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AMD XC3S400-4FT256C
- Part No.:
- XC3S400-4FT256C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC3S400-4FT256C.pdf
- Description:
- IC FPGA 173 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
XC3S400-4FT256C from AMD (formerly Xilinx) is a Spartan-3 FPGA with 400,000 system gates, 241 I/O pins, and configured in a 256-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at -4 speed grade (4.8 ns CLB delay), supports SelectIO™ standards up to 333 Mbps, and targets cost-sensitive embedded control and interface bridging applications.
For engineers reviewing the XC3S400-4FT256C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, speed grade timing closure, FBGA thermal and routing constraints, and legacy Spartan-3 toolchain compatibility.
Technical Context
The XC3S400-4FT256C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, block RAM (176 Kbits), and dedicated multipliers. It uses SRAM-based configuration with external SPI or parallel PROM loading.
It supports LVCMOS, LVTTL, PCI, HSTL, and SSTL I/O standards across banks with independent VCCO and VREF per bank. Configuration occurs via JTAG or master/slave serial mode using internal startup circuitry.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Capacity | 400,000 system gates - defines maximum combinational logic density for gate-equivalent design mapping |
| CLB Count | 8064 CLBs - determines number of 4-input LUTs and flip-flops available for synchronous logic implementation |
| I/O Pins | 241 user I/O - usable signal routing endpoints supporting mixed-voltage bank operation |
| Block RAM | 176 Kbits - on-chip memory for FIFOs, buffers, or small lookup tables without external memory |
| Speed Grade | -4 (4.8 ns CLB delay) - specifies worst-case propagation delay through a single CLB for timing closure at target frequency |
| Package | 256-pin FTBGA (Fine-Pitch TBGA) - 17×17 mm body, 1.0 mm ball pitch, requires controlled-impedance PCB layout |
Pinout & Package
XC3S400-4FT256C is housed in a 256-ball Fine-Pitch TBGA (FTBGA) package with 169 I/O balls, 12 configuration balls, 8 JTAG/debug balls, 4 power/ground distribution balls, and 63 reserved/no-connect balls. Thermal pad is not present.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.2 V core supply input - must be filtered locally with low-ESR ceramic capacitors |
| A1, A2 | TCK, TMS | JTAG boundary-scan test clock and mode select - require 10 kΩ pull-up to VCCO |
| P1 | PROGRAM_B | Active-low configuration reset - initiates reconfiguration when pulsed low |
| R1 | DONE | Open-drain status output - goes high-Z after successful configuration completion |
| H1, H2 | VCCO_0, VCCO_1 | I/O bank power supplies - set voltage level (1.2–3.3 V) for associated I/O pins |
Key Features
| Feature | Design Value |
|---|---|
| SelectIO™ Technology | Supports 18 I/O standards including LVCMOS, LVTTL, SSTL, HSTL - enables direct interfacing with memory, processors, and peripherals without level shifters |
| Dedicated Multipliers | Four 18×18-bit two's complement multipliers - accelerates DSP functions like FIR filtering and motor control algorithms |
| Embedded Block RAM | 44 × 4 Kbit blocks - provides synchronous dual-port memory for data buffering and state storage |
| Configurable Logic Blocks | Each CLB contains two function generators and four registers - enables efficient implementation of pipelined and registered logic |
Applications
| Industrial PLC Interface | Legacy Bus Bridge |
|---|---|
Use Scenario: Replacing ASICs in programmable logic controllers to support field-upgradable I/O mapping and protocol translation. IC Role / Device Role / Timing Role: Configurable glue logic and real-time sequencer managing discrete I/O, analog mux control, and watchdog supervision. Use Value: Enables firmware-defined signal routing and timing adjustments without hardware redesign or mask changes. | Use Scenario: Bridging ISA or PCI bus peripherals to modern microcontrollers in medical diagnostic equipment. IC Role / Device Role / Timing Role: Synchronous protocol converter translating address/data strobes and handshaking signals between mismatched buses. Use Value: Maintains deterministic latency under 25 ns while supporting burst transfers up to 33 MHz. |
| Video Signal Formatter | Test Equipment Pattern Generator |
Use Scenario: Converting parallel RGB data to serialized LVDS streams for LCD panel drivers in avionics displays. IC Role / Device Role / Timing Role: Pixel clock domain synchronizer and parallel-to-serial serializer with programmable skew calibration. Use Value: Achieves sub-pixel jitter < 150 ps RMS using digital delay taps and phase-aligned I/O clocks. | Use Scenario: Generating high-speed digital stimulus waveforms for IC functional validation in ATE systems. IC Role / Device Role / Timing Role: Deterministic pattern sequencer with 200 MHz DDR-capable outputs and cycle-accurate trigger response. Use Value: Delivers 16-bit parallel vectors at 100 MHz with setup/hold margins > 1.2 ns across all channels. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S500E-4FT256C | 500K-gate capacity, enhanced DCMs, higher static power, same package and pinout | Supports more complex state machines and wider datapaths; requires updated timing constraints | Choose when additional logic resources or improved clock management are required without board redesign |
| XC3S200A-4FT256C | 200K-gate capacity, lower I/O count (195), identical speed grade and package | Suitable for simpler control tasks with reduced peripheral integration | Choose for cost-optimized designs where logic utilization stays below 65% and fewer I/Os are needed |
Compared with XC3S400-4FT256C, the XC3S500E-4FT256C offers headroom for future feature expansion but increases static power by ~22%, while the XC3S200A-4FT256C reduces bill-of-materials cost and thermal load at the expense of logic and I/O scalability.
Availability
XC3S400-4FT256C is available at Aetrix Electronics and suitable for industrial automation, test instrumentation, and legacy system upgrade programs requiring stable component supply and long-term obsolescence mitigation.
Supply support for XC3S400-4FT256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains legacy Spartan-3 product support, documentation, and silicon supply for industrial and aerospace customers.
The Spartan-3 family was designed for cost-sensitive, high-volume applications requiring predictable timing, broad I/O flexibility, and mature synthesis toolchain support - especially where ASIC replacement or rapid prototyping is critical.
FAQ
What is the maximum operating frequency of the XC3S400-4FT256C?
The XC3S400-4FT256C has a -4 speed grade specifying a 4.8 ns CLB propagation delay. In practice, achievable system clock frequencies depend on design topology and routing; typical synchronous logic paths reach 125–160 MHz. The DCM can generate internal clocks up to 280 MHz, but I/O timing limits external interface rates to ≤333 Mbps per pin.
Does the XC3S400-4FT256C support JTAG programming?
Yes, the XC3S400-4FT256C supports IEEE 1149.1 JTAG boundary-scan for configuration, debugging, and verification. Pins TCK, TMS, TDI, and TDO are dedicated to JTAG, and the device complies with Xilinx's Impact programming flow. JTAG mode does not require external configuration PROM.
What configuration modes are supported by the XC3S400-4FT256C?
The XC3S400-4FT256C supports Master Serial, Slave Serial, Master SelectMAP, Slave SelectMAP, and JTAG configuration modes. Configuration bitstream can be loaded from SPI PROM, parallel PROM, or host processor via dedicated configuration pins. Startup sequence is controlled by INIT_B, PROGRAM_B, and DONE signals.
Is the XC3S400-4FT256C RoHS compliant?
Yes, the XC3S400-4FT256C is RoHS-6 compliant (lead-free, halogen-free). It meets EU Directive 2011/65/EU and carries the "Pb-free" marking on the package. The FT256 package uses matte tin finish on solder balls and complies with JEDEC J-STD-020 moisture sensitivity level 3.
Can the XC3S400-4FT256C operate with multiple I/O voltage levels simultaneously?
Yes, the XC3S400-4FT256C supports bank-wise I/O voltage independence: each of its eight I/O banks can be powered with separate VCCO (1.2 V to 3.3 V) and VREF (if used), enabling concurrent LVCMOS33, LVTTL, and SSTL18 signaling on a single device without level translators.
XC3S400-4FT256C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 896
- Number of Logic Elements/Cells:
- 8064
- Total RAM Bits:
- 294912
- Number of I/O:
- 173
- Number of Gates:
- 400000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC3S400-4FT256C FAQ
1.How can I place an order for XC3S400-4FT256C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S400-4FT256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S400-4FT256C reliable?
The price and inventory of XC3S400-4FT256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S400-4FT256C is usually 5 days.
3.What payment methods are accepted for XC3S400-4FT256C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S400-4FT256C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S400-4FT256C?
XC3S400-4FT256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S400-4FT256C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S400-4FT256C?
For technical support, including XC3S400-4FT256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S400-4FT256C requirements.
6.How does Aetrix verify that XC3S400-4FT256C is sourced from the original manufacturer or authorized distributors?
All XC3S400-4FT256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S400-4FT256C meets industry standards.
7.What is the process for return or replacement of XC3S400-4FT256C?
All XC3S400-4FT256C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S400-4FT256C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S400-4FT256C part is unused and in its original packaging.
Return procedure for XC3S400-4FT256C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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