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AMD XC3S4000-4FG900I
- Part No.:
- XC3S4000-4FG900I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA
- Datasheet:
-
XC3S4000-4FG900I.pdf
- Description:
- IC FPGA 633 I/O 900FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,381
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Product details
Overview
XC3S4000-4FG900I from AMD (formerly Xilinx) is a Spartan-3 FPGA with 4,000,000 system gates, 29,952 logic cells, and 3,888 Kbits of block RAM. It features 633 user I/Os, operates at -4 speed grade (tPD = 4.5 ns), and uses a 900-pin Fine-Pitch Ball Grid Array (FBGA) package. It is deployed in high-bandwidth industrial imaging systems requiring deterministic timing and parallel data path handling.
For engineers reviewing the XC3S4000-4FG900I datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count, speed grade timing closure, block RAM depth, and FBGA thermal/mechanical compatibility with existing PCB layouts.
Technical Context
The XC3S4000-4FG900I implements a hierarchical architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated multipliers. It supports SelectIO™ standards including LVCMOS, LVTTL, HSTL, and SSTL up to 333 Mbps per pin.
Configuration is performed via Master Serial mode using an external PROM or through JTAG boundary-scan. The device includes Digital Clock Managers (DCMs) providing phase-matched clock synthesis, duty-cycle correction, and frequency multiplication/division with ±100 ppm jitter tolerance.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 29,952 - determines maximum combinational/sequential logic capacity for RTL implementation |
| System Gates | 4,000,000 - industry-standard metric for relative logic density vs. ASIC equivalents |
| Block RAM | 3,888 Kbits - enables on-chip FIFOs, buffers, and lookup tables without external memory |
| User I/O Pins | 633 - supports wide parallel interfaces such as camera sensor buses or backplane links |
| Speed Grade | -4 - guarantees worst-case propagation delay ≤4.5 ns for critical path timing closure |
| Package | 900-pin FBGA (Fine-Pitch BGA) - 35 mm × 35 mm body, 1.0 mm ball pitch, RoHS-compliant |
| DCM Units | 8 - provides independent clock domain management for multi-clock system designs |
Pinout & Package
XC3S4000-4FG900I is housed in a 900-ball fine-pitch FBGA (package code FG900) with 35 mm × 35 mm footprint and 1.0 mm ball pitch. Thermal pad is exposed on underside for enhanced heat dissipation in high-utilization configurations.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.2 V core supply input - must be locally decoupled with low-ESR ceramic capacitors |
| A2 | VCCAUX | 2.5 V auxiliary supply for configuration I/O and DCM circuitry |
| P3 | PROGRAM_B | Active-low asynchronous reset - initiates reconfiguration when pulsed low |
| R2 | INIT_B | Open-drain status output - indicates configuration completion or error condition |
| T1 | DONE | Open-drain configuration status - driven high upon successful bitstream load |
| Y1–Y10 | I/O_0–I/O_9 | Configurable bidirectional I/O banks - support voltage-referenced standards per bank |
Key Features
| Feature | Design Value |
|---|---|
| Eight Digital Clock Managers (DCMs) | Enable precise clock synthesis, skew elimination, and dynamic phase alignment across multiple domains |
| SelectIO™ Technology | Supports mixed-voltage I/O banks with programmable drive strength and slew rate control per pin |
| Embedded Multipliers | 128 18×18-bit signed/unsigned multipliers - accelerate DSP filtering and math-intensive algorithms |
| Configurable Logic Blocks (CLBs) | Each CLB contains four 3-input LUTs and eight flip-flops - optimized for high-speed synchronous logic |
| Boundary-Scan JTAG Support | IEEE 1149.1-compliant test access port - enables in-system programming and board-level diagnostics |
Applications
| Industrial Machine Vision | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time pixel preprocessing and ROI extraction from high-frame-rate CMOS sensors. IC Role / Device Role / Timing Role: FPGA fabric performs parallel pixel pipeline processing with sub-microsecond latency. Use Value: 633 I/Os enable direct connection to multi-channel image sensors; block RAM stores line buffers for 2D convolution kernels. | Use Scenario: DICOM-compliant video stream encoding and hardware-accelerated noise reduction in ultrasound systems. IC Role / Device Role / Timing Role: Configurable logic implements custom compression engines synchronized to analog front-end sampling clocks. Use Value: Eight DCMs lock to multiple ADC/DAC reference frequencies while maintaining phase coherence across signal paths. |
| Avionics Data Concentrators | Test & Measurement Pattern Generators |
Use Scenario: Aggregation and protocol translation between ARINC 429, MIL-STD-1553, and Ethernet avionics buses. IC Role / Device Role / Timing Role: FPGA serves as deterministic real-time bridge with guaranteed interrupt response under 200 ns. Use Value: -4 speed grade ensures timing closure for 1553 bus arbitration logic operating at 1 MHz with 50 ns setup margin. | Use Scenario: High-fidelity digital stimulus generation for semiconductor ATE with >200 MHz pattern rates. IC Role / Device Role / Timing Role: On-chip RAM and fast CLBs generate synchronized multi-channel waveforms with <10 ps skew. Use Value: 4M-gate density accommodates complex state machines and deep pattern memory without external SRAM. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S5000-4FG900I | 5M system gates, 33,280 logic cells, +8% logic density and +10% block RAM vs. XC3S4000-4FG900I | Suitable for designs requiring additional pipeline stages or larger on-chip buffers | Select when RTL utilization exceeds 90% on XC3S4000-4FG900I with no layout change needed |
| XC4VLX25-11FF668C | Virtex-4 architecture, 25K logic cells, 1.2V core, 668-pin FF package - higher performance but different pinout and power delivery | Better suited for PCIe endpoint or high-speed serial interface integration | Choose only if migrating to serial transceivers or embedded PowerPC processor subsystem is required |
Compared with XC3S4000-4FG900I, the XC3S5000-4FG900I offers incremental gate scaling within identical packaging and toolchain, whereas the XC4VLX25-11FF668C introduces architectural discontinuity-requiring full RTL rewrite, new power sequencing, and PCB redesign-despite higher peak performance.
Availability
XC3S4000-4FG900I is available at Aetrix Electronics and suitable for industrial imaging, avionics data concentrators, and medical diagnostic equipment requiring stable component supply over extended production lifecycles.
Supply support for XC3S4000-4FG900I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now oversees the legacy Spartan and Virtex FPGA product lines. Xilinx pioneered programmable logic architecture and introduced the first commercial FPGA in 1985.
The Spartan-3 family, including XC3S4000-4FG900I, was engineered for cost-sensitive, high-volume applications demanding predictable timing, robust I/O flexibility, and long-term industrial availability.
FAQ
What is the maximum operating frequency supported by the XC3S4000-4FG900I?
The XC3S4000-4FG900I has a -4 speed grade, guaranteeing a maximum internal clock frequency of 250 MHz for fully registered paths under worst-case conditions. DCM outputs can synthesize clocks up to 320 MHz with jitter specifications defined in DS099. Actual achievable frequency depends on design placement, routing, and I/O standard selection.
Does the XC3S4000-4FG900I support JTAG boundary-scan testing?
Yes, the XC3S4000-4FG900I fully complies with IEEE 1149.1 and supports TAP-controlled INTEST and EXTEST instructions. JTAG pins (TCK, TMS, TDI, TDO) are dedicated and electrically isolated during configuration. This enables board-level fault isolation and in-system programming without requiring external configuration PROMs.
What power supplies are required for the XC3S4000-4FG900I?
The XC3S4000-4FG900I requires three independent supplies: 1.2 V for core logic (VCCINT), 2.5 V for auxiliary circuits and configuration I/O (VCCAUX), and 3.3 V for bank-specific I/O (VCCO). Each supply must meet ripple, sequencing, and decoupling requirements specified in Xilinx UG331 to ensure reliable configuration and operation.
Can the XC3S4000-4FG900I be reconfigured in-system?
Yes, the XC3S4000-4FG900I supports multiple in-system configuration modes including Master Serial (via SPI PROM), Slave SelectMAP, and JTAG. PROGRAM_B and INIT_B signals allow controlled reconfiguration without power cycling. Partial reconfiguration is not supported - full bitstream reload is required for any logic change.
Is the XC3S4000-4FG900I RoHS compliant?
Yes, the XC3S4000-4FG900I is manufactured in accordance with EU RoHS Directive 2011/65/EU and is lead-free. The FG900 package uses matte tin finish on solder balls and complies with JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) handling requirements.
XC3S4000-4FG900I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3
- Package/Case:
- 900-BBGA
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 6912
- Number of Logic Elements/Cells:
- 62208
- Total RAM Bits:
- 1769472
- Number of I/O:
- 633
- Number of Gates:
- 4000000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FBGA (31x31)
XC3S4000-4FG900I FAQ
1.How can I place an order for XC3S4000-4FG900I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S4000-4FG900I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S4000-4FG900I reliable?
The price and inventory of XC3S4000-4FG900I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S4000-4FG900I is usually 5 days.
3.What payment methods are accepted for XC3S4000-4FG900I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S4000-4FG900I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S4000-4FG900I?
XC3S4000-4FG900I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S4000-4FG900I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S4000-4FG900I?
For technical support, including XC3S4000-4FG900I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S4000-4FG900I requirements.
6.How does Aetrix verify that XC3S4000-4FG900I is sourced from the original manufacturer or authorized distributors?
All XC3S4000-4FG900I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S4000-4FG900I meets industry standards.
7.What is the process for return or replacement of XC3S4000-4FG900I?
All XC3S4000-4FG900I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S4000-4FG900I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S4000-4FG900I part is unused and in its original packaging.
Return procedure for XC3S4000-4FG900I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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