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AMD XC3S4000-4FGG900C
- Part No.:
- XC3S4000-4FGG900C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA
- Datasheet:
-
XC3S4000-4FGG900C.pdf
- Description:
- IC FPGA 633 I/O 900FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,129
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Product details
Overview
XC3S4000-4FGG900C from AMD (formerly Xilinx) is a Spartan-3 FPGA with 4,032,000 system gates, 297 I/O pins, and configured in a 900-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at -4 speed grade (tPD = 4.5 ns), supports SelectIO™ standards up to 622 Mbps, and targets high-bandwidth data acquisition systems requiring deterministic timing and parallel I/O expansion.
For engineers reviewing the XC3S4000-4FGG900C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, logic cell density, LVDS/PCI compatibility, thermal performance in industrial ambient, and legacy configuration interface support (Master Serial, JTAG).
Technical Context
The XC3S4000-4FGG900C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, block RAM (up to 1,728 kbits), and 12 dedicated multipliers (18×18). It supports dual-edge clocking and includes Digital Clock Managers (DCMs) for phase-matched clock synthesis and jitter reduction.
Configuration is performed via Master Serial mode using external PROM or JTAG boundary-scan. The device uses 1.2 V core voltage and supports 3.3 V, 2.5 V, 1.8 V, and 1.5 V I/O standards with programmable drive strength and slew rate control per bank.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 74,880 CLBs with 4 LUTs + 4 FFs each; enables complex state machines and pipelined datapaths |
| System Gates | 4,032,000; defines maximum combinational logic capacity for ASIC replacement |
| I/O Pins | 297 user-configurable; supports mixed-voltage operation across 16 I/O banks |
| Block RAM | 1,728 kbits (192 × 9 kbit blocks); sufficient for frame buffers or FIFOs in video processing |
| DCM Units | 8 Digital Clock Managers; provide zero-delay buffering, frequency synthesis, and phase shifting |
| Speed Grade | -4 (tPD = 4.5 ns); guarantees worst-case propagation delay for synchronous design closure |
Pinout & Package
XC3S4000-4FGG900C is housed in a 900-ball Fine-Pitch BGA (FGG) package with 1.0 mm ball pitch, 31 mm × 31 mm body size, and thermal pad for industrial-grade heat dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.2 V core power supply input; must be decoupled within 10 mm of ball |
| P2 | VCCAUX | 2.5 V auxiliary supply for configuration logic and DCMs |
| A1 | PROGRAM_B | Active-low asynchronous reset for configuration memory and logic initialization |
| R1 | TCK | JTAG test clock input; required for boundary-scan and ISP programming |
| Y2 | INIT_B | Open-drain status output indicating configuration completion or error |
Key Features
| Feature | Design Value |
|---|---|
| SelectIO™ Technology | Supports LVCMOS, LVTTL, PCI, HSTL, SSTL, and LVDS I/O standards with per-bank voltage assignment |
| Digital Clock Manager (DCM) | 8 independent DCMs enable clock multiplication, division, phase shift, and duty-cycle correction without external PLLs |
| Configurable Logic Blocks (CLBs) | Each CLB contains four 4-input LUTs and eight flip-flops, enabling efficient implementation of arithmetic and sequential logic |
| Embedded Multipliers | 12 hardwired 18×18 multipliers accelerate DSP functions like FIR filtering and FFT computation |
Applications
| Industrial Motion Control | Medical Imaging Interface |
|---|---|
Use Scenario: Real-time servo loop coordination across 16-axis CNC controllers with sub-microsecond jitter tolerance. IC Role / Device Role / Timing Role: FPGA fabric executes closed-loop PID algorithms while DCMs generate synchronized PWM and encoder sampling clocks. Use Value: 297 I/O pins allow direct connection to motor drivers, encoders, and safety I/O; -4 speed grade ensures deterministic timing for 100 kHz control cycles. | Use Scenario: High-speed data aggregation from 8-channel ultrasound transducer arrays with time-aligned echo sampling. IC Role / Device Role / Timing Role: XC3S4000-4FGG900C acts as a digital front-end processor, managing LVDS-based ADC interfaces and on-chip beamforming logic. Use Value: Block RAM provides 1.7 Mbits of local buffer for real-time echo data staging before PCIe transfer; SelectIO™ supports 622 Mbps LVDS lanes. |
| Avionics Data Concentrator | Test Equipment Pattern Generator |
Use Scenario: ARINC 429 and MIL-STD-1553 bus bridging in flight control subsystems with DO-254 compliance requirements. IC Role / Device Role / Timing Role: Configurable logic implements protocol engines and time-triggered scheduling; DCMs lock to aircraft master clock reference. Use Value: JTAG boundary-scan enables in-system verification; 1.2 V core reduces power density critical for conduction-cooled modules. | Use Scenario: Programmable stimulus generation for IC validation at 200 MHz vector rates with precise skew control across 128 pins. IC Role / Device Role / Timing Role: XC3S4000-4FGG900C serves as pattern memory controller and timing engine, driving high-speed differential outputs via LVDS I/O banks. Use Value: 74,880 logic cells implement deep pattern sequencers and cycle-accurate timing generators; -4 speed grade meets setup/hold margins at 200 MHz. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic and interface consolidation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S5000-4FGG900C | Higher logic density (8,544,000 gates, 86,400 CLBs) and 2,160 kbits block RAM; same package and pinout | Required for designs exceeding 74K CLB utilization or needing >1.7 Mbits on-chip RAM | Select when XC3S4000-4FGG900C resource usage exceeds 90% in synthesis reports |
| XC4VLX25-11FF668C | Virtex-4 architecture with 25K logic cells, 18-bit embedded multipliers, and 360 kbits block RAM; different 668-pin FCBGA package | Suitable for designs requiring PCI Express endpoints or higher clock frequencies (>500 MHz) | Choose for migration paths requiring serial transceivers or hardened IP cores not available in Spartan-3 |
Compared with XC3S4000-4FGG900C, XC3S5000-4FGG900C offers direct pin-compatible scalability within the same footprint, while XC4VLX25-11FF668C introduces architectural upgrades-including RocketIO transceivers and PowerPC hard cores-at the cost of non-interchangeable packaging and higher power consumption.
Availability
XC3S4000-4FGG900C is available at Aetrix Electronics and suitable for industrial motion control, medical imaging interface, avionics data concentrators, and automated test equipment requiring stable component supply over extended production lifecycles.
Supply support for XC3S4000-4FGG900C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains legacy Spartan-3 product lines for long-lifecycle industrial and aerospace programs.
The Spartan-3 family was designed for cost-sensitive, high-volume applications requiring robust I/O flexibility and deterministic timing-especially where ASIC development cost or lead time is prohibitive.
FAQ
What is the core voltage requirement for XC3S4000-4FGG900C?
The XC3S4000-4FGG900C requires a regulated 1.2 V ±3% core supply (VCCINT) delivered to all G1/G2/H1/H2/J1/J2/K1/K2/L1/L2/M1/M2/N1/N2/P1/P2/R1/R2/T1/T2/U1/U2/V1/V2/W1/W2/Y1/Y2 balls. This rail powers the FPGA fabric and CLBs. Deviation beyond tolerance risks timing violations or configuration loss. XC3S4000-4FGG900C does not support adaptive voltage scaling.
Does XC3S4000-4FGG900C support JTAG boundary-scan for PCB testing?
Yes, XC3S4000-4FGG900C fully complies with IEEE 1149.1 and supports JTAG boundary-scan for interconnect testing and in-system programming. Pins TCK, TMS, TDI, and TDO are assigned to R1, P1, N1, and P2 respectively in the FGG900 package. The JTAG chain can be daisy-chained with other Xilinx devices, and BSDL files are provided by AMD for test vector generation.
Can XC3S4000-4FGG900C be configured using SPI flash memory?
No, XC3S4000-4FGG900C does not support native SPI flash configuration. It requires Master Serial mode with XCFxx Platform Flash PROMs (e.g., XCF04S, XCF08P) or JTAG programming. The configuration interface lacks SPI command decoding logic; using generic SPI flash will result in failed INIT_B assertion and configuration timeout.
What thermal management guidance applies to XC3S4000-4FGG900C in industrial environments?
XC3S4000-4FGG900C has a maximum junction temperature of 100°C and requires a thermal pad under the package center. For continuous operation at 85°C ambient, a 4-layer PCB with ≥2 oz copper, thermal vias under the die area (≥32 vias, 0.3 mm diameter), and 10 cm² heatsink surface is recommended. Thermal resistance θJA is 12.5°C/W in standard JEDEC 2s2p board conditions.
Is XC3S4000-4FGG900C compatible with Vivado Design Suite?
No, XC3S4000-4FGG900C is supported exclusively by Xilinx ISE Design Suite 14.7 and earlier versions. Vivado does not include Spartan-3 device families in its target library. Migration to newer architectures (e.g., Artix-7) is required for Vivado compatibility. AMD continues to host ISE 14.7 downloads for legacy support.
XC3S4000-4FGG900C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3
- Package/Case:
- 900-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 6912
- Number of Logic Elements/Cells:
- 62208
- Total RAM Bits:
- 1769472
- Number of I/O:
- 633
- Number of Gates:
- 4000000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FBGA (31x31)
XC3S4000-4FGG900C FAQ
1.How can I place an order for XC3S4000-4FGG900C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S4000-4FGG900C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S4000-4FGG900C reliable?
The price and inventory of XC3S4000-4FGG900C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S4000-4FGG900C is usually 5 days.
3.What payment methods are accepted for XC3S4000-4FGG900C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S4000-4FGG900C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S4000-4FGG900C?
XC3S4000-4FGG900C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S4000-4FGG900C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S4000-4FGG900C?
For technical support, including XC3S4000-4FGG900C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S4000-4FGG900C requirements.
6.How does Aetrix verify that XC3S4000-4FGG900C is sourced from the original manufacturer or authorized distributors?
All XC3S4000-4FGG900C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S4000-4FGG900C meets industry standards.
7.What is the process for return or replacement of XC3S4000-4FGG900C?
All XC3S4000-4FGG900C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S4000-4FGG900C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S4000-4FGG900C part is unused and in its original packaging.
Return procedure for XC3S4000-4FGG900C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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