AMD XC3S4000-4FG676C

Overview

XC3S4000-4FG676C from AMD (formerly Xilinx) is a Spartan-3 FPGA with 4,000,000 system gates, 576 I/O pins, and configured in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at -4 speed grade (t_PD = 4.5 ns), supports SelectIO™ standards up to 622 Mbps, and targets high-bandwidth logic control in industrial video processing systems.

For engineers reviewing the XC3S4000-4FG676C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count, speed grade timing closure, LVDS/PCI compatibility, and availability of migration paths within the Spartan-3 family.

Technical Context

The XC3S4000-4FG676C implements configurable logic blocks (CLBs) with dual 4-input LUTs and flip-flops per slice, distributed RAM up to 1,872 kbits, and eighteen 18×18 multipliers. It integrates global clock networks with eight dedicated clock buffers and supports four DLLs for internal clock deskew and phase alignment.

Configuration is performed via Master Serial mode using external PROM or JTAG boundary-scan, with support for bitstream encryption using AES-128. The device complies with IEEE 1149.1 JTAG and uses 1.2 V core voltage with 3.3 V or 2.5 V I/O bank supplies.

Key Specifications

Pinout & Package

XC3S4000-4FG676C is housed in a 676-ball Fine-Pitch BGA (FBGA) package with 1.0 mm ball pitch, 27 × 27 array, and thermal pad on underside for enhanced heat dissipation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic control applications.

Compared with XC3S4000-4FG676C, the XC3S5000-4FG676C offers headroom for feature expansion without board redesign, while the XC3S2500-4FG676C reduces unit cost and power in resource-constrained deployments-both retain identical timing closure methodology and I/O bank configuration.

Availability

XC3S4000-4FG676C is available at Aetrix Electronics and suitable for industrial machine vision, medical imaging interface, and avionics data concentrator applications requiring stable component supply and long-term production continuity.

Supply support for XC3S4000-4FG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and maintains the Spartan-3 product line for legacy industrial and aerospace programs requiring proven reliability and long-lifecycle support.

The Spartan-3 family was designed for cost-sensitive, high-volume applications demanding predictable timing, robust I/O flexibility, and seamless integration with standard microprocessors and memory interfaces.

FAQ

What is the maximum operating frequency of the XC3S4000-4FG676C?

The XC3S4000-4FG676C has a -4 speed grade specifying a maximum input clock frequency of 333 MHz under worst-case conditions. This value is derived from propagation delay (t_PD) of 4.5 ns and applies to synchronous logic paths meeting timing closure requirements. Actual system clock rates depend on design complexity, placement, and routing; the device's four Digital Clock Managers support internal frequency synthesis up to 380 MHz for specific clock domains.

Does the XC3S4000-4FG676C support JTAG programming and debugging?

Yes, the XC3S4000-4FG676C fully supports IEEE 1149.1 JTAG boundary-scan for configuration, debugging, and testing. Dedicated TCK, TMS, TDI, and TDO pins enable in-circuit programming and real-time visibility into internal logic states. JTAG mode can be used for initial configuration or fallback reload, and is required for bitstream encryption key loading during secure configuration workflows involving the XC3S4000-4FG676C.

What I/O standards are supported by the XC3S4000-4FG676C?

The XC3S4000-4FG676C supports SelectIO™ technology with programmable I/O standards including LVCMOS, LVTTL, PCI, LVDS, RSDS, and BLVDS. Each of its 16 I/O banks accepts independent VCCO voltages (1.2 V to 3.3 V), allowing mixed-voltage operation. Differential standards like LVDS operate at up to 622 Mbps per pair, and on-die termination is configurable per pin group-critical for signal integrity in high-speed industrial video and test equipment using the XC3S4000-4FG676C.

Is the XC3S4000-4FG676C still in production or subject to obsolescence?

The XC3S4000-4FG676C is classified as a mature product under AMD's long-term support program for legacy Xilinx devices. While not actively promoted for new designs, it remains available through authorized channels with committed supply for industrial and aerospace customers. Aetrix Electronics maintains active inventory and provides lifecycle coordination-including last-time-buy planning and cross-reference guidance-for programs relying on the XC3S4000-4FG676C.

Can the XC3S4000-4FG676C be configured using SPI flash memory?

No, the XC3S4000-4FG676C does not support native SPI flash configuration. It requires Master Serial mode via dedicated configuration pins (DIN, CCLK, DONE, INIT_B, PROGRAM_B) connected to an external PROM (e.g., XCFxxP series) or microcontroller. Configuration bitstreams must be loaded in serial format; SPI interface capability is absent in the XC3S4000-4FG676C architecture. Alternative methods include JTAG or slave-parallel modes using external controllers.