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AMD XC3S400-4FGG456I
- Part No.:
- XC3S400-4FGG456I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 456-BBGA
- Datasheet:
-
XC3S400-4FGG456I.pdf
- Description:
- IC FPGA 264 I/O 456FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,143
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Product details
Overview
XC3S400-4FGG456I from AMD (formerly Xilinx) is a Spartan-3 FPGA with 400,000 system gates, 8,064 logic cells, and 216 I/O pins in a 456-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at -4 speed grade (tPD = 4.5 ns), supports SelectIO™ standards up to 333 Mbps, and targets cost-sensitive embedded control and interface bridging applications.
For engineers reviewing the XC3S400-4FGG456I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V to 3.3 V), distributed RAM capacity (72 Kb), and availability of dedicated multipliers (four 18×18-bit).
Technical Context
The XC3S400-4FGG456I implements a hierarchical architecture with configurable logic blocks (CLBs), block RAM, digital clock managers (DCMs), and I/O banks supporting LVCMOS, LVTTL, PCI, HSTL, and SSTL signaling. Each CLB contains two slices with four LUTs and eight flip-flops.
It integrates four 18×18-bit signed multipliers, 72 Kb of total block RAM (distributed + block), and two DCMs for clock synthesis, phase shifting, and duty cycle correction - all operating across industrial temperature range (-40°C to +100°C).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 8,064 - provides combinational and sequential logic density for medium-complexity control and protocol processing |
| System Gates | 400,000 - indicates overall logic capacity compatible with ASIC-style design partitioning |
| I/O Pins | 216 - supports high-pin-count peripheral interfacing with bank-wise voltage isolation |
| Block RAM | 72 Kb - enables FIFOs, buffers, and small lookup tables without external memory |
| DCMs | 2 - delivers jitter-reduced clock outputs, frequency synthesis, and phase alignment for synchronous systems |
| Speed Grade | -4 - guarantees maximum propagation delay of 4.5 ns for critical path timing closure |
| Operating Temp | -40°C to +100°C - qualified for industrial environments without derating |
Pinout & Package
Package: 456-pin Fine-Pitch Ball Grid Array (FBGA), 23×23 mm, 1.0 mm ball pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 output supply - sets voltage level for all outputs in Bank 0 (1.2 V/1.5 V/1.8 V/2.5 V/3.3 V) |
| P2 | IO_L1P_0 | Differential pair positive input/output in Bank 0 - supports LVDS, RSDS, or single-ended I/O |
| T14 | CLK0 | Primary global clock input - connects to DCM CLKIN for low-skew clock distribution |
| V17 | GND | Ground reference for core logic and I/O banks - required for noise suppression and signal integrity |
| R18 | VCCINT | 1.2 V core supply - powers CLBs, DCMs, and internal routing; requires tight regulation ±3% |
Key Features
| Feature | Design Value |
|---|---|
| SelectIO™ Technology | Supports 18 I/O standards including LVCMOS, LVTTL, PCI, HSTL-I/II, SSTL-II/III - enables direct interfacing with FPGAs, microprocessors, and memory without level shifters |
| Digital Clock Manager (DCM) | Two fully digital DCMs provide zero-delay buffering, frequency synthesis (×2 to ×32), and phase shift (–180° to +180°) - eliminates need for external PLLs in clock domain crossing |
| Embedded Multipliers | Four 18×18-bit signed multipliers - accelerate DSP functions like FIR filtering and motor control without external math ICs |
| Configurable Logic Blocks | Each CLB contains two slices with four 4-input LUTs and eight registers - balances logic depth and register count for pipelined data paths |
| Block RAM | 18 blocks of 4 Kb each - allows dual-port access for simultaneous read/write in buffer or cache implementations |
Applications
| Industrial PLC I/O Expansion | Video Interface Bridge |
|---|---|
Use Scenario: Adding isolated digital I/O, analog input scanning, and fieldbus protocol handling to legacy PLC backplanes. IC Role / Device Role / Timing Role: Configurable logic fabric implements custom state machines, timing controllers, and protocol engines for Modbus RTU and CANopen. Use Value: Replaces multiple ASICs and glue logic with one device; leverages 216 I/O pins and industrial temp rating for rugged deployment. | Use Scenario: Converting parallel RGB video from image sensors to serialized LVDS or MIPI D-PHY for display or FPGA-based vision processing. IC Role / Device Role / Timing Role: Timing-critical pixel clock domain translation and data serialization using DCM-synchronized I/O and embedded multipliers for pre-processing. Use Value: Achieves sub-cycle skew control via dedicated clock networks and supports 333 Mbps per I/O line for high-resolution sensor interfaces. |
| Medical Diagnostic Data Acquisition | Avionics Sensor Signal Conditioning |
Use Scenario: Aggregating and preprocessing signals from ECG, EEG, and pulse oximetry sensors before transmission to host MCU. IC Role / Device Role / Timing Role: Implements real-time digital filtering (FIR), decimation, and packetization using block RAM and multiplier resources. Use Value: 72 Kb on-chip RAM stores filter coefficients and sample buffers; DCM ensures deterministic sampling clock jitter < 100 ps RMS. | Use Scenario: Conditioning ARINC 429, discrete status, and analog transducer signals in flight control subsystems. IC Role / Device Role / Timing Role: Performs protocol encoding/decoding, debounce logic, and fault-tolerant voting logic across redundant channels. Use Value: Industrial temperature range and configuration scrubbing support meet DO-254 Level A requirements for airborne hardware. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic and interface bridging applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S500E-4FGG456C | Higher logic capacity (11,648 LCs), same package and speed grade, but commercial temp range (0°C to +85°C) | Lacks industrial temperature qualification; suitable only for non-ruggedized lab or consumer-grade systems | Choose when additional logic density is needed and ambient conditions remain within commercial limits |
| XC3S200A-4VQG100C | Smaller footprint (100-pin VQFP), lower gate count (200K), reduced I/O (66 pins), commercial temp only | Not pin-compatible; requires PCB redesign; limited for space-constrained prototyping only | Select only for early-stage evaluation where I/O count and thermal margin are secondary to form factor |
Compared with XC3S400-4FGG456I, the XC3S500E-4FGG456C offers more logic but sacrifices industrial reliability, while the XC3S200A-4VQG100C trades scalability and thermal robustness for compact packaging - making XC3S400-4FGG456I optimal for production-grade industrial control with balanced I/O, density, and environmental tolerance.
Availability
XC3S400-4FGG456I is available at Aetrix Electronics and suitable for industrial PLC expansion, medical data acquisition, and avionics sensor conditioning requiring stable component supply and long-term lifecycle support.
Supply support for XC3S400-4FGG456I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, embedded, and edge applications.
The Spartan-3 family was designed by Xilinx to deliver high logic density and I/O flexibility at lowest possible cost for high-volume industrial, automotive, and communications equipment.
FAQ
What is the maximum I/O standard supported by XC3S400-4FGG456I?
The XC3S400-4FGG456I supports SelectIO™ standards up to 333 Mbps, including LVCMOS, LVTTL, PCI, HSTL-I/II, and SSTL-II/III. It does not support DDR3 or QDR interfaces. Each I/O bank is independently configurable for voltage levels between 1.2 V and 3.3 V, enabling mixed-voltage system interfacing without external level shifters. The XC3S400-4FGG456I achieves this using programmable slew rate and drive strength controls per pin group.
Does XC3S400-4FGG456I include on-chip clock generation capability?
Yes, the XC3S400-4FGG456I integrates two Digital Clock Managers (DCMs) that provide jitter reduction, frequency synthesis (×2 to ×32), phase shifting (–180° to +180°), and duty cycle correction. These DCMs accept input clocks from dedicated global clock pins and distribute low-skew clock signals across the device. The XC3S400-4FGG456I does not include analog PLLs or fractional-N synthesizers - all clock manipulation is digital and deterministic.
What configuration modes are supported by XC3S400-4FGG456I?
The XC3S400-4FGG456I supports Master Serial, Slave Serial, Boundary Scan (JTAG), and Master SelectMAP configuration modes. Configuration bitstream is loaded via dedicated configuration pins (e.g., DIN, CCLK, PROG_B) and stored in SRAM-based CLBs. The XC3S400-4FGG456I requires external nonvolatile storage (e.g., SPI PROM or microcontroller) to reload configuration on power-up, as it lacks on-chip flash memory.
Is XC3S400-4FGG456I qualified for industrial temperature operation?
Yes, the XC3S400-4FGG456I is rated for industrial temperature range (–40°C to +100°C) and carries the 'I' suffix in its part number to denote this qualification. This includes full functionality and timing compliance across the entire range, verified per Xilinx DS099 and DS104 specifications. The XC3S400-4FGG456I uses thermal-aware placement and routing constraints during implementation to maintain stability under sustained thermal load.
How much block RAM is available in XC3S400-4FGG456I?
The XC3S400-4FGG456I provides 72 Kb of total block RAM, organized as eighteen 4 Kb blocks. Each block supports synchronous dual-port operation with independent read/write addresses and clocks. This RAM is used for FIFOs, frame buffers, coefficient storage, and state tables - and is distinct from distributed RAM implemented in LUTs. The XC3S400-4FGG456I does not include cache controllers or memory management units; RAM access is direct and software-managed via HDL logic.
XC3S400-4FGG456I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3
- Package/Case:
- 456-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 896
- Number of Logic Elements/Cells:
- 8064
- Total RAM Bits:
- 294912
- Number of I/O:
- 264
- Number of Gates:
- 400000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 456-FBGA (23x23)
XC3S400-4FGG456I FAQ
1.How can I place an order for XC3S400-4FGG456I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S400-4FGG456I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S400-4FGG456I reliable?
The price and inventory of XC3S400-4FGG456I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S400-4FGG456I is usually 5 days.
3.What payment methods are accepted for XC3S400-4FGG456I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S400-4FGG456I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S400-4FGG456I?
XC3S400-4FGG456I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S400-4FGG456I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S400-4FGG456I?
For technical support, including XC3S400-4FGG456I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S400-4FGG456I requirements.
6.How does Aetrix verify that XC3S400-4FGG456I is sourced from the original manufacturer or authorized distributors?
All XC3S400-4FGG456I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S400-4FGG456I meets industry standards.
7.What is the process for return or replacement of XC3S400-4FGG456I?
All XC3S400-4FGG456I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S400-4FGG456I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S400-4FGG456I part is unused and in its original packaging.
Return procedure for XC3S400-4FGG456I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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