100C is listed as NRND (Not Recommended for New Designs) by AMD/Xilinx, but remains available through authorized distributors and Aetrix Electronics with controlled-lifecycle sourcing. Obsolescence risk is mitigated by long-term inventory commitments and second-source options for legacy program continuity.
XC3S250E-4VQG100C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3E
- Package/Case:
- 100-TQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 612
- Number of Logic Elements/Cells:
- 5508
- Total RAM Bits:
- 221184
- Number of I/O:
- 66
- Number of Gates:
- 250000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 100-VQFP (14x14)
XC3S250E-4VQG100C FAQ
1.How can I place an order for XC3S250E-4VQG100C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S250E-4VQG100C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S250E-4VQG100C reliable?
The price and inventory of XC3S250E-4VQG100C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S250E-4VQG100C is usually 5 days.
3.What payment methods are accepted for XC3S250E-4VQG100C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S250E-4VQG100C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S250E-4VQG100C?
XC3S250E-4VQG100C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S250E-4VQG100C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S250E-4VQG100C?
For technical support, including XC3S250E-4VQG100C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S250E-4VQG100C requirements.
6.How does Aetrix verify that XC3S250E-4VQG100C is sourced from the original manufacturer or authorized distributors?
All XC3S250E-4VQG100C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S250E-4VQG100C meets industry standards.
7.What is the process for return or replacement of XC3S250E-4VQG100C?
All XC3S250E-4VQG100C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S250E-4VQG100C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S250E-4VQG100C part is unused and in its original packaging.
Return procedure for XC3S250E-4VQG100C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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