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AMD XC3S400-4FGG320I
- Part No.:
- XC3S400-4FGG320I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 320-BGA
- Datasheet:
-
XC3S400-4FGG320I.pdf
- Description:
- IC FPGA 221 I/O 320FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,583
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Product details
Overview
XC3S400-4FGG320I from AMD (formerly Xilinx) is a Spartan-3 FPGA with 400,000 system gates, 241 I/O pins, and configured in a 320-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at -4 speed grade (tPD = 4.5 ns), supports SelectIO™ standards up to 622 Mbps, and targets high-volume cost-sensitive embedded control and interface bridging applications.
For engineers reviewing the XC3S400-4FGG320I datasheet, pinout, applications, or equivalent options, key selection factors include I/O count, speed grade timing closure, LVDS/PCI compatibility, and availability of migration paths within the Spartan-3 family.
Technical Context
The XC3S400-4FGG320I implements a hierarchical logic fabric built from configurable logic blocks (CLBs), each containing two slices with four LUTs and eight flip-flops. It integrates eighteen 18×18 multipliers and supports distributed RAM and block RAM (up to 288 Kbits).
Configuration is performed via Master Serial mode using an external PROM or through JTAG boundary-scan. It supports IEEE 1149.1 compliance and includes internal digital clock managers (DCMs) for phase shifting, frequency synthesis, and duty cycle correction across multiple clock domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Capacity | 400,000 system gates - defines maximum combinational logic density for gate-equivalent design mapping |
| Speed Grade | -4 - guarantees worst-case propagation delay ≤ 4.5 ns for CLB-to-CLB paths under industrial temperature |
| I/O Pins | 241 user-configurable I/Os - supports parallel bus interfaces, multi-protocol pin assignment, and bank-wise voltage isolation |
| Block RAM | 288 Kbits total - enables FIFOs, dual-port buffers, and small on-chip data storage without external memory |
| DCMs | 2 Digital Clock Managers - provide jitter-tolerant clock synthesis, 0–255° phase shift, and input clock multiplication/division |
| Operating Temp | -40°C to +100°C - qualified for extended industrial environments without derating |
Pinout & Package
XC3S400-4FGG320I is housed in a 320-ball fine-pitch BGA (FBGA) package with 1.0 mm ball pitch, 23 × 23 array, and thermal pad. Package dimensions are 27 mm × 27 mm × 1.55 mm (height).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.2 V core supply - powers CLBs, DCMs, and internal routing; requires low-noise local regulation |
| P2 | VCCAUX | 2.5 V auxiliary supply - powers configuration logic, JTAG, and DCM analog circuitry |
| A1 | PROGRAM_B | Active-Low configuration reset - initiates slave serial or JTAG reconfiguration when pulsed low |
| T1 | DONE | Open-drain status output - goes high-Z after successful configuration; pulled high externally to indicate completion |
| R1 | INIT_B | Open-drain initialization indicator - driven low during configuration, released upon bitstream CRC pass |
Key Features
| Feature | Design Value |
|---|---|
| SelectIO™ Technology | Supports LVCMOS, LVTTL, PCI, HSTL, SSTL, and differential standards (LVDS, RSDS) on all I/O banks - enables direct interfacing with legacy and high-speed peripherals |
| Digital Clock Manager (DCM) | Two fully independent DCMs per device - allow simultaneous clock domain translation, skew elimination, and jitter reduction without external PLLs |
| Configurable Logic Blocks (CLBs) | Each CLB contains eight flip-flops and four 4-input LUTs - provides balanced resource allocation for synchronous state machines and arithmetic pipelines |
| Embedded Multipliers | Eighteen 18 × 18 signed multipliers - accelerate FIR filters, motor control algorithms, and real-time signal processing tasks |
Applications
| Industrial Motion Control | Video Interface Bridge |
|---|---|
Use Scenario: Real-time closed-loop servo positioning in CNC machines and robotic arms using encoder feedback and PWM generation. IC Role / Device Role / Timing Role: FPGA fabric executes PID computation, pulse-width modulation, and encoder quadrature decoding with deterministic sub-microsecond latency. Use Value: XC3S400-4FGG320I delivers 241 I/Os for multi-axis I/O expansion and integrated DCMs for synchronized PWM and capture clock domains. | Use Scenario: Converting parallel BT.656 video streams to MIPI CSI-2 for image sensor integration in embedded vision systems. IC Role / Device Role / Timing Role: XC3S400-4FGG320I acts as protocol translator and timing adapter, managing pixel clock domain crossing and packet framing. Use Value: SelectIO™ support for both 3.3 V parallel video I/O and differential MIPI-compatible signaling enables single-chip bridging without level-shifting ICs. |
| Communications Backplane Interface | Medical Imaging Data Acquisition |
Use Scenario: Implementing custom packet parsing and header rewriting in modular telecom line cards with parallel bus backplanes. IC Role / Device Role / Timing Role: XC3S400-4FGG320I serves as programmable logic layer between ASICs and backplane connectors, handling parity, CRC, and address decode. Use Value: 241 I/Os accommodate wide parallel buses (e.g., 32-bit data + 12-bit address), while -4 speed grade ensures setup/hold timing closure at 66 MHz PCI-X rates. | Use Scenario: Aggregating ADC samples from multi-channel ultrasound front-ends into DDR2 memory controllers for beamforming preprocessing. IC Role / Device Role / Timing Role: XC3S400-4FGG320I manages time-critical ADC sampling synchronization, channel multiplexing, and burst-mode memory writes. Use Value: Integrated block RAM (288 Kbits) buffers transient sample bursts, and DCMs align sampling clocks with memory controller timing windows. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S500E-4FG320C | Higher logic capacity (500K gates), same -4 speed grade, but commercial temp range (0°C to +85°C) | Lacks extended temperature qualification; not suitable for uncontrolled industrial enclosures | Choose if higher gate count is needed and ambient temperature remains within commercial limits |
| XC3S200A-4VQG100C | Smaller footprint (100-pin VQFP), lower I/O count (63), reduced block RAM (96 Kbits), commercial temp only | Targeted for space-constrained prototyping or low-pin-count control functions | Select when board area is critical and full 241 I/Os are unnecessary |
Compared with XC3S400-4FGG320I, the XC3S500E-4FG320C offers more logic resources but sacrifices industrial temperature operation, while the XC3S200A-4VQG100C trades I/O count, memory, and thermal rating for compact packaging - both require PCB redesign and timing revalidation.
Availability
XC3S400-4FGG320I is available at Aetrix Electronics and suitable for industrial motion control, medical imaging data acquisition, and communications backplane interface applications requiring stable component supply over extended product lifecycles.
Supply support for XC3S400-4FGG320I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now owns the Spartan FPGA portfolio. Xilinx pioneered programmable logic architecture and introduced the Spartan family for high-volume, cost-optimized applications.
The Spartan-3 family, including XC3S400-4FGG320I, was designed for embedded control, interface bridging, and digital logic replacement in industrial, medical, and communications equipment where gate density, I/O flexibility, and thermal robustness are essential.
FAQ
What is the operating temperature range for XC3S400-4FGG320I?
The XC3S400-4FGG320I is rated for industrial temperature operation from -40°C to +100°C. This specification is validated per Xilinx DS099 documentation and applies to the FGG320 package variant. The extended range supports deployment in factory automation, outdoor telecom cabinets, and medical diagnostic enclosures without forced cooling or derating.
Does XC3S400-4FGG320I support LVDS signaling?
Yes, XC3S400-4FGG320I supports LVDS input and output standards via its SelectIO™ technology. Each I/O bank can be independently configured for LVDS, provided VCCO is set to 2.5 V and appropriate termination is applied. This capability is confirmed in Xilinx UG331 and applies directly to the FGG320 package's I/O pin assignments.
How many Digital Clock Managers (DCMs) does XC3S400-4FGG320I contain?
XC3S400-4FGG320I contains two fully functional Digital Clock Managers (DCMs). These are independent, non-shared resources that support input clock multiplication, division, phase shifting, and duty cycle correction. Their presence is documented in the Spartan-3 datasheet DS099 and verified in the XC3S400-4FGG320I device-specific configuration tables.
What configuration modes are supported by XC3S400-4FGG320I?
XC3S400-4FGG320I supports Master Serial, Slave Serial, JTAG, and Boundary Scan configuration modes. Master Serial uses an external PROM; Slave Serial accepts bitstream from a microcontroller; JTAG enables programming and debugging. All modes are defined in Xilinx UG332 and apply to the FGG320 package without modification.
Is XC3S400-4FGG320I pin-compatible with other Spartan-3 devices in the FGG320 package?
No, XC3S400-4FGG320I is not pin-compatible with other Spartan-3 devices in the FGG320 package, such as XC3S1000-4FGG320I. While both share the same 320-ball FBGA footprint, I/O bank assignments, VCCO/VREF allocations, and dedicated configuration pin placements differ across densities. Pin mapping must be verified per device-specific pinout files from Xilinx documentation.
XC3S400-4FGG320I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3
- Package/Case:
- 320-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 896
- Number of Logic Elements/Cells:
- 8064
- Total RAM Bits:
- 294912
- Number of I/O:
- 221
- Number of Gates:
- 400000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 320-FBGA (19x19)
XC3S400-4FGG320I FAQ
1.How can I place an order for XC3S400-4FGG320I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S400-4FGG320I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S400-4FGG320I reliable?
The price and inventory of XC3S400-4FGG320I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S400-4FGG320I is usually 5 days.
3.What payment methods are accepted for XC3S400-4FGG320I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S400-4FGG320I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S400-4FGG320I?
XC3S400-4FGG320I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S400-4FGG320I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S400-4FGG320I?
For technical support, including XC3S400-4FGG320I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S400-4FGG320I requirements.
6.How does Aetrix verify that XC3S400-4FGG320I is sourced from the original manufacturer or authorized distributors?
All XC3S400-4FGG320I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S400-4FGG320I meets industry standards.
7.What is the process for return or replacement of XC3S400-4FGG320I?
All XC3S400-4FGG320I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S400-4FGG320I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S400-4FGG320I part is unused and in its original packaging.
Return procedure for XC3S400-4FGG320I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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