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AMD XC3S4000-4FGG900I
- Part No.:
- XC3S4000-4FGG900I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA
- Datasheet:
-
XC3S4000-4FGG900I.pdf
- Description:
- IC FPGA 633 I/O 900FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,051
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Product details
Overview
XC3S4000-4FGG900I from AMD (formerly Xilinx) is a Spartan-3 FPGA with 4,000,000 system gates, 576 I/O pins, and configured in a 900-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at -4 speed grade (tPD = 4.5 ns), supports SelectIO standards up to LVDS and SSTL, and targets high-bandwidth logic-intensive applications such as baseband signal processing in wireless infrastructure.
For engineers reviewing the XC3S4000-4FGG900I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, speed grade timing closure, bank voltage flexibility, embedded RAM block count, and configuration interface compatibility (e.g., Master Serial, JTAG).
Technical Context
The XC3S4000-4FGG900I implements a hierarchical architecture with configurable logic blocks (CLBs), distributed RAM, block RAM (1,728 kbits), and dedicated digital clock managers (DCMs) for phase-matched clock synthesis and jitter reduction. It supports multi-voltage I/O banks (1.2 V to 3.3 V) and includes 8 DCMs for independent clock domain management.
Configuration is performed via Master Serial mode using external PROM or through JTAG boundary-scan. The device uses SRAM-based configuration memory, requiring external nonvolatile storage for power-up initialization, and supports partial reconfiguration in selected design flows.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Capacity | 4,000,000 system gates - determines maximum combinational/sequential logic density for complex state machines or datapaths |
| I/O Pins | 576 user I/Os - enables high-pin-count interfaces such as parallel DDR memory buses or multi-lane data acquisition |
| Block RAM | 1,728 kbits - supports large on-chip FIFOs, coefficient storage, or frame buffers without external memory |
| Speed Grade | -4 (tPD = 4.5 ns) - defines worst-case propagation delay for CLB-to-CLB paths under specified conditions |
| DCMs | 8 Digital Clock Managers - provide frequency synthesis, phase shifting, and duty-cycle correction per clock domain |
| Configuration Mode | Master Serial, JTAG - determines boot method and debug accessibility during development and field updates |
Pinout & Package
XC3S4000-4FGG900I is housed in a 900-ball Fine-Pitch BGA (FBGA) package with 35 × 35 mm body size, 1.0 mm ball pitch, and thermal pad exposed on underside for enhanced heat dissipation in high-utilization designs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration shift register during Master Serial mode; must be driven by external source or DCM output |
| DIN | Configuration Data Input | Serial data input for bitstream loading in Master Serial mode; tied to PROM or microcontroller GPIO |
| PROG_B | Program Initiate | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration sequence |
| INIT_B | Configuration Status Output | Open-drain output indicating configuration memory readiness; pulled high externally during valid operation |
| PROGRAM_B | Configuration Reset | Same function as PROG_B; dual naming reflects legacy pin aliasing in Spartan-3 documentation |
Key Features
| Feature | Design Value |
|---|---|
| Multi-Voltage I/O Banks | Supports mixed-voltage operation across 8 banks (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V) enabling direct interfacing with diverse peripherals |
| Embedded Multipliers | 128 18 × 18-bit signed/unsigned multipliers - accelerate DSP functions like FIR filtering or FFT without external ASIC |
| SelectIO Technology | LVDS, RSDS, BLVDS, SSTL, HSTL, LVTTL support - allows high-speed differential signaling and memory interface compliance |
| Dedicated Clock Routing | Global and regional clock networks with low-skew distribution - ensures timing integrity for multi-domain synchronous systems |
Applications
| Wireless Baseband Processing | Industrial Machine Vision Interface |
|---|---|
Use Scenario: Real-time channel coding, modulation/demodulation, and MIMO signal conditioning in 3G/LTE remote radio units. IC Role / Device Role / Timing Role: Programmable logic fabric executing custom PHY-layer algorithms with deterministic latency and parallel throughput. Use Value: 576 I/Os and LVDS support enable direct connection to multiple ADC/DAC channels and RF front-end ICs without glue logic. | Use Scenario: High-speed image sensor aggregation (e.g., 4× CMOS sensors at 100 MHz pixel clock) and preprocessing before GPU offload. IC Role / Device Role / Timing Role: Synchronization hub and pixel pipeline processor handling timing-critical sensor framing, ROI extraction, and Bayer demosaicing. Use Value: 8 DCMs allow independent pixel clock generation, sensor strobe alignment, and frame buffer refresh timing with sub-nanosecond skew control. |
| Medical Ultrasound Beamforming | Test & Measurement Pattern Generation |
Use Scenario: Digital beamformer controlling hundreds of transducer elements with precise phase-shifted sample delays and dynamic focusing. IC Role / Device Role / Timing Role: Time-critical delay engine implementing programmable tap delays and real-time coefficient updates via PCIe host interface. Use Value: Block RAM capacity (1,728 kbits) stores full delay coefficient tables for all channels, eliminating external SRAM access latency. | Use Scenario: High-fidelity digital stimulus generation for semiconductor ATE, supporting multi-gigabit serial patterns and parallel vector sets. IC Role / Device Role / Timing Role: Deterministic pattern sequencer with jitter-free clock synthesis and synchronized multi-channel output drivers. Use Value: -4 speed grade ensures <4.5 ns path delay for critical setup/hold timing margins in 500+ MHz vector rates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA logic and I/O resource applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S5000-4FGG900I | 5,000,000 system gates, same package and speed grade; higher CLB count and 2,160 kbits block RAM | Required when logic utilization exceeds 90% in XC3S4000-4FGG900I implementations | Select if design requires >4M gate headroom or additional embedded memory without changing PCB layout |
| XC4VLX25-11FF668C | Virtex-4 LX25 in 668-pin FF package; 25K logic cells, 1.5 Mb block RAM, faster speed grade (-11) | Targets higher-performance signal processing with PCI Express endpoint capability and hardened RocketIO transceivers | Choose for designs needing serial transceivers, larger memory, or migration path beyond Spartan-3 architecture |
Compared with XC3S4000-4FGG900I, XC3S5000-4FGG900I offers gate and RAM headroom within identical mechanical and thermal constraints, while XC4VLX25-11FF668C provides transceiver integration and architectural scalability at the cost of higher power and cost.
Availability
XC3S4000-4FGG900I is available at Aetrix Electronics and suitable for wireless infrastructure, medical imaging, industrial automation, and test equipment requiring stable component supply and long-term obsolescence planning.
Supply support for XC3S4000-4FGG900I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for heterogeneous compute acceleration.
The Spartan-3 family was originally designed by Xilinx for cost-sensitive, high-volume applications demanding substantial logic density and I/O flexibility without premium performance or transceiver features.
FAQ
What is the operating temperature range for XC3S4000-4FGG900I?
The XC3S4000-4FGG900I is rated for industrial temperature operation from –40 °C to +100 °C junction temperature. This range supports deployment in base station cabinets, factory-floor controllers, and outdoor test instrumentation where ambient thermal conditions exceed commercial limits. The 'I' suffix in XC3S4000-4FGG900I explicitly denotes industrial-grade thermal qualification per Xilinx specification DS152.
Does XC3S4000-4FGG900I support JTAG boundary-scan for in-system programming?
Yes, XC3S4000-4FGG900I fully supports IEEE 1149.1 JTAG boundary-scan for configuration, debugging, and verification. The TDI, TDO, TMS, and TCK pins are dedicated and electrically compatible with standard JTAG adapters. This enables in-system programming without requiring external PROM, and supports partial reconfiguration and real-time signal probing via ChipScope Pro or Vivado Logic Analyzer equivalents.
How many configuration modes does XC3S4000-4FGG900I support?
XC3S4000-4FGG900I supports five configuration modes: Master Serial, Slave Serial, Slave Parallel, Boundary Scan (JTAG), and Microprocessor Bus. Mode selection is controlled by the MODE pins (M0–M2) at power-up. Master Serial is most common for standalone operation with external PROM, while JTAG is preferred for development and field updates due to its standardized interface and debug visibility.
What is the maximum supported I/O standard voltage for XC3S4000-4FGG900I banks?
XC3S4000-4FGG900I I/O banks support VCCO voltages from 1.2 V to 3.3 V, with individual bank configuration. Each bank's VCCO must match the signaling standard used (e.g., 1.8 V for LVCMOS18, 2.5 V for SSTL2_I). The device does not support 5 V-tolerant inputs in this package variant, and exceeding 3.3 V on any VCCO rail may damage the I/O structure per DS152 Section 5.2.
Is XC3S4000-4FGG900I still in active production?
No, XC3S4000-4FGG900I was discontinued by Xilinx in 2013 and is now classified as obsolete. Aetrix Electronics maintains legacy inventory and provides extended lifecycle sourcing, including traceable batch history, counterfeit mitigation, and last-time-buy coordination. Engineering support includes migration guidance to Spartan-6 or Artix-7 families where applicable.
XC3S4000-4FGG900I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3
- Package/Case:
- 900-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 6912
- Number of Logic Elements/Cells:
- 62208
- Total RAM Bits:
- 1769472
- Number of I/O:
- 633
- Number of Gates:
- 4000000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FBGA (31x31)
XC3S4000-4FGG900I FAQ
1.How can I place an order for XC3S4000-4FGG900I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S4000-4FGG900I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S4000-4FGG900I reliable?
The price and inventory of XC3S4000-4FGG900I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S4000-4FGG900I is usually 5 days.
3.What payment methods are accepted for XC3S4000-4FGG900I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S4000-4FGG900I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S4000-4FGG900I?
XC3S4000-4FGG900I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S4000-4FGG900I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S4000-4FGG900I?
For technical support, including XC3S4000-4FGG900I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S4000-4FGG900I requirements.
6.How does Aetrix verify that XC3S4000-4FGG900I is sourced from the original manufacturer or authorized distributors?
All XC3S4000-4FGG900I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S4000-4FGG900I meets industry standards.
7.What is the process for return or replacement of XC3S4000-4FGG900I?
All XC3S4000-4FGG900I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S4000-4FGG900I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S4000-4FGG900I part is unused and in its original packaging.
Return procedure for XC3S4000-4FGG900I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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