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Home > Products > Integrated Circuits (ICs) > Embedded > FPGAs (Field Programmable Gate Array)

AMD XC3S4000-4FGG676I

Name: XC3S4000-4FGG676I
Brand: AMD
SKU: XC3S4000-4FGG676I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: XC3S4000-4FGG676I

Manufacturer:: AMD

Category:: FPGAs (Field Programmable Gate Array)

Package:: 676-BGA

Datasheet:: XC3S4000-4FGG676I.pdf

Description:: IC FPGA 489 I/O 676FBGA

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Product details

Overview

XC3S4000-4FGG676I from AMD (formerly Xilinx) is a Spartan-3 FPGA with 4,032,000 system gates, 29,952 logic cells, and 2,128 Kbits of block RAM. It features 502 user I/Os, operates at -4 speed grade (t_PD = 4.5 ns), and is rated for industrial temperature range (-40°C to +100°C). It is used in high-bandwidth digital signal processing and reconfigurable embedded control systems.

For engineers reviewing the XC3S4000-4FGG676I datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count, speed grade timing closure, industrial temperature rating, and compatibility with Xilinx ISE design tools.

Technical Context

The XC3S4000-4FGG676I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated multipliers. It supports SelectIO standards including LVCMOS, LVTTL, SSTL, and HSTL across its 502 user I/O pins.

It integrates global clock networks with eight fully programmable clock buffers and supports DLL-based clock management. Configuration is performed via Master Serial, Slave Serial, or JTAG modes using external PROM or processor-controlled interfaces.

Key Specifications

Parameter	Value and Actual Design Meaning
Logic Cells	29,952 - determines maximum combinational/sequential logic capacity per design
System Gates	4,032,000 - legacy metric estimating equivalent ASIC gate count for logic synthesis
User I/O Pins	502 - supports high-pin-count parallel interfaces and multi-standard I/O banking
Block RAM	2,128 Kbits - enables on-chip data buffering, FIFOs, and lookup table storage
Speed Grade	-4 - guarantees worst-case propagation delay ≤ 4.5 ns for CLB-to-CLB paths
Operating Temp	-40°C to +100°C - qualified for industrial environments without derating
Package	FGG676 - 676-ball Fine-Pitch BGA, 27×27 mm, 1.0 mm ball pitch

Pinout & Package

XC3S4000-4FGG676I is housed in a 676-ball Fine-Pitch Ball Grid Array (FGG676) package with 27×27 array, 1.0 mm ball pitch, and standard thermal pad configuration. Pin functions are organized into 22 I/O banks supporting independent voltage and standard assignment.

Pin/Terminal	Circuit Role	Design Meaning
VCCINT	Core Power Supply	1.2 V supply for internal logic; requires low-noise regulation and local decoupling
VCCO_0	I/O Bank Power	Configurable 1.2–3.3 V supply per bank; sets output voltage level and input threshold
PROGRAM_B	Configuration Init	Active-low asynchronous reset that clears configuration memory and restarts startup sequence
DONE	Configuration Status	Open-drain output indicating successful configuration completion and I/O enable
TCK/TMS/TDI/TDO	JTAG Interface	IEEE 1149.1 boundary-scan interface for programming, debugging, and testing

Key Features

Feature	Design Value
Multi-Standard I/O	Supports LVCMOS, LVTTL, SSTL-2/3, HSTL-I/II across 22 independently powered banks
Dedicated Multipliers	128 18×18-bit two's complement multipliers for DSP-intensive arithmetic pipelines
Global Clock Networks	Eight low-skew global clock lines with programmable dividers and phase alignment
Configuration Security	Bitstream encryption option using AES-128 key stored in on-chip non-volatile memory
Partial Reconfiguration	Enables dynamic module swapping without full device reset or system interruption

Applications

Medical Imaging Backend Processing	Industrial Motion Control Hub
Use Scenario: Real-time pixel stream processing and image reconstruction in CT/MRI subsystems. IC Role / Device Role / Timing Role: Configurable datapath accelerator handling parallel convolution, filtering, and DMA coordination. Use Value: 29,952 logic cells and 2,128 Kbits block RAM enable on-chip frame buffering and pipelined algorithm execution without external memory latency.	Use Scenario: Synchronized multi-axis servo drive coordination in CNC and robotic arms. IC Role / Device Role / Timing Role: Deterministic real-time controller managing PWM generation, encoder feedback decoding, and safety interlock logic. Use Value: -4 speed grade ensures sub-5 ns path timing for closed-loop cycle times under 1 µs, meeting SIL-3 functional safety timing constraints.
Avionics Data Concentrator	Test Equipment Pattern Generator
Use Scenario: ARINC 429 and MIL-STD-1553 bus aggregation in flight control computers. IC Role / Device Role / Timing Role: Protocol-aware bridge with time-stamped packet routing and error detection logic. Use Value: 502 user I/Os allow concurrent interface support for up to 16 ARINC receivers/transmitters and dual 1553 buses with isolated power domains.	Use Scenario: High-speed digital stimulus generation for IC validation and ATE systems. IC Role / Device Role / Timing Role: Programmable pattern sequencer with deterministic jitter-free output timing. Use Value: DLL-based clock management delivers <50 ps peak-to-peak jitter on 100+ MHz outputs, meeting IEEE 1149.6 AC test requirements.

Medical Imaging Backend Processing

Industrial Motion Control Hub

Use Scenario: Real-time pixel stream processing and image reconstruction in CT/MRI subsystems.

IC Role / Device Role / Timing Role: Configurable datapath accelerator handling parallel convolution, filtering, and DMA coordination.

Use Value: 29,952 logic cells and 2,128 Kbits block RAM enable on-chip frame buffering and pipelined algorithm execution without external memory latency.

Use Scenario: Synchronized multi-axis servo drive coordination in CNC and robotic arms.

IC Role / Device Role / Timing Role: Deterministic real-time controller managing PWM generation, encoder feedback decoding, and safety interlock logic.

Use Value: -4 speed grade ensures sub-5 ns path timing for closed-loop cycle times under 1 µs, meeting SIL-3 functional safety timing constraints.

Avionics Data Concentrator

Test Equipment Pattern Generator

Use Scenario: ARINC 429 and MIL-STD-1553 bus aggregation in flight control computers.

IC Role / Device Role / Timing Role: Protocol-aware bridge with time-stamped packet routing and error detection logic.

Use Value: 502 user I/Os allow concurrent interface support for up to 16 ARINC receivers/transmitters and dual 1553 buses with isolated power domains.

Use Scenario: High-speed digital stimulus generation for IC validation and ATE systems.

IC Role / Device Role / Timing Role: Programmable pattern sequencer with deterministic jitter-free output timing.

Use Value: DLL-based clock management delivers <50 ps peak-to-peak jitter on 100+ MHz outputs, meeting IEEE 1149.6 AC test requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
XC3S5000-4FGG900C	Higher logic density (33,072 CLBs), larger 900-ball BGA, commercial temp range only	Suitable for non-industrial designs requiring more resources but no extended temperature operation	Select when additional logic and RAM are needed and thermal environment is controlled
XCV500E-8FGG256I	Virtex-E family, 500K system gates, 256-ball BGA, lower I/O count (176), older architecture	Limited to legacy upgrade paths where footprint and toolchain compatibility outweigh performance needs	Choose only for drop-in replacement in existing Virtex-E designs with unchanged PCB layout

Compared with XC3S4000-4FGG676I, XC3S5000-4FGG900C offers higher capacity but sacrifices industrial temperature rating and increases board area, while XCV500E-8FGG256I provides legacy compatibility at the cost of logic efficiency, I/O scalability, and modern clocking features.

Availability

XC3S4000-4FGG676I is available at Aetrix Electronics and suitable for medical imaging subsystems, industrial motion controllers, avionics data concentrators, and automated test equipment requiring stable component supply over extended production lifecycles.

Supply support for XC3S4000-4FGG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.

The Spartan-3 family was designed by Xilinx to deliver high logic density and I/O flexibility at cost-sensitive price points for industrial, automotive, and communications applications.

FAQ

What is the maximum operating frequency supported by the XC3S4000-4FGG676I?

The XC3S4000-4FGG676I has a -4 speed grade specifying worst-case CLB-to-CLB propagation delay of 4.5 ns, enabling reliable operation up to 222 MHz for register-to-register paths. Actual achievable frequency depends on design placement, routing, and clock network usage - verified through static timing analysis in Xilinx ISE.

Does the XC3S4000-4FGG676I support configuration via JTAG?

Yes, the XC3S4000-4FGG676I supports IEEE 1149.1 JTAG configuration through TCK, TMS, TDI, and TDO pins. This mode allows in-system programming, boundary-scan testing, and debug access without requiring external configuration PROMs or microcontrollers.

What I/O standards are compatible with the XC3S4000-4FGG676I?

The XC3S4000-4FGG676I supports LVCMOS, LVTTL, SSTL-2, SSTL-3, HSTL-I, and HSTL-II across its 22 I/O banks. Each bank can be independently powered from 1.2 V to 3.3 V, allowing mixed-voltage interface coexistence on a single device.

Is the XC3S4000-4FGG676I pin-compatible with other Spartan-3 devices?

No, the XC3S4000-4FGG676I uses the FGG676 package and is not pin-compatible with smaller Spartan-3 variants like XC3S1000 or XC3S2000. Its 676-ball layout and I/O bank arrangement are unique to the 4M-gate and 5M-gate members of the family.

What configuration memory options are available for the XC3S4000-4FGG676I?

The XC3S4000-4FGG676I supports Master Serial (via on-board PROM), Slave Serial (controlled by external processor), and JTAG configuration modes. Common external PROMs include XCF02S, XCF04S, and XCF08P, all programmed with bitstreams generated in Xilinx ISE.

XC3S4000-4FGG676I Specifications

Product attributes: Attribute value

Manufacturer:: AMD

Series:: Spartan®-3

Package/Case:: 676-BGA

Packaging:: Tray

Product Status:: Obsolete

Programmable:: Not Verified

Number of LABs/CLBs:: 6912

Number of Logic Elements/Cells:: 62208

Total RAM Bits:: 1769472

Number of I/O:: 489

Number of Gates:: 4000000

Voltage - Supply:: 1.14V ~ 1.26V

Mounting Type:: Surface Mount

Operating Temperature:: -40°C ~ 100°C (TJ)

Grade:: -

Qualification:: -

Supplier Device Package:: 676-FBGA (27x27)

XC3S4000-4FGG676I FAQ

1.How can I place an order for XC3S4000-4FGG676I through Aetrix?

Please submit a Request for Quotation (RFQ) for XC3S4000-4FGG676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC3S4000-4FGG676I reliable?

The price and inventory of XC3S4000-4FGG676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S4000-4FGG676I is usually 5 days.

3.What payment methods are accepted for XC3S4000-4FGG676I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S4000-4FGG676I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC3S4000-4FGG676I?

XC3S4000-4FGG676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC3S4000-4FGG676I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC3S4000-4FGG676I?

For technical support, including XC3S4000-4FGG676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S4000-4FGG676I requirements.

6.How does Aetrix verify that XC3S4000-4FGG676I is sourced from the original manufacturer or authorized distributors?

All XC3S4000-4FGG676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S4000-4FGG676I meets industry standards.

7.What is the process for return or replacement of XC3S4000-4FGG676I?

All XC3S4000-4FGG676I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S4000-4FGG676I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC3S4000-4FGG676I part is unused and in its original packaging.

Return procedure for XC3S4000-4FGG676I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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