Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

AMD XC3S400-4FG320I

Part No.:
XC3S400-4FG320I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
320-BGA
Datasheet:
AetrixXC3S400-4FG320I.pdf
Description:
IC FPGA 221 I/O 320FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,705

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

XC3S400-4FG320I from AMD (formerly Xilinx) is a Spartan-3 FPGA with 400,000 system gates, 241 I/O pins, and configured in a 320-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at -4 speed grade (tPD = 4.5 ns), supports SelectIO™ standards including LVCMOS, LVTTL, and SSTL, and targets cost-sensitive embedded control and interface bridging applications.

For engineers reviewing the XC3S400-4FG320I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, logic cell density, supported voltage standards (2.5 V/3.3 V), configuration mode (Master Serial/JTAG), and thermal performance in industrial temperature range (-40°C to +100°C).

Technical Context

The XC3S400-4FG320I integrates 8,064 configurable logic blocks (CLBs), 24 dedicated multipliers (18 × 18), and up to 294 Kbits of distributed RAM. Its configuration is performed via Master Serial mode using external PROM or JTAG boundary-scan, supporting IEEE 1149.1 compliance.

It features Digital Clock Managers (DCMs) for clock synthesis, phase shifting, and duty-cycle correction across four independent clock domains. All I/O banks support independent VCCO supply (1.2 V to 3.3 V) and programmable slew rate and drive strength per pin group.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells8,064 CLBs - provides sufficient resources for medium-complexity digital controllers and protocol translators.
System Gates400,000 - defines routing and logic capacity suitable for bridging between legacy and modern interfaces.
I/O Pins241 user I/O - enables high-pin-count peripheral interfacing without external glue logic.
Speed Grade-4 (tPD = 4.5 ns) - guarantees maximum combinational delay for timing-critical synchronous paths.
Operating Temperature-40°C to +100°C - qualified for industrial environments without derating.
Configuration ModeMaster Serial or JTAG - allows flexible programming via SPI PROM or debug probe during development and field updates.

Pinout & Package

Package: 320-pin Fine-Pitch Ball Grid Array (FBGA), 19 mm × 19 mm, 1.0 mm pitch, RoHS-compliant, thermally enhanced with exposed thermal pad.

Pin/TerminalCircuit RoleDesign Meaning
G1VCCINT1.2 V core supply input - must be decoupled locally with low-ESR ceramic capacitors.
P2VCCO_02.5 V or 3.3 V I/O bank 0 supply - sets voltage standard for associated pins (A1–D13).
T14PROGRAM_BActive-low configuration reset - initiates reconfiguration when pulled low externally.
R15DONEOpen-drain status output - goes high-Z after successful configuration, pulled up to confirm completion.
M16TCKJTAG test clock input - synchronizes boundary-scan operations per IEEE 1149.1 timing.

Key Features

FeatureDesign Value
Digital Clock Manager (DCM)Four independent DCMs provide jitter-free clock multiplication, division, phase shift, and duty-cycle correction without external PLL components.
SelectIO™ TechnologyPer-bank I/O voltage support (1.2 V–3.3 V) enables mixed-voltage interfacing to legacy and modern peripherals.
Dedicated Multipliers24 × 18-bit multipliers accelerate arithmetic-intensive tasks such as motor control loop computation or FIR filtering.
Distributed RAM294 Kbits of fast, asynchronous block RAM - usable as FIFOs, lookup tables, or state storage without external memory.

Applications

Industrial Motor ControlLegacy Interface Bridging

Use Scenario: Real-time PWM generation and encoder feedback processing in servo drives.

IC Role / Device Role / Timing Role: FPGA fabric implements closed-loop control logic with sub-microsecond latency and deterministic timing.

Use Value: 241 I/O pins allow direct connection to gate drivers, encoders, and analog front-ends; DCMs stabilize PWM carrier frequency against temperature drift.

Use Scenario: Converting parallel ATA signals to SDIO or SPI for flash storage migration in aging medical devices.

IC Role / Device Role / Timing Role: Protocol translator with synchronous state machines and timing calibration for skew compensation.

Use Value: SelectIO™ supports both 3.3 V ATA and 1.8 V SDIO signaling on separate banks; 400K gates accommodate dual-interface logic and buffer management.

Automated Test Equipment (ATE)Communications Backplane Monitoring

Use Scenario: High-speed digital pattern generation and response capture at 100+ MHz.

IC Role / Device Role / Timing Role: Configurable I/O with programmable slew rate and termination controls signal integrity on long PCB traces.

Use Value: -4 speed grade ensures setup/hold timing margins for 100 MHz test vectors; 241 I/O supports parallel 32-bit bus testing.

Use Scenario: Monitoring PCIe and SATA link status, error counters, and hot-plug events in telecom chassis.

IC Role / Device Role / Timing Role: Glue logic and status aggregator interfacing with multiple PHYs and microcontroller host.

Use Value: Independent I/O banks isolate 1.2 V PCIe and 3.3 V SATA signaling; JTAG enables in-system diagnostics without host intervention.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based interface and control applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC3S500E-4FG320CHigher logic density (17,280 CLBs), same package and speed grade, but commercial temp range (0°C to +85°C).Suitable for non-industrial environments where extended temperature is not required.Select when additional logic resources are needed and thermal constraints permit commercial-grade operation.
XC6SLX45-3CSG324CNext-generation Spartan-6 architecture, 43,661 logic cells, 2.5 V core, different pinout and configuration scheme.Requires PCB redesign and toolchain migration; offers lower static power and enhanced DSP slices.Choose for new designs prioritizing power efficiency and future roadmap alignment over drop-in compatibility.

Compared with XC3S400-4FG320I, XC3S500E-4FG320C delivers more logic in identical packaging but lacks industrial temperature rating, while XC6SLX45-3CSG324C provides architectural improvements at the cost of layout and firmware rework.

Availability

XC3S400-4FG320I is available at Aetrix Electronics and suitable for industrial motor control, legacy interface bridging, and automated test equipment requiring stable component supply and long-term obsolescence management.

Supply support for XC3S400-4FG320I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and continues to support legacy Spartan-3 product lines with documentation, tools, and lifecycle guidance.

The Spartan-3 family was designed for cost-optimized, high-volume embedded applications requiring balanced logic density, I/O flexibility, and industrial temperature operation.

FAQ

What is the maximum operating frequency of the XC3S400-4FG320I?

The XC3S400-4FG320I has a -4 speed grade, meaning its maximum guaranteed internal clock frequency is 225 MHz for register-to-register paths under worst-case industrial conditions. Actual achievable frequency depends on design placement, routing, and resource utilization. The XC3S400-4FG320I DCMs can generate higher-frequency clocks (up to 320 MHz) with appropriate feedback, but system-level timing closure must be verified per implementation.

Does the XC3S400-4FG320I support JTAG configuration?

Yes, the XC3S400-4FG320I fully supports IEEE 1149.1 JTAG boundary-scan for programming, debugging, and verification. It uses TDI, TDO, TMS, TCK, and TRTI pins for JTAG access and can be configured in JTAG mode without external PROM. The XC3S400-4FG320I also supports JTAG-based partial reconfiguration in compatible toolchains.

What voltage levels are supported on the I/O banks of the XC3S400-4FG320I?

The XC3S400-4FG320I supports independent VCCO supplies per I/O bank, ranging from 1.2 V to 3.3 V. Common configurations include 3.3 V for LVTTL/LVCMOS, 2.5 V for SSTL2, and 1.8 V with external level-shifting since native 1.8 V VCCO is not supported. Each bank's voltage setting determines compatible I/O standards, and the XC3S400-4FG320I requires proper bank-specific decoupling.

Is the XC3S400-4FG320I still in production?

The XC3S400-4FG320I is listed as NRND (Not Recommended for New Designs) by AMD/Xilinx, but active inventory and authorized channel supply remain available through Aetrix Electronics. Lifecycle notifications, last-time-buy windows, and obsolescence mitigation plans are provided for ongoing production programs using the XC3S400-4FG320I.

Can the XC3S400-4FG320I be used in automotive applications?

No, the XC3S400-4FG320I is rated for industrial temperature range (-40°C to +100°C) and is not AEC-Q100 qualified. It lacks automotive-specific reliability testing, failure-in-time (FIT) data, and extended temperature validation required for automotive ECUs. For automotive use, AMD recommends Spartan-7 or Zynq-7000 families instead of the XC3S400-4FG320I.

XC3S400-4FG320I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Spartan®-3
Package/Case:
320-BGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
896
Number of Logic Elements/Cells:
8064
Total RAM Bits:
294912
Number of I/O:
221
Number of Gates:
400000
Voltage - Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
320-FBGA (19x19)

XC3S400-4FG320I FAQ

1.How can I place an order for XC3S400-4FG320I through Aetrix?

Please submit a Request for Quotation (RFQ) for XC3S400-4FG320I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC3S400-4FG320I reliable?

The price and inventory of XC3S400-4FG320I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S400-4FG320I is usually 5 days.

3.What payment methods are accepted for XC3S400-4FG320I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S400-4FG320I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC3S400-4FG320I?

XC3S400-4FG320I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC3S400-4FG320I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC3S400-4FG320I?

For technical support, including XC3S400-4FG320I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S400-4FG320I requirements.

6.How does Aetrix verify that XC3S400-4FG320I is sourced from the original manufacturer or authorized distributors?

All XC3S400-4FG320I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S400-4FG320I meets industry standards.

7.What is the process for return or replacement of XC3S400-4FG320I?

All XC3S400-4FG320I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S400-4FG320I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC3S400-4FG320I part is unused and in its original packaging.

Return procedure for XC3S400-4FG320I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC3S400-4FG320I Tags

  • XC3S400-4FG320I
  • XC3S400-4FG320I PDF
  • XC3S400-4FG320I Datasheet
  • XC3S400-4FG320I Specifications
  • XC3S400-4FG320I Images
  • AMD
  • AMD XC3S400-4FG320I
  • Buy XC3S400-4FG320I
  • XC3S400-4FG320I Price
  • XC3S400-4FG320I Distributor
  • XC3S400-4FG320I Supplier
  • XC3S400-4FG320I Wholesale
Related Products
ICE40LP384-SG32
ICE40LP384-SG32

Lattice Semiconductor Corporation

ICE40UL640-CM36AI
ICE40UL640-CM36AI

Lattice Semiconductor Corporation

ICE40UL1K-CM36AI
ICE40UL1K-CM36AI

Lattice Semiconductor Corporation

LCMXO2-256HC-4SG32C
LCMXO2-256HC-4SG32C

Lattice Semiconductor Corporation

10M02DCV36C8G
10M02DCV36C8G

Intel

LCMXO2-256HC-4SG32I
LCMXO2-256HC-4SG32I

Lattice Semiconductor Corporation

ICE5LP1K-SG48ITR
ICE5LP1K-SG48ITR

Lattice Semiconductor Corporation

ICE40LP1K-CM36
ICE40LP1K-CM36

Lattice Semiconductor Corporation

LCMXO2-256ZE-1SG32I
LCMXO2-256ZE-1SG32I

Lattice Semiconductor Corporation

LCMXO2-256HC-4SG48I
LCMXO2-256HC-4SG48I

Lattice Semiconductor Corporation

ICE40LP1K-CM81
ICE40LP1K-CM81

Lattice Semiconductor Corporation

T20W80I4
T20W80I4

Efinix, Inc.

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER