AMD XC3S4000-5FGG676C

Overview

XC3S4000-5FGG676C from AMD (formerly Xilinx) is a Spartan-3 FPGA with 4,000,000 system gates, 576 I/O pins, and configured in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at -5 speed grade (tPD = 4.5 ns), supports SelectIO™ standards up to 622 Mbps, and targets high-bandwidth logic acceleration in telecom line cards.

For engineers reviewing the XC3S4000-5FGG676C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count, speed grade timing closure, LVDS/PCI compatibility, and availability of migration paths within the Spartan-3 family.

Technical Context

The XC3S4000-5FGG676C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, block RAM (up to 1,728 Kbits), and dedicated multipliers (18×18-bit). It integrates Digital Clock Managers (DCMs) for jitter reduction and phase alignment across multiple clock domains.

It supports configuration via Master Serial, Slave Serial, or JTAG modes, and includes internal pull-up resistors on configuration pins. The device uses 1.2 V core voltage and supports 3.3 V, 2.5 V, 1.8 V, and 1.5 V I/O standards with programmable drive strength and slew rate control.

Key Specifications

Pinout & Package

XC3S4000-5FGG676C is housed in a 676-ball Fine-Pitch BGA (FBGA) package with 1.0 mm ball pitch, 27 × 27 array, and thermal pad. Package dimensions are 27 mm × 27 mm × 1.8 mm (height).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic acceleration applications.

Compared with XC3S4000-5FGG676C, XC3S5000-5FGG900C offers higher resource headroom but demands larger board area and thermal management, while XC3S2000-4FGG456C reduces cost and power at the expense of I/O count and maximum operating frequency-selection depends strictly on gate utilization, I/O routing, and timing slack margins.

Availability

XC3S4000-5FGG676C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, medical imaging, and automated test equipment requiring stable component supply and long-term lifecycle support.

Supply support for XC3S4000-5FGG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software-defined hardware solutions.

The Spartan-3 family was designed for cost-sensitive, high-volume applications requiring balanced logic density, I/O flexibility, and low-power operation-targeting communications, industrial control, and video processing.

FAQ

What is the core voltage requirement for XC3S4000-5FGG676C?

The XC3S4000-5FGG676C requires a regulated 1.2 V ±3% core supply (VCCINT) with low-noise decoupling. Deviation beyond this range risks configuration loss or timing violation. The XC3S4000-5FGG676C does not support dynamic voltage scaling; fixed 1.2 V operation is mandatory across all temperature and process corners.

Does XC3S4000-5FGG676C support JTAG boundary scan?

Yes, XC3S4000-5FGG676C fully complies with IEEE 1149.1 JTAG boundary scan. Its TCK, TMS, TDI, and TDO pins enable device identification, interconnect testing, and SRAM configuration verification. The XC3S4000-5FGG676C supports INTEST and EXTEST instructions, and its BSDL file is published by AMD for tool integration.

Can XC3S4000-5FGG676C be configured using SPI flash memory?

Yes, XC3S4000-5FGG676C supports Master Serial configuration mode, enabling direct boot from industry-standard SPI flash devices such as Micron MT25QL or Winbond W25Q series. The XC3S4000-5FGG676C automatically loads bitstream upon power-up when M0–M2 pins are set to 000, eliminating need for external microcontroller bootloading.

What I/O standards are supported by XC3S4000-5FGG676C?

XC3S4000-5FGG676C supports LVCMOS, LVTTL, PCI, SSTL-2, SSTL-3, HSTL-I, HSTL-II, and differential standards including LVDS, RSDS, and BLVDS. Each of its 16 I/O banks is independently configurable for voltage and standard. The XC3S4000-5FGG676C does not support MIPI or sub-1.2 V I/O standards.

Is XC3S4000-5FGG676C still in active production?

XC3S4000-5FGG676C is listed as Not Recommended for New Designs (NRND) by AMD, with last-time-buy (LTB) windows managed through authorized distributors. Aetrix Electronics maintains legacy inventory and provides obsolescence mitigation support, including cross-reference guidance and migration path evaluation for the XC3S4000-5FGG676C.