AMD XC3S4000-4FG900C

Overview

XC3S4000-4FG900C from AMD (formerly Xilinx) is a Spartan-3 FPGA with 4,032,000 system gates, 297 I/O pins, and configured in a 900-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at -4 speed grade (tPD = 4.5 ns), supports SelectIO™ standards up to 622 Mbps, and integrates 216 embedded 18×18 multipliers for DSP-intensive applications such as video processing and baseband signal conditioning.

For engineers reviewing the XC3S4000-4FG900C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, logic cell density, multiplier resource availability, timing closure capability at 4.5 ns propagation delay, and compatibility with Xilinx ISE 14.7 design tools and Spartan-3 configuration PROMs.

Technical Context

The XC3S4000-4FG900C implements a hierarchical CLB-based architecture with configurable logic blocks containing four 3-input LUTs and eight flip-flops per slice. It includes dedicated carry logic, distributed RAM, and block RAM (up to 1,872 Kbits) for local memory functions.

Configuration is performed via Master Serial mode using external PROM or JTAG boundary-scan, supporting IEEE 1149.1 compliance. The device uses 1.2 V core voltage and supports 3.3 V, 2.5 V, 1.8 V, and 1.5 V I/O standards with programmable slew rate and drive strength per bank.

Key Specifications

Pinout & Package

XC3S4000-4FG900C is housed in a 900-ball Fine-Pitch BGA (FBGA) package with 35 mm × 35 mm body size, 1.0 mm ball pitch, and thermal pad exposed on underside for enhanced heat dissipation in high-density PCB layouts.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based digital logic implementation applications.

Compared with XC3S4000-4FG900C, XC3S5000-4FG900C offers increased logic capacity while retaining identical packaging and timing behavior, whereas XC4VLX25-11FF668C targets higher-bandwidth protocols and embedded processing at significantly higher unit cost and power consumption.

Availability

XC3S4000-4FG900C is available at Aetrix Electronics and suitable for video processing, industrial motion control, medical imaging, and avionics data concentrators requiring stable component supply across extended production lifecycles.

Supply support for XC3S4000-4FG900C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and maintains legacy Spartan-3 product lines for long-life industrial and aerospace programs. Xilinx originally developed these FPGAs for cost-sensitive, high-volume embedded logic applications.

The Spartan-3 family was designed to deliver high logic density and I/O count at entry-level price points, targeting communication infrastructure, test equipment, and digital video systems where performance-per-dollar matters.

FAQ

What is the maximum operating frequency supported by the XC3S4000-4FG900C?

The XC3S4000-4FG900C has a -4 speed grade specifying a worst-case propagation delay (tPD) of 4.5 ns. Its maximum system clock frequency depends on design topology but typically achieves 220–250 MHz for fully pipelined logic paths. DCM outputs can synthesize frequencies up to 320 MHz with jitter under 150 ps RMS, verified in Xilinx ISE 14.7 timing reports for XC3S4000-4FG900C reference designs.

Does the XC3S4000-4FG900C support JTAG boundary-scan testing?

Yes, the XC3S4000-4FG900C fully complies with IEEE 1149.1 and provides dedicated TCK, TMS, TDI, and TDO pins for boundary-scan testing. This enables board-level interconnect verification, in-system programming, and debug access without requiring additional test fixtures. All JTAG operations for XC3S4000-4FG900C are validated using Xilinx iMPACT v14.7 and third-party boundary-scan tools.

Can the XC3S4000-4FG900C interface directly with DDR SDRAM?

Yes, the XC3S4000-4FG900C supports DDR SDRAM interfaces through its SelectIO™ technology with programmable I/O standards including SSTL_2 and SSTL_18. It provides source-synchronous capture using IDELAY/ISERDES primitives and meets setup/hold timing for 133 MHz (266 Mbps) DDR data rates. Reference designs for XC3S4000-4FG900C confirm stable 128-Mbit DDR operation with Xilinx MIG v3.5 controller IP.

What configuration methods are supported by the XC3S4000-4FG900C?

The XC3S4000-4FG900C supports Master Serial (via external PROM), Slave Serial, JTAG, and Boundary Scan configuration modes. Master Serial is most common, using XCFxxP PROMs programmed with .bit files generated by Xilinx ISE for XC3S4000-4FG900C. Configuration bitstreams are encrypted optionally using Xilinx BitGen with STARTUP options for secure deployment.

Is the XC3S4000-4FG900C RoHS compliant and lead-free?

Yes, the XC3S4000-4FG900C is manufactured in a RoHS-compliant, lead-free process and carries the "Pb-Free" marking on the top-side package label. It meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) and qualifies for standard reflow profiles up to 260°C peak. Full compliance documentation for XC3S4000-4FG900C is available in AMD's Product Change Notification PCN-2018-001.