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AMD XC3S4000-4FGG676C
- Part No.:
- XC3S4000-4FGG676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC3S4000-4FGG676C.pdf
- Description:
- IC FPGA 489 I/O 676FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,693
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Product details
Overview
XC3S4000-4FGG676C from AMD (formerly Xilinx) is a Spartan-3 FPGA with 4,032,000 system gates, 29,952 logic cells, and 284 user I/Os in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at -4 speed grade (tPD = 3.5 ns), supports SelectIO™ standards up to 622 Mbps, and targets high-bandwidth data acquisition and industrial control systems.
For engineers reviewing the XC3S4000-4FGG676C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, logic cell density, speed grade timing, differential signaling support (LVDS, RSDS), and embedded block RAM capacity for real-time buffering.
Technical Context
The XC3S4000-4FGG676C implements a hierarchical architecture with configurable logic blocks (CLBs), distributed RAM, and eighteen 18×18 multipliers. It integrates eight Digital Clock Managers (DCMs) supporting phase shifting, frequency synthesis, and duty cycle correction across multiple clock domains.
Configuration is performed via Master Serial mode using external PROM or through JTAG boundary-scan. The device supports IEEE 1149.1 compliance and includes internal configuration monitoring with CRC error detection for bitstream integrity verification.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 29,952 - determines maximum combinational/sequential logic capacity for custom digital functions |
| System Gates | 4,032,000 - indicates relative ASIC-equivalent gate count for architectural sizing |
| User I/O Pins | 284 - supports high-pin-count interface bridging (e.g., parallel bus, camera sensor, ADC/DAC) |
| Block RAM | 1,824 kbits - enables on-chip FIFOs, frame buffers, or lookup tables without external memory |
| Speed Grade | -4 (tPD = 3.5 ns) - guarantees worst-case propagation delay for synchronous logic paths |
| DCMs | 8 - provides independent clock domain management including jitter reduction and dynamic phase alignment |
| SelectIO Standards | LVCMOS, LVTTL, LVDS, RSDS, HSTL - enables direct interfacing with diverse peripheral voltage and signaling families |
Pinout & Package
XC3S4000-4FGG676C is housed in a 676-ball fine-pitch BGA (FGG) package with 1.0 mm ball pitch, 27 mm × 27 mm body size, and thermal pad for enhanced power dissipation. Pin assignment follows Xilinx Spartan-3 pinout conventions with dedicated configuration, clock, and I/O banks.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives serial configuration clock during Master Serial mode; must be driven by external source or DCM output |
| DIN | Configuration Data Input | Receives bitstream serially during configuration; tied to PROM or microcontroller GPIO |
| PROGRAM_B | Active-Low Configuration Initiate | Resets configuration logic and clears internal SRAM; asynchronous reset signal |
| INIT_B | Configuration Status Output | Open-drain active-low signal indicating readiness for configuration or error condition |
| Done | Configuration Completion Indicator | High-Z open-drain output pulled high when configuration completes successfully |
| IO_LxxN/IO_LxxP | Differential I/O Pair | Supports LVDS, RSDS, or differential termination; requires matched trace lengths and controlled impedance |
Key Features
| Feature | Design Value |
|---|---|
| Eight Digital Clock Managers (DCMs) | Enable precise clock synthesis, phase alignment, and jitter filtering across multiple independent domains |
| 18×18 Multipliers | Accelerate arithmetic-intensive tasks such as FIR filtering, FFT computation, and motor control algorithms |
| Embedded Block RAM | 1,824 kbits distributed across 96 blocks-supports dual-port access for simultaneous read/write in buffering applications |
| SelectIO Technology | Single-ended and differential I/O support up to 622 Mbps per pin pair without external termination components |
| IEEE 1149.1 JTAG Boundary Scan | Enables in-system test, debug, and programming without requiring physical probe access to all pins |
Applications
| Industrial Motion Control | Medical Imaging Interface |
|---|---|
Use Scenario: Real-time servo loop execution with synchronized encoder feedback and PWM output generation. IC Role / Device Role / Timing Role: FPGA fabric implements closed-loop PID controller, encoder counter, and high-resolution PWM generator with deterministic timing. Use Value: 29,952 logic cells and 8 DCMs enable concurrent multi-axis control with sub-microsecond jitter on critical timing paths. | Use Scenario: High-speed parallel data capture from CMOS image sensors in ultrasound or digital radiography systems. IC Role / Device Role / Timing Role: Configurable I/O bank interfaces directly to sensor parallel output; block RAM buffers frames before compression or transfer. Use Value: 284 user I/Os and 1,824 kbits of embedded RAM eliminate need for external FIFOs or SDRAM controllers. |
| Test & Measurement Equipment | Avionics Data Acquisition |
Use Scenario: Multi-channel digital pattern generation and acquisition with precise inter-channel skew control. IC Role / Device Role / Timing Role: FPGA configures as programmable logic analyzer core with deep trigger memory and real-time protocol decoding. Use Value: LVDS-capable I/Os and -4 speed grade ensure <100 ps channel-to-channel skew for 100+ MHz parallel bus capture. | Use Scenario: ARINC 429 and MIL-STD-1553B bus interface consolidation in flight control subsystems. IC Role / Device Role / Timing Role: Implements dual-bus transceivers, message scheduling, and error-checking logic in single device. Use Value: SelectIO flexibility allows mixed-voltage I/O banks to meet both 1553B (±15 V) and ARINC (10 V p-p) electrical requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S5000-4FGG900C | Higher logic density (33,072 CLBs), 900-ball FBGA, +32% I/O count (372), larger footprint and power envelope | Better suited for designs requiring >30K logic cells or >350 I/Os; not drop-in compatible due to package and pinout differences | Select when scaling logic complexity beyond XC3S4000-4FGG676C capacity while retaining Spartan-3 architecture and toolchain compatibility |
| XC4VLX25-10FF668C | Virtex-4 family; 25K logic cells but superior performance (10 speed grade), 64-bit DDR2 controller, RocketIO GTP transceivers | Targets high-speed serial protocols (PCIe, Gigabit Ethernet); higher cost, power, and design complexity than Spartan-3 | Choose for new designs needing serial connectivity or advanced memory interfaces where Spartan-3 lacks native support |
Compared with XC3S4000-4FGG676C, XC3S5000-4FGG900C offers scalable logic density within the same architecture, while XC4VLX25-10FF668C introduces transceivers and hardened memory controllers-neither is pin-compatible, but both maintain Xilinx ISE toolchain support for migration paths.
Availability
XC3S4000-4FGG676C is available at Aetrix Electronics and suitable for industrial automation, medical imaging, and test equipment requiring stable component supply throughout long-life production cycles.
Supply support for XC3S4000-4FGG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software-defined hardware solutions.
The Spartan-3 family was designed for cost-sensitive, high-volume applications demanding predictable performance, low power, and broad I/O flexibility-particularly in industrial and instrumentation markets.
FAQ
What is the maximum operating frequency supported by XC3S4000-4FGG676C?
The XC3S4000-4FGG676C has a -4 speed grade, specifying a worst-case propagation delay (tPD) of 3.5 ns. This enables reliable synchronous operation up to 280 MHz for register-to-register paths under typical conditions. Actual achievable frequency depends on design routing, resource utilization, and temperature/voltage margins.
Does XC3S4000-4FGG676C support JTAG programming and debugging?
Yes, XC3S4000-4FGG676C fully supports IEEE 1149.1 JTAG boundary-scan for programming, configuration verification, and in-circuit debugging. The JTAG interface uses TCK, TMS, TDI, TDO, and TROUT pins and is accessible regardless of configuration mode, enabling post-production test and field updates.
How much embedded memory does XC3S4000-4FGG676C provide?
XC3S4000-4FGG676C contains 1,824 kbits of total block RAM, organized into 96 blocks of 18 kbits each. Each block supports true dual-port operation with independent read/write addresses, enabling efficient use as FIFOs, frame buffers, or lookup tables without external memory devices.
Can XC3S4000-4FGG676C interface directly with LVDS receivers and drivers?
Yes, XC3S4000-4FGG676C supports LVDS signaling through its SelectIO technology. Differential I/O pairs (IO_LxxN/IO_LxxP) can be configured as LVDS drivers or receivers with internal 100 Ω differential termination, eliminating need for external resistors in point-to-point links up to 622 Mbps.
What configuration methods are supported by XC3S4000-4FGG676C?
XC3S4000-4FGG676C supports Master Serial (via PROM), Slave Serial, Slave Parallel, and JTAG configuration modes. Master Serial is most common for standalone operation, using CCLK and DIN signals; JTAG is used for development, debugging, and in-system programming without requiring external configuration memory.
XC3S4000-4FGG676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 6912
- Number of Logic Elements/Cells:
- 62208
- Total RAM Bits:
- 1769472
- Number of I/O:
- 489
- Number of Gates:
- 4000000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC3S4000-4FGG676C FAQ
1.How can I place an order for XC3S4000-4FGG676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S4000-4FGG676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S4000-4FGG676C reliable?
The price and inventory of XC3S4000-4FGG676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S4000-4FGG676C is usually 5 days.
3.What payment methods are accepted for XC3S4000-4FGG676C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S4000-4FGG676C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S4000-4FGG676C?
XC3S4000-4FGG676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S4000-4FGG676C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S4000-4FGG676C?
For technical support, including XC3S4000-4FGG676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S4000-4FGG676C requirements.
6.How does Aetrix verify that XC3S4000-4FGG676C is sourced from the original manufacturer or authorized distributors?
All XC3S4000-4FGG676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S4000-4FGG676C meets industry standards.
7.What is the process for return or replacement of XC3S4000-4FGG676C?
All XC3S4000-4FGG676C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S4000-4FGG676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S4000-4FGG676C part is unused and in its original packaging.
Return procedure for XC3S4000-4FGG676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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