AMD XC3S250E-5TQG144C

Overview

XC3S250E-5TQG144C from AMD (formerly Xilinx) is a Spartan-3E FPGA with 250,000 system gates, 576 Kbits of block RAM, 22 dedicated multipliers, and operates at -5 speed grade in a 144-pin TQFP package. It targets low-cost embedded control, industrial I/O bridging, and digital logic replacement in space-constrained PCBs.

For engineers reviewing the XC3S250E-5TQG144C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (108 user I/Os), LVCMOS/LVTTL interface support, internal configuration memory, and JTAG boundary-scan compliance for production testability.

Technical Context

The XC3S250E-5TQG144C implements a configurable logic fabric based on 4-input LUTs and flip-flops, with dedicated carry logic for arithmetic. It integrates SelectIO™ technology supporting single-ended standards including LVCMOS 3.3V/2.5V/1.8V and LVTTL, and includes Digital Clock Managers (DCMs) for clock synthesis and phase alignment.

Configuration is performed via master serial mode using an external PROM or through JTAG boundary-scan. The device supports IEEE 1149.1-compliant test access and includes internal startup circuitry with programmable configuration timing.

Key Specifications

Pinout & Package

XC3S250E-5TQG144C is housed in a 144-pin Thin Quad Flat Pack (TQFP) with 0.5 mm pitch, 20 mm × 20 mm body size, and exposed thermal pad. Package meets JEDEC MS-026 standard and supports reflow soldering per IPC/JEDEC J-STD-020.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC3S250E-5TQG144C, the XC3S500E-5TQG144C offers headroom for feature expansion within identical footprint and pinout, while the XC6SLX9-2TQG144C provides architectural upgrades at the cost of design migration effort and toolchain transition.

Availability

XC3S250E-5TQG144C is available at Aetrix Electronics and suitable for industrial control, medical instrumentation, and test equipment requiring stable component supply across extended product lifecycles.

Supply support for XC3S250E-5TQG144C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and maintains the Spartan FPGA portfolio for cost-sensitive, high-volume embedded applications. The company focuses on adaptive computing solutions for data centers, AI, and edge systems.

The Spartan-3E family was designed for mainstream logic replacement and interface bridging in industrial, automotive, and consumer electronics - emphasizing low power, small footprint, and rapid time-to-market.

FAQ

What is the maximum operating frequency of the XC3S250E-5TQG144C?

The XC3S250E-5TQG144C has a -5 speed grade, meaning its guaranteed maximum system clock frequency is 333 MHz for internal logic and 210 MHz for I/O registers under typical conditions. Actual achievable frequency depends on design placement, routing, and temperature. The DCMs support input clocks up to 250 MHz and can generate outputs up to 500 MHz with appropriate constraints applied in Xilinx ISE.

Does the XC3S250E-5TQG144C support configuration via SPI flash memory?

No, the XC3S250E-5TQG144C does not support native SPI flash configuration. It requires master serial mode using Xilinx-compatible PROMs such as XCF02S or XCF04S (parallel NOR flash with specific command set). SPI flash can be interfaced only via user logic implemented in the FPGA fabric, not through dedicated hardware configuration pins.

Can the XC3S250E-5TQG144C operate with a 1.8 V I/O voltage?

Yes, the XC3S250E-5TQG144C supports 1.8 V I/O in Bank 2 and Bank 3 when VCCAUX is supplied at 2.5 V and appropriate IOSTANDARD attributes (e.g., LVCMOS18) are assigned in the UCF file. Each I/O bank is independently configurable for voltage levels ranging from 1.2 V to 3.3 V, subject to VCCAUX and VCCO supply constraints.

Is the XC3S250E-5TQG144C RoHS compliant and lead-free?

Yes, the XC3S250E-5TQG144C is RoHS compliant and manufactured with lead-free (Pb-free) terminations. The "G" in the part number denotes green packaging, and the device meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) requirements. Full compliance documentation is available in AMD's official product change notices.

How many global clock networks does the XC3S250E-5TQG144C provide?

The XC3S250E-5TQG144C provides eight global clock networks (GCLK lines), each driven by dedicated clock buffers and capable of routing to any CLB or I/O. These networks support low-skew distribution of clock, enable, and reset signals across the entire device, enabling synchronous design of large logic blocks without manual routing constraints.