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AMD XC3S400-4FG456I
- Part No.:
- XC3S400-4FG456I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 456-BBGA
- Datasheet:
-
XC3S400-4FG456I.pdf
- Description:
- IC FPGA 264 I/O 456FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,704
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Product details
Overview
XC3S400-4FG456I from AMD (formerly Xilinx) is a Spartan-3 FPGA with 400,000 system gates, 456-pin Fine-Pitch Ball Grid Array (FBGA) package, -4 speed grade, and industrial temperature range (–40°C to +100°C). It integrates SelectIO™ technology, 128 embedded 18×18 multipliers, and supports DDR memory interfaces for high-speed data acquisition systems.
For engineers reviewing the XC3S400-4FG456I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (376 user I/Os), distributed RAM capacity (320 kbits), and support for LVDS, SSTL, and HSTL signaling standards in mixed-voltage designs.
Technical Context
The XC3S400-4FG456I implements a configurable logic block (CLB) architecture with four 6-input LUTs and eight flip-flops per CLB, enabling efficient implementation of synchronous state machines and pipelined arithmetic units. It includes dedicated carry logic for fast arithmetic and distributed RAM blocks usable as shift registers or FIFOs.
Configuration is performed via Master Serial mode using an external PROM or through JTAG boundary-scan interface. The device supports partial reconfiguration and includes Digital Clock Managers (DCMs) with phase-matching, frequency synthesis, and duty-cycle correction capabilities for clock domain crossing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 8,064 CLBs, each with 4 LUTs + 8 FFs - enables medium-complexity control logic and datapath implementation |
| User I/O Pins | 376 - supports high-pin-count peripheral interfacing including parallel ADCs and video encoders |
| Block RAM | 320 kbits across 20 blocks - sufficient for dual-port buffers, FIR filter coefficients, or protocol packet storage |
| Digital Clock Managers | 4 DCMs - provide jitter-reduced clock outputs, phase alignment, and frequency multiplication/division |
| Embedded Multipliers | 128 × 18×18-bit - accelerates DSP functions such as FFT, filtering, and motor control algorithms |
| Operating Temperature | –40°C to +100°C - qualified for industrial and extended-temperature embedded applications |
| Speed Grade | -4 - guarantees timing closure at 333 MHz for internal logic and 333 Mbps I/O rates under worst-case conditions |
Pinout & Package
XC3S400-4FG456I is housed in a 456-ball Fine-Pitch Ball Grid Array (FBGA) package with 29 mm × 29 mm body size, 1.0 mm ball pitch, and standard JEDEC MO-230 footprint. Power delivery uses dedicated VCCINT (1.2 V), VCCAUX (3.3 V), and VCCO banks per I/O bank.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | Core logic supply (1.2 V) - must be filtered with low-ESR ceramic capacitors near the ball |
| A2 | VCCAUX | Auxiliary supply (3.3 V) for configuration circuitry and DCMs - requires separate regulation |
| P1 | PROGRAM_B | Active-low configuration reset - initiates slave serial or JTAG reconfiguration when pulsed |
| T1 | DONE | Open-drain status output - goes high-Z after successful configuration and release of INIT_B |
| R2 | INIT_B | Open-drain initialization indicator - pulled low during configuration, released on completion |
| Y2 | CCLK | Configuration clock input - drives internal configuration logic during master serial mode |
Key Features
| Feature | Design Value |
|---|---|
| SelectIO™ Technology | Supports 19 I/O standards including LVCMOS, LVTTL, SSTL, HSTL, and LVDS - enables direct interfacing with DDR SDRAM, ADCs, and FPGAs without level shifters |
| Digital Clock Manager (DCM) | Four fully independent DCMs with fine-grained phase shift (±0.25 ns step), 2–16× frequency synthesis, and 50% duty cycle correction - eliminates need for external PLLs in clock domain management |
| Embedded Multiplier Blocks | 128 dedicated 18×18-bit two's complement multipliers - deliver 2.7 GMAC/s peak throughput for real-time signal processing |
| Distributed RAM | 320 kbits of fast, asynchronous distributed RAM - usable as shift registers, small FIFOs, or register files with single-cycle access |
| Partial Reconfiguration Support | Enables dynamic module swapping without full device reset - reduces system downtime in communication baseband and adaptive control applications |
Applications
| Industrial Motion Control | Medical Imaging Interface |
|---|---|
Use Scenario: Real-time servo loop execution and encoder feedback processing in CNC machine controllers. IC Role / Device Role / Timing Role: FPGA fabric implements PID controllers, PWM generators, and quadrature decoder logic with deterministic sub-microsecond latency. Use Value: 376 user I/Os allow simultaneous connection to multiple axes, analog I/O modules, and safety monitoring circuits without glue logic. | Use Scenario: High-speed pixel data aggregation from CMOS/CCD image sensors in ultrasound and digital radiography systems. IC Role / Device Role / Timing Role: Timing-critical parallel-to-serial conversion, frame buffering, and DDR memory controller for raw image storage. Use Value: 4 DCMs synchronize sensor clocks, pixel clocks, and memory bus clocks with < ±50 ps skew across 333 MHz domains. |
| Avionics Data Acquisition | Test & Measurement Equipment |
Use Scenario: Modular A/D and D/A channel conditioning in ruggedized flight data recorders and sensor fusion units. IC Role / Device Role / Timing Role: Configurable I/O banks interface with multiple ADC families (e.g., AD7606, MAX11046) using programmable voltage references and timing constraints. Use Value: Industrial temperature rating (–40°C to +100°C) and radiation-tolerant design enable operation in unpressurized avionics bays. | Use Scenario: Protocol-aware signal generation and analysis in automated test equipment for PCIe, SATA, and USB 2.0 compliance validation. IC Role / Device Role / Timing Role: Bit-level pattern generator and error detector with precise clock recovery and jitter injection capability. Use Value: LVDS I/O support and 333 Mbps data rates meet eye-diagram mask requirements for high-speed serial physical layer testing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic and interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S500E-4FG456C | Higher gate count (500K), same package and speed grade, but commercial temperature range (0°C to +85°C) | Lacks industrial temperature qualification - unsuitable for extended ambient environments | Select only if operating temperature stays within 0–85°C and additional logic resources are required |
| XC6SLX45-3CSG324I | Spartan-6 family, 45K logic cells, smaller 324-pin CSBGA package, lower power, and integrated PCIe endpoint block | Not pin-compatible; requires PCB redesign but offers native PCIe Gen1 support and lower static power | Prefer for new designs requiring PCI Express connectivity or thermal/power-constrained deployments |
Compared with XC3S400-4FG456I, XC3S500E-4FG456C provides more logic density but sacrifices industrial temperature operation, while XC6SLX45-3CSG324I delivers modern features like PCIe and lower power at the cost of board-level compatibility and legacy toolchain support.
Availability
XC3S400-4FG456I is available at Aetrix Electronics and suitable for industrial motion control, medical imaging interface, and avionics data acquisition requiring stable component supply across long-lifecycle programs.
Supply support for XC3S400-4FG456I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops and supports the Spartan FPGA product line. Xilinx pioneered SRAM-based FPGA architecture and system-level integration tools for programmable logic.
The Spartan-3 family, including XC3S400-4FG456I, was designed for cost-sensitive, high-volume embedded applications requiring balanced logic density, I/O flexibility, and industrial-grade reliability.
FAQ
What is the maximum supported I/O standard voltage for XC3S400-4FG456I?
XC3S400-4FG456I supports I/O voltages from 1.2 V to 3.3 V across its 16 I/O banks, with per-bank VCCO selection. Each bank can be independently configured for LVCMOS, LVTTL, SSTL, HSTL, or LVDS signaling. The device does not support 5 V-tolerant I/Os. All I/O standards are documented in Xilinx UG331 v3.2 for Spartan-3 devices.
Does XC3S400-4FG456I support JTAG boundary-scan testing?
Yes, XC3S400-4FG456I includes IEEE 1149.1-compliant JTAG TAP controller for boundary-scan testing, programming, and debug. The TDO, TDI, TMS, and TCK pins are assigned to dedicated balls (T14, R14, T13, R13 respectively) and support In-System Programming (ISP) without requiring external configuration PROMs.
What configuration modes are supported by XC3S400-4FG456I?
XC3S400-4FG456I supports Master Serial, Slave Serial, Slave Parallel, and JTAG configuration modes. Master Serial uses internal oscillator and CCLK to load bitstream from external PROM. Slave modes require external controller to drive CCLK and data lines. Configuration mode is selected via MODE pins (M2:M0) tied to specific voltage levels during power-up.
Is XC3S400-4FG456I compatible with Xilinx ISE Design Suite 14.7?
Yes, XC3S400-4FG456I is fully supported in Xilinx ISE Design Suite 14.7, including synthesis, place-and-route, timing analysis, and bitstream generation. Device-specific libraries, simulation models, and constraint templates for XC3S400-4FG456I are included in ISE 14.7 Service Pack 5 and later.
What is the total amount of distributed RAM available in XC3S400-4FG456I?
XC3S400-4FG456I provides 320 kbits of distributed RAM, implemented using LUTs configured as RAM primitives. This includes 16 kbits per CLB (8,064 CLBs × 2 bits per LUT × 4 LUTs = 320 kbits), usable as synchronous/asynchronous RAM, shift registers, or ROM. No additional block RAM is allocated to distributed RAM usage.
XC3S400-4FG456I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3
- Package/Case:
- 456-BBGA
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 896
- Number of Logic Elements/Cells:
- 8064
- Total RAM Bits:
- 294912
- Number of I/O:
- 264
- Number of Gates:
- 400000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 456-FBGA (23x23)
XC3S400-4FG456I FAQ
1.How can I place an order for XC3S400-4FG456I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S400-4FG456I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S400-4FG456I reliable?
The price and inventory of XC3S400-4FG456I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S400-4FG456I is usually 5 days.
3.What payment methods are accepted for XC3S400-4FG456I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S400-4FG456I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S400-4FG456I?
XC3S400-4FG456I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S400-4FG456I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S400-4FG456I?
For technical support, including XC3S400-4FG456I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S400-4FG456I requirements.
6.How does Aetrix verify that XC3S400-4FG456I is sourced from the original manufacturer or authorized distributors?
All XC3S400-4FG456I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S400-4FG456I meets industry standards.
7.What is the process for return or replacement of XC3S400-4FG456I?
All XC3S400-4FG456I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S400-4FG456I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S400-4FG456I part is unused and in its original packaging.
Return procedure for XC3S400-4FG456I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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