My Inquiry
My Account
AMD XC3S4000-5FGG900C
- Part No.:
- XC3S4000-5FGG900C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA
- Datasheet:
-
XC3S4000-5FGG900C.pdf
- Description:
- IC FPGA 633 I/O 900FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,982
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC3S4000-5FGG900C from AMD (formerly Xilinx) is a Spartan-3 FPGA with 4,032,000 system gates, 297 I/O pins, and a -5 speed grade operating at 1.2 V core voltage. It integrates 228 dual-port block RAM blocks (18 kbits each), 128 multipliers, and supports LVCMOS/LVTTL/HSTL/SSTL I/O standards for high-speed interface implementation in industrial control systems.
For engineers reviewing the XC3S4000-5FGG900C datasheet, pinout, applications, or equivalent options, key selection criteria include logic capacity, I/O count and voltage compatibility, embedded RAM depth, multiplier count, and thermal performance in reconfigurable digital signal processing designs.
Technical Context
The XC3S4000-5FGG900C implements a fine-grained, SRAM-based configurable logic architecture with dedicated carry chains and shift registers per CLB. Its configuration memory is loaded via Master Serial or JTAG mode using external PROM or processor-controlled initialization.
It supports SelectIO technology with programmable slew rate, drive strength, and on-chip termination for 12–24 mA output drive across multiple I/O banks. Configuration logic includes internal oscillator and fallback mode for single-bit error recovery during bitstream loading.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Capacity | 4,032,000 system gates - determines maximum combinational/sequential logic density for complex state machines or protocol engines |
| I/O Pins | 297 user I/Os - enables direct connection to multiple parallel buses, ADC/DAC interfaces, or FMC-style expansion connectors |
| Block RAM | 228 × 18-kbit dual-port blocks - supports simultaneous read/write for FIFOs, frame buffers, or coefficient storage in DSP pipelines |
| Multipliers | 128 × 18×18-bit signed - accelerates FIR filtering, FFT twiddle factor computation, and motor control vector math |
| Core Voltage | 1.2 V ±3% - defines power delivery network requirements and impacts dynamic power consumption in high-clock-rate operation |
| Speed Grade | -5 - guarantees timing closure up to 333 MHz for critical paths under worst-case industrial temperature conditions |
Pinout & Package
The XC3S4000-5FGG900C is housed in a 900-pin Fine-Pitch Ball Grid Array (FBGA) package with 35 mm × 35 mm body size and 1.0 mm ball pitch. Thermal pad exposed on underside requires solder paste stencil design per IPC-7351B.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply | 1.2 V power rail for CLBs, RAM, and interconnect; requires low-noise decoupling within 10 mm of each pin |
| VCCO_0 | I/O bank supply | Configurable 1.2–3.3 V supply per bank; sets voltage threshold for input receivers and output drivers in Bank 0 |
| PROGRAM_B | Configuration reset | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration sequence |
| DONE | Configuration status | Open-drain output indicating successful bitstream load completion; pulled high externally to enable startup |
| TCK/TMS/TDI/TDO | JTAG interface | IEEE 1149.1-compliant test access port used for boundary-scan, programming, and debug visibility |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated Digital Clock Manager (DCM) | Provides jitter-reduced clock synthesis, phase shifting, and frequency multiplication/division without external PLL components |
| SelectIO Technology | Enables mixed-voltage I/O operation across 8 independent banks, supporting concurrent 1.8 V, 2.5 V, and 3.3 V interfaces |
| Embedded Multipliers | Hardwired 18×18-bit two's complement multipliers reduce LUT usage and improve MAC throughput in filter implementations |
| Block RAM Flexibility | Each 18-kbit block can be configured as 18K×1, 9K×2, 4K×4, 2K×9, 1K×18, or 512×36 - adapts to diverse buffer depth/width requirements |
Applications
| Industrial Motion Control | High-Speed Data Acquisition |
|---|---|
Use Scenario: Real-time closed-loop servo positioning with 10 µs cycle time and synchronized encoder feedback. IC Role / Device Role / Timing Role: FPGA fabric executes PID computation, PWM generation, and encoder interpolation while DCM locks to 100 MHz reference clock. Use Value: 297 I/Os route quadrature signals, analog trigger lines, and isolated digital outputs; 128 multipliers accelerate vector torque calculations. | Use Scenario: Simultaneous sampling of 32-channel 16-bit ADCs at 1 MSPS with real-time spectral analysis. IC Role / Device Role / Timing Role: Configurable logic manages parallel ADC data capture, applies windowing functions, and streams FFT-ready data to DDR2 memory via native interface. Use Value: 228 block RAM blocks store 1024-point FFT buffers and coefficient tables; SelectIO supports LVDS inputs from ADCs and SSTL outputs to memory controller. |
| Avionics Data Concentrator | Programmable Logic Controller (PLC) |
Use Scenario: ARINC 429 bus monitoring and protocol translation between legacy avionics subsystems. IC Role / Device Role / Timing Role: Implements dual ARINC 429 transceivers with Manchester decoding, parity checking, and time-stamped message buffering. Use Value: 4,032,000-gate capacity accommodates redundant protocol stacks and deterministic latency paths; -5 speed grade ensures 333 MHz timing margin for 100 kHz bit rate processing. | Use Scenario: Modular I/O expansion with hot-swap support, safety-rated watchdog, and EtherCAT slave stack execution. IC Role / Device Role / Timing Role: Hosts soft-core microblaze processor, EtherCAT application layer, and cyclic I/O mapping logic with precise 1 ms task scheduling. Use Value: Dual-port RAM enables zero-copy buffer sharing between CPU and peripheral logic; 297 I/Os interface to isolated digital inputs, analog modules, and fieldbus PHYs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV500E-8FG896C | Virtex-E family; 500K gate capacity, 3.3 V core, no embedded multipliers, 128 I/Os | Limited DSP capability and lower I/O count restrict use to simpler glue logic or interface bridging | Choose when legacy Virtex-E toolchain compatibility is required and logic density < 1M gates suffices |
| XC6SLX45-3CSG324C | Spartan-6 family; 43,661 logic cells, 218 I/Os, 1.2 V core, integrated PCIe block, lower static power | Includes hard IP for PCI Express but lacks same block RAM depth and multiplier count for intensive DSP | Prefer for new designs needing PCIe endpoint functionality and reduced thermal footprint over raw gate count |
Compared with XC3S4000-5FGG900C, XCV500E-8FG896C offers older architecture with higher static power and no DSP resources, while XC6SLX45-3CSG324C provides modern process node and hard IP at cost of reduced embedded memory and arithmetic density for compute-heavy tasks.
Availability
XC3S4000-5FGG900C is available at Aetrix Electronics and suitable for industrial motion control, high-speed data acquisition, and avionics data concentrators requiring stable component supply and long-term manufacturing continuity.
Supply support for XC3S4000-5FGG900C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains legacy Spartan-3 product lines for industrial and aerospace customers requiring long-lifecycle support.
The Spartan-3 family was designed for cost-sensitive, high-volume applications demanding predictable timing, robust configuration security, and broad I/O voltage flexibility in harsh environments.
FAQ
What is the configuration method supported by the XC3S4000-5FGG900C?
The XC3S4000-5FGG900C supports Master Serial, Slave Serial, and JTAG configuration modes. Bitstream loading occurs via dedicated configuration pins (INIT_B, PROGRAM_B, DONE) and can be initiated from external PROM, microcontroller, or boundary-scan chain. Internal oscillator provides clock during startup, eliminating need for external configuration clock source in most deployments of XC3S4000-5FGG900C.
Does the XC3S4000-5FGG900C include on-chip memory for program storage?
No, the XC3S4000-5FGG900C does not include non-volatile program memory. It relies on external configuration PROM or processor-controlled loading of its SRAM-based configuration memory. The device retains logic state only while powered; power cycling requires full reconfiguration. This behavior is inherent to all Spartan-3 FPGAs including XC3S4000-5FGG900C.
What I/O standards are supported by the XC3S4000-5FGG900C?
The XC3S4000-5FGG900C supports LVCMOS, LVTTL, HSTL Class I/II, and SSTL2 Class I/II across its eight I/O banks. Each bank operates independently with selectable VCCO voltage (1.2–3.3 V), enabling mixed-voltage interfaces such as 3.3 V control signals alongside 1.8 V memory buses. This I/O flexibility is fully documented in the XC3S4000-5FGG900C datasheet and applies directly to this specific part number.
Can the XC3S4000-5FGG900C operate in extended temperature ranges?
The XC3S4000-5FGG900C is rated for industrial temperature range (–40°C to +85°C ambient). Its thermal design, including thermal pad and recommended PCB copper pour, ensures reliable operation at maximum junction temperature of 100°C. The -5 speed grade guarantees timing closure across this full range, making XC3S4000-5FGG900C suitable for uncontrolled environmental deployments.
Is there a migration path from XC3S4000-5FGG900C to newer AMD/Xilinx families?
Direct pin-compatible migration is not available due to architectural and package differences. However, XC6SLX45-3CSG324C and XC7A35T-2CSG324I offer functional equivalents with updated toolchains and enhanced features. Migration requires RTL and constraints file revision, though Spartan-3 design experience transfers well. AMD provides legacy support documentation for XC3S4000-5FGG900C through its archived Xilinx resources portal.
XC3S4000-5FGG900C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3
- Package/Case:
- 900-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 6912
- Number of Logic Elements/Cells:
- 62208
- Total RAM Bits:
- 1769472
- Number of I/O:
- 633
- Number of Gates:
- 4000000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FBGA (31x31)
XC3S4000-5FGG900C FAQ
1.How can I place an order for XC3S4000-5FGG900C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S4000-5FGG900C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S4000-5FGG900C reliable?
The price and inventory of XC3S4000-5FGG900C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S4000-5FGG900C is usually 5 days.
3.What payment methods are accepted for XC3S4000-5FGG900C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S4000-5FGG900C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S4000-5FGG900C?
XC3S4000-5FGG900C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S4000-5FGG900C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S4000-5FGG900C?
For technical support, including XC3S4000-5FGG900C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S4000-5FGG900C requirements.
6.How does Aetrix verify that XC3S4000-5FGG900C is sourced from the original manufacturer or authorized distributors?
All XC3S4000-5FGG900C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S4000-5FGG900C meets industry standards.
7.What is the process for return or replacement of XC3S4000-5FGG900C?
All XC3S4000-5FGG900C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S4000-5FGG900C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S4000-5FGG900C part is unused and in its original packaging.
Return procedure for XC3S4000-5FGG900C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC3S4000-5FGG900C Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
