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AMD XC3S400-4FG320C
- Part No.:
- XC3S400-4FG320C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 320-BGA
- Datasheet:
-
XC3S400-4FG320C.pdf
- Description:
- IC FPGA 221 I/O 320FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,597
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Product details
Overview
XC3S400-4FG320C from AMD (formerly Xilinx) is a Spartan-3 FPGA with 400,000 system gates, 241 I/O pins, and a -4 speed grade in a 320-pin Fine-Pitch Ball Grid Array (FBGA) package. It integrates 8,064 logic cells, 720 Kbits of block RAM, and supports LVCMOS/LVTTL I/O standards for embedded control and digital signal processing applications.
For engineers reviewing the XC3S400-4FG320C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count, speed grade timing closure, and FBGA thermal/mechanical compatibility in space-constrained industrial controllers.
Technical Context
The XC3S400-4FG320C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated multipliers. It supports SelectIO technology for programmable I/O standards including LVCMOS, LVTTL, PCI, and SSTL.
Configuration is performed via Master Serial mode using an external PROM or JTAG boundary-scan interface. The device includes Digital Clock Managers (DCMs) for clock synthesis, phase shifting, and duty-cycle correction across up to eight independent clock domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 8,064 - provides combinational and sequential logic capacity for medium-complexity digital controllers |
| System Gates | 400,000 - indicates total equivalent gate count for RTL synthesis estimation |
| I/O Pins | 241 - supports high-channel-count peripheral interfacing with bank-wise voltage assignment |
| Block RAM | 720 Kbits - enables on-chip data buffering and FIFO implementation without external memory |
| Speed Grade | -4 - guarantees maximum clock frequency of 280 MHz for CLB-to-CLB paths under worst-case conditions |
| Package | 320-pin FBGA (Fine-Pitch BGA) - 19×19 mm body, 1.0 mm ball pitch, JEDEC MO-230 compliant |
| DCM Units | 4 - allows independent clock domain management with jitter reduction and phase alignment |
Pinout & Package
XC3S400-4FG320C uses a 320-ball fine-pitch BGA (package code FG320) with 16 I/O banks, power/ground ball distribution optimized for signal integrity and thermal dissipation. Pin functions are bank- and row-dependent; configuration and clock pins are fixed per device architecture.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PROGRAM_B | Active-Low Configuration Initiate | Asserts hardware reset of configuration logic; must be pulled high for normal operation |
| INIT_B | Configuration Status Output | Open-drain indicator signaling successful bitstream loading or error condition |
| CCLK | Configuration Clock Input | Drives serial configuration data timing; supports up to 50 MHz during Master Serial mode |
| DIN | Serial Configuration Data Input | Accepts configuration bitstream from PROM or processor-controlled source |
| CLK0–CLK3 | Global Clock Inputs | Dedicated low-skew routing to DCMs and clock buffers for synchronous design |
Key Features
| Feature | Design Value |
|---|---|
| SelectIO Technology | Supports mixed-voltage I/O banks (1.2V–3.3V) enabling direct interface to legacy and modern peripherals |
| Digital Clock Manager (DCM) | Four independent DCMs provide zero-delay buffering, frequency synthesis, and ±150 ps phase shift resolution |
| Embedded Multipliers | 12 dedicated 18×18-bit two's complement multipliers accelerate DSP algorithm execution |
| Configurable Logic Blocks | Each CLB contains two slices with four LUTs and eight flip-flops, supporting efficient register-rich designs |
| Boundary-Scan Support | IEEE 1149.1-compliant JTAG TAP controller enables in-system programming and board-level test |
Applications
| Industrial Motion Controller | Video Interface Bridge |
|---|---|
Use Scenario: Real-time closed-loop servo positioning with encoder feedback and PWM motor drive signals. IC Role / Device Role / Timing Role: FPGA fabric implements PID computation, pulse generation, and safety monitoring logic with deterministic sub-microsecond latency. Use Value: 241 I/O pins allow simultaneous connection to multiple encoders, analog inputs, and isolated digital outputs without glue logic. | Use Scenario: Conversion between HDMI source and LVDS display panels in medical imaging equipment. IC Role / Device Role / Timing Role: XC3S400-4FG320C performs pixel clock domain crossing, color space transformation, and timing adjustment using block RAM and DCMs. Use Value: On-chip 720 Kbits RAM buffers full video lines; -4 speed grade ensures setup/hold timing margin at 74.25 MHz TMDS clock. |
| Programmable Logic Relay | Communications Protocol Gateway |
Use Scenario: Replacing electromechanical relays in factory automation panels with solid-state switching controlled by ladder logic. IC Role / Device Role / Timing Role: XC3S400-4FG320C executes scanned logic tables and drives opto-isolated output drivers with cycle-accurate timing. Use Value: 8,064 logic cells support >1,000 rungs of IEC 61131-3 ladder logic while retaining diagnostic I/O and watchdog circuitry. | Use Scenario: Translating Modbus RTU over RS-485 to CANopen messages for legacy PLC integration. IC Role / Device Role / Timing Role: XC3S400-4FG320C implements dual-protocol state machines, CRC engines, and baud-rate-agile UARTs with precise bit timing. Use Value: SelectIO banks permit concurrent 5V-tolerant RS-485 and 3.3V CAN transceiver interfacing without level shifters. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S500E-4FG320C | Higher logic density (11,648 CLBs), same package and pinout, but increased static power and larger bitstream | Better suited for designs requiring additional embedded memory or arithmetic resources | Select when migrating from XC3S400-4FG320C with minimal PCB change but higher resource headroom needed |
| XC6SLX45-3CSG324C | Newer Spartan-6 architecture, 43,661 logic cells, 2.5V core, different pinout and configuration protocol | Requires board redesign and toolchain migration but offers lower dynamic power and enhanced DSP blocks | Choose for new designs prioritizing power efficiency and long-term availability over legacy compatibility |
Compared with XC3S400-4FG320C, XC3S500E-4FG320C delivers drop-in resource scalability within identical thermal and mechanical constraints, while XC6SLX45-3CSG324C requires layout and firmware rework but enables substantial power reduction and advanced IP integration.
Availability
XC3S400-4FG320C is available at Aetrix Electronics and suitable for industrial motion control, video interface bridging, and programmable relay applications requiring stable component supply throughout extended production lifecycles.
Supply support for XC3S400-4FG320C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains the Spartan FPGA product line for cost-sensitive, high-volume embedded applications.
The Spartan-3 family was designed for mainstream digital logic replacement and ASIC prototyping, emphasizing I/O flexibility, predictable timing, and broad temperature range operation.
FAQ
What is the maximum operating junction temperature for XC3S400-4FG320C?
The XC3S400-4FG320C has a maximum operating junction temperature of 85°C, specified for commercial-grade operation (suffix C). Thermal design must ensure that internal die temperature remains within this limit under worst-case ambient and power dissipation conditions. The FG320 package's thermal resistance (θJA) is 25.6°C/W, requiring appropriate PCB copper area and airflow for sustained 1.2W typical power draw.
Does XC3S400-4FG320C support JTAG boundary-scan testing?
Yes, XC3S400-4FG320C includes a fully IEEE 1149.1-compliant JTAG TAP controller for boundary-scan testing, in-system programming, and debug access. The TDO, TDI, TCK, TMS, and TRST pins are dedicated and mapped to specific balls in the FG320 package. This capability enables verification of solder joint integrity and interconnect continuity before configuration.
Can XC3S400-4FG320C be configured using a microcontroller?
Yes, XC3S400-4FG320C supports Slave Serial and Slave SelectMAP configuration modes, allowing initialization by an external microcontroller. In Slave Serial mode, the MCU clocks data into DIN using CCLK while monitoring INIT_B and DONE to confirm successful loading. Proper timing alignment and reset sequencing per UG332 must be implemented in firmware.
What I/O standards are supported by XC3S400-4FG320C?
XC3S400-4FG320C supports LVCMOS, LVTTL, PCI, SSTL2, and HSTL I/O standards across its 16 configurable I/O banks. Each bank operates at a single VCCO voltage (1.2V–3.3V), enabling mixed-voltage interfaces. I/Os are 5V-tolerant only in LVTTL and PCI modes; other standards require strict voltage compliance per bank.
Is XC3S400-4FG320C still in active production?
XC3S400-4FG320C is listed as obsolete by AMD/Xilinx, with last-time-buy (LTB) status effective Q3 2021. Aetrix Electronics maintains legacy inventory and offers extended sourcing support, including cross-reference validation and obsolescence mitigation planning for ongoing production programs relying on this device.
XC3S400-4FG320C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3
- Package/Case:
- 320-BGA
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 896
- Number of Logic Elements/Cells:
- 8064
- Total RAM Bits:
- 294912
- Number of I/O:
- 221
- Number of Gates:
- 400000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 320-FBGA (19x19)
XC3S400-4FG320C FAQ
1.How can I place an order for XC3S400-4FG320C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S400-4FG320C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S400-4FG320C reliable?
The price and inventory of XC3S400-4FG320C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S400-4FG320C is usually 5 days.
3.What payment methods are accepted for XC3S400-4FG320C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S400-4FG320C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S400-4FG320C?
XC3S400-4FG320C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S400-4FG320C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S400-4FG320C?
For technical support, including XC3S400-4FG320C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S400-4FG320C requirements.
6.How does Aetrix verify that XC3S400-4FG320C is sourced from the original manufacturer or authorized distributors?
All XC3S400-4FG320C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S400-4FG320C meets industry standards.
7.What is the process for return or replacement of XC3S400-4FG320C?
All XC3S400-4FG320C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S400-4FG320C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S400-4FG320C part is unused and in its original packaging.
Return procedure for XC3S400-4FG320C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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