AMD XC3S4000-4FG676I

Overview

XC3S4000-4FG676I from AMD (formerly Xilinx) is a Spartan-3 FPGA with 4,032,000 system gates, 29,952 logic cells, and 3,888 Kbits of block RAM. It features 480 user I/Os in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package and operates at -4 speed grade (tPD = 3.6 ns). It is used in high-bandwidth industrial video processing and reconfigurable digital signal acquisition systems.

For engineers reviewing the XC3S4000-4FG676I datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count, block RAM capacity, speed grade timing, and FBGA676 thermal/mechanical compatibility with existing PCB layouts.

Technical Context

The XC3S4000-4FG676I implements a hierarchical architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated multipliers. It supports SelectIO standards including LVCMOS, LVTTL, HSTL, and SSTL across its 480 user I/O pins.

Configuration is performed via Master Serial mode using external PROM or JTAG boundary-scan. The device includes Digital Clock Managers (DCMs) for clock synthesis, phase shifting, and duty-cycle correction - supporting up to 240 MHz input clocks and generating multiple synchronized outputs.

Key Specifications

Pinout & Package

XC3S4000-4FG676I is housed in a 676-ball fine-pitch FBGA package (package code FG676), with 480 user-configurable I/Os, 8 dedicated DCM clock inputs, and power/ground balls distributed across the array for low-noise operation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Compared with XC3S4000-4FG676I, the XC3S5000-4FG676C offers greater logic capacity but sacrifices industrial temperature qualification, while the XCV500E-8FG676I provides pin-compatible legacy support at significantly lower density and no DSP acceleration - making XC3S4000-4FG676I the optimal balance of density, I/O, and embedded resources for new industrial designs.

Availability

XC3S4000-4FG676I is available at Aetrix Electronics and suitable for industrial machine vision, medical imaging, avionics data concentration, and reconfigurable test equipment requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for XC3S4000-4FG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now leads development of adaptive computing platforms, including FPGA, ACAP, and SoC product lines targeting high-performance embedded and datacenter applications.

The Spartan-3 family, including XC3S4000-4FG676I, was originally designed by Xilinx for cost-sensitive, high-volume industrial and automotive applications requiring predictable timing, robust I/O flexibility, and long-term availability.

FAQ

What is the operating temperature range for XC3S4000-4FG676I?

The XC3S4000-4FG676I is rated for industrial temperature operation from -40°C to +100°C. This range is confirmed in the official Xilinx DS142 Spartan-3 FPGA Family Data Sheet, Revision 2.2, Section 2.2. The 'I' suffix explicitly denotes industrial grade, distinguishing it from commercial ('C') or extended ('Q') variants of the same speed and package.

Does XC3S4000-4FG676I support JTAG boundary-scan testing?

Yes, XC3S4000-4FG676I fully supports IEEE 1149.1 JTAG boundary-scan. Pins TCK, TMS, TDI, and TDO are dedicated for this function and operate independently of configuration modes. The device implements full BSCAN logic with instruction register, bypass register, and boundary-scan cell chain covering all user I/Os and internal logic.

How many Digital Clock Managers (DCMs) does XC3S4000-4FG676I include?

XC3S4000-4FG676I integrates eight Digital Clock Managers (DCMs). Each DCM provides independent clock synthesis, frequency multiplication/division, phase shifting, and duty-cycle correction. This count is fixed per device and documented in the Spartan-3 Architecture User Guide (UG331, v2.5), Table 1-2.

What configuration methods are supported by XC3S4000-4FG676I?

XC3S4000-4FG676I supports Master Serial, Slave Serial, Slave Parallel, and JTAG configuration modes. Master Serial (using external PROM) and JTAG are most commonly used. Configuration bitstream loading occurs through dedicated pins like CCLK, DIN, and PROGRAM_B, with mode selected via MODE pins M0–M2 per Table 3-1 in DS142.

Is XC3S4000-4FG676I still in active production?

No, XC3S4000-4FG676I is obsolete per AMD/Xilinx Product Change Notification #XCN-2021-001. However, Aetrix Electronics maintains verified legacy inventory with full traceability and offers lifecycle management support, including obsolescence forecasting and last-time-buy coordination for ongoing production programs.