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AMD XC3S400-4FGG320C
- Part No.:
- XC3S400-4FGG320C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 320-BGA
- Datasheet:
-
XC3S400-4FGG320C.pdf
- Description:
- IC FPGA 221 I/O 320FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,547
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Product details
Overview
XC3S400-4FGG320C from AMD (formerly Xilinx) is a Spartan-3 FPGA with 400,000 system gates, 241 I/O pins, and configured in a 320-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at -4 speed grade (4.9 ns CLB delay), supports SelectIO™ standards up to 622 Mbps, and targets cost-sensitive embedded control and interface bridging applications.
For engineers reviewing the XC3S400-4FGG320C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage flexibility (1.2 V to 3.3 V), distributed RAM capacity (288 kbits), and availability of dedicated multipliers (four 18×18-bit) for real-time signal processing tasks.
Technical Context
The XC3S400-4FGG320C implements a hierarchical logic fabric built from Configurable Logic Blocks (CLBs), each containing two slices with four LUTs and eight flip-flops. It integrates block RAM (288 kbits total), four 18×18-bit hardware multipliers, and Digital Clock Managers (DCMs) supporting frequency synthesis, phase shifting, and duty cycle correction.
It supports LVCMOS, LVTTL, PCI, HSTL, and SSTL I/O standards across its 241 user-configurable pins, with programmable slew rate and drive strength per bank. Configuration is performed via Master Serial, Slave Serial, or JTAG modes using external PROM or processor-controlled loading.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Capacity | 400,000 system gates - defines maximum combinational logic density for gate-equivalent design mapping |
| CLB Count | 806 CLBs - determines parallel logic resource availability for pipelined or parallelized functions |
| Block RAM | 288 kbits distributed across 20 blocks - enables on-chip FIFOs, buffers, or small lookup tables without external memory |
| I/O Pins | 241 user I/Os - supports high-pin-count peripheral interfacing with bank-wise voltage isolation |
| Speed Grade | -4 (4.9 ns CLB propagation delay) - guarantees timing closure for designs targeting ≤200 MHz system clock domains |
| DCM Units | 4 Digital Clock Managers - provide jitter-tolerant clock synthesis, phase alignment, and frequency multiplication/division |
| Multpliers | 4 × 18×18-bit signed/unsigned - accelerates arithmetic-intensive operations like filtering or motor control algorithms |
Pinout & Package
XC3S400-4FGG320C is housed in a 320-ball Fine-Pitch Ball Grid Array (FBGA) package with 25 mm × 25 mm body size, 1.0 mm ball pitch, and Pb-free (RoHS-compliant) finish. Pinout follows Xilinx Spartan-3 family standard layout with dedicated configuration, clock, JTAG, and I/O banks.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration shift register during Master Serial mode; must be driven externally or by DCM output |
| DIN | Configuration Data Input | Serial data input for bitstream loading in Master/Slave Serial modes |
| PROG_B | Program Initiate | Active-low signal that clears configuration memory and resets internal logic prior to reconfiguration |
| TCK/TMS/TDI/TDO | JTAG Boundary-Scan Interface | Enables IEEE 1149.1-compliant programming, debugging, and interconnect testing |
| IO_LxxN/IO_LxxP | Differential I/O Pair | Supports LVDS, RSDS, or BLVDS signaling when assigned as differential pair in ISE software |
| GCLKx | Global Clock Input | Connects directly to global routing network for low-skew clock distribution to all CLBs and RAM blocks |
Key Features
| Feature | Design Value |
|---|---|
| SelectIO™ Technology | Per-bank I/O voltage support (1.2 V–3.3 V) enables mixed-voltage interface to legacy and modern peripherals |
| Digital Clock Manager (DCM) | Four independent DCMs provide deterministic clock deskew, frequency synthesis, and 0°–360° phase shift without external PLL components |
| Embedded Multipliers | Four hardwired 18×18-bit multipliers deliver 270+ MHz sustained multiply-accumulate throughput for real-time DSP loops |
| Configurable Logic Blocks | Each CLB contains dual-slice architecture with fast carry chain, enabling efficient arithmetic and wide decoder implementation |
| Block RAM | 20 × 144-bit RAM blocks support true dual-port operation, critical for ping-pong buffering in video or communication pipelines |
Applications
| Industrial Motion Control | Automotive Diagnostic Interface |
|---|---|
Use Scenario: Real-time closed-loop servo positioning using encoder feedback and PWM generation. IC Role / Device Role / Timing Role: FPGA logic implements PID controller, quadrature decoder, and 16-channel PWM generator with sub-microsecond timing resolution. Use Value: XC3S400-4FGG320C delivers deterministic latency and synchronized I/O timing essential for jitter-free motor commutation. | Use Scenario: CAN-to-USB gateway in vehicle service tools connecting OBD-II port to PC host. IC Role / Device Role / Timing Role: XC3S400-4FGG320C hosts dual CAN controller IP cores and USB 2.0 transceiver interface logic. Use Value: On-chip block RAM buffers CAN message queues while DCMs synchronize 125 MHz USB and 1 MHz CAN clock domains. |
| Medical Imaging Front-End | Test & Measurement Equipment |
Use Scenario: High-speed ADC data capture and real-time histogram generation for ultrasound beamforming. IC Role / Device Role / Timing Role: XC3S400-4FGG320C manages LVDS ADC interface, performs pixel-level thresholding, and compresses histogram data before transfer. Use Value: 241 I/Os support parallel 16-bit LVDS lanes; 288 kbits block RAM stores 1024-bin histograms without external SRAM. | Use Scenario: Modular digital pattern generator with programmable timing resolution down to 2.5 ns. IC Role / Device Role / Timing Role: XC3S400-4FGG320C implements high-speed state machines, delay calibration logic, and serial-to-parallel conversion for 100+ channel outputs. Use Value: -4 speed grade ensures setup/hold timing margins for 400 Mbps pattern rates; DCMs generate precise sub-cycle delays. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S500E-4FG320C | Higher logic capacity (500K gates), same package and pinout, but increased power consumption and thermal footprint | Better suited for designs requiring additional logic resources or larger embedded memory, e.g., multi-protocol bridge with Ethernet MAC + USB PHY | Select when XC3S400-4FGG320C fails timing closure or exceeds LUT utilization in final place-and-route |
| XC6SLX45-3CSG324C | Newer Spartan-6 architecture, 45K logic cells, 2.5 V core, improved DSP slice count (64 vs 4), and lower static power | Preferred for new designs needing higher performance-per-watt, PCIe endpoint support, or DDR2/3 memory controllers | Choose for long-term design continuity and access to newer toolchain features; not pin-compatible with XC3S400-4FGG320C |
Compared with XC3S400-4FGG320C, XC3S500E-4FG320C offers gate scalability within identical PCB layout, while XC6SLX45-3CSG324C provides architectural upgrades including enhanced memory bandwidth and integrated memory controllers-requiring board redesign but delivering superior power efficiency and IP integration.
Availability
XC3S400-4FGG320C is available at Aetrix Electronics and suitable for industrial motion control, automotive diagnostic interface, medical imaging front-end, and test & measurement equipment requiring stable component supply and long-lifecycle support.
Supply support for XC3S400-4FGG320C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops and supports the Spartan FPGA product line originally introduced by Xilinx for cost-optimized, high-volume embedded logic applications.
The Spartan-3 family, including XC3S400-4FGG320C, was designed for non-volatile, reprogrammable logic in space-constrained systems where gate density, I/O flexibility, and deterministic timing outweigh advanced features like embedded processors or high-speed transceivers.
FAQ
What is the maximum operating frequency supported by XC3S400-4FGG320C?
The XC3S400-4FGG320C has a -4 speed grade, specifying a worst-case CLB propagation delay of 4.9 ns. This enables reliable synchronous operation up to 200 MHz for well-constrained logic paths. Actual achievable frequency depends on design topology, placement, and routing; timing analysis in Xilinx ISE must confirm closure for each specific implementation of XC3S400-4FGG320C.
Does XC3S400-4FGG320C support JTAG boundary-scan testing?
Yes, XC3S400-4FGG320C includes full IEEE 1149.1-compliant JTAG circuitry with TCK, TMS, TDI, and TDO pins. It supports device programming, configuration verification, and interconnect testing during board assembly and field diagnostics-all without requiring XC3S400-4FGG320C to be operational in user mode.
Can XC3S400-4FGG320C interface directly with 3.3 V and 1.8 V peripherals?
Yes, XC3S400-4FGG320C supports mixed-voltage I/O through bank-wise VCCO assignment. Each I/O bank can be independently powered at 1.2 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V, allowing direct connection to peripherals operating at different voltage levels without level-shifting components-provided all signals in a given bank share the same VCCO setting for XC3S400-4FGG320C.
What configuration methods are supported by XC3S400-4FGG320C?
XC3S400-4FGG320C supports three primary configuration modes: Master Serial (using external PROM), Slave Serial (driven by microcontroller), and JTAG (for programming and debugging). Configuration bitstream is loaded into SRAM-based logic cells, making XC3S400-4FGG320C volatile-requiring reconfiguration at power-up unless paired with non-volatile storage.
Is XC3S400-4FGG320C RoHS compliant and lead-free?
Yes, XC3S400-4FGG320C is manufactured in a Pb-free (lead-free) process and complies with EU RoHS Directive 2011/65/EU. The FGG320 package uses matte tin surface finish on solder balls and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) requirements for standard SMT assembly processes involving XC3S400-4FGG320C.
XC3S400-4FGG320C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3
- Package/Case:
- 320-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 896
- Number of Logic Elements/Cells:
- 8064
- Total RAM Bits:
- 294912
- Number of I/O:
- 221
- Number of Gates:
- 400000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 320-FBGA (19x19)
XC3S400-4FGG320C FAQ
1.How can I place an order for XC3S400-4FGG320C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S400-4FGG320C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S400-4FGG320C reliable?
The price and inventory of XC3S400-4FGG320C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S400-4FGG320C is usually 5 days.
3.What payment methods are accepted for XC3S400-4FGG320C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S400-4FGG320C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S400-4FGG320C?
XC3S400-4FGG320C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S400-4FGG320C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S400-4FGG320C?
For technical support, including XC3S400-4FGG320C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S400-4FGG320C requirements.
6.How does Aetrix verify that XC3S400-4FGG320C is sourced from the original manufacturer or authorized distributors?
All XC3S400-4FGG320C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S400-4FGG320C meets industry standards.
7.What is the process for return or replacement of XC3S400-4FGG320C?
All XC3S400-4FGG320C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S400-4FGG320C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S400-4FGG320C part is unused and in its original packaging.
Return procedure for XC3S400-4FGG320C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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