AMD XC3S250E-5FTG256C

Overview

XC3S250E-5FTG256C from AMD (formerly Xilinx) is a Spartan-3E FPGA with 250K system gates, 576 distributed RAM bits, 22 dedicated multipliers, and 256-pin Fine-Pitch Thin Quad Flatpack (FTBGA) package. It operates at -5 speed grade (4 ns CLB delay), supports 3.3V/2.5V/1.2V I/Os, and targets low-cost embedded control and interface bridging applications.

For engineers reviewing the XC3S250E-5FTG256C datasheet, pinout, applications, or equivalent options, key selection criteria include logic capacity, I/O voltage flexibility, embedded multiplier count, and FTBGA256 thermal/mechanical compatibility in space-constrained industrial controllers.

Technical Context

The XC3S250E-5FTG256C implements a configurable logic block (CLB) architecture with four 3-input LUTs and eight flip-flops per CLB, supporting synchronous logic and registered outputs. It integrates SelectIO technology enabling single-ended standards (LVTTL, LVCMOS) and differential standards (LVDS, RSDS) across its 180 user I/O pins.

Configuration is performed via Master Serial mode using external PROM or JTAG boundary-scan, with full IEEE 1149.1 compliance. The device includes internal global clock networks with eight dedicated clock routing resources and DLL-based clock management for input deskew and phase alignment.

Key Specifications

Pinout & Package

XC3S250E-5FTG256C uses a 256-ball Fine-Pitch Thin Ball Grid Array (FTBGA) package with 1.0 mm ball pitch, 17 mm × 17 mm body size, and standard JEDEC MO-251AC footprint. Thermal performance supports industrial temperature range operation (0°C to 85°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC3S250E-5FTG256C, XC3S500E-5FTG256C offers double logic capacity in identical footprint and timing, while XC6SLX16-2CSG324C delivers architectural improvements including hardened I/O features and better power efficiency-but requires PCB redesign due to different package and pinout.

Availability

XC3S250E-5FTG256C is available at Aetrix Electronics and suitable for industrial automation, automotive diagnostics, and medical imaging equipment requiring stable component supply and long-term obsolescence planning.

Supply support for XC3S250E-5FTG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, MPSoCs, and ACAPs for data center, AI, and embedded markets.

The Spartan-3E family was designed by Xilinx as a cost-optimized FPGA platform targeting high-volume industrial, consumer, and automotive applications where logic density, I/O flexibility, and power efficiency were prioritized over advanced features like hard IP cores.

FAQ

What is the maximum operating frequency supported by XC3S250E-5FTG256C?

The XC3S250E-5FTG256C has a -5 speed grade specifying a 4 ns CLB propagation delay, enabling reliable operation at system clock frequencies up to 250 MHz for well-constrained critical paths. Actual achievable frequency depends on design topology, routing congestion, and I/O standard selection, but timing analysis tools confirm this limit for synchronous logic within the device's internal fabric.

Does XC3S250E-5FTG256C support JTAG programming and debugging?

Yes, XC3S250E-5FTG256C fully supports IEEE 1149.1 JTAG boundary-scan for in-system programming, configuration verification, and board-level testing. The JTAG TAP controller allows bitstream loading, IDCODE reading, and EXTEST/INTEST operations without requiring external configuration PROM, making it suitable for field-upgradable embedded systems.

Can XC3S250E-5FTG256C interface directly with DDR SDRAM?

XC3S250E-5FTG256C supports SSTL-2 and SSTL-3 I/O standards required for DDR SDRAM interfaces, and its SelectIO technology provides source-synchronous timing control. However, it lacks dedicated DDR controller hard IP; successful DDR interfacing requires careful PCB layout, precise timing constraints, and soft logic implementation of command/address decoding and data capture-verified in Xilinx UG331 for Spartan-3E.

What power supplies are required for XC3S250E-5FTG256C operation?

XC3S250E-5FTG256C requires three independent supply rails: 1.2V for core logic (VCCINT), 2.5V for auxiliary functions and configuration (VCCAUX), and 3.3V (or 2.5V/1.8V) for I/O banks (VCCO). Each rail must meet ripple, sequencing, and decoupling requirements specified in Xilinx DS312 to ensure stable configuration and functional operation across temperature.

Is XC3S250E-5FTG256C still in active production or subject to obsolescence?

XC3S250E-5FTG256C is listed as NRND (Not Recommended for New Designs) by AMD/Xilinx, with last-time-buy availability through authorized distributors. Aetrix Electronics maintains strategic inventory and offers lifecycle management services including cross-reference support and migration guidance to Spartan-6 or Artix-7 families for long-term program continuity.