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AMD XC3S400-4FT256I
- Part No.:
- XC3S400-4FT256I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC3S400-4FT256I.pdf
- Description:
- IC FPGA 173 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,772
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Product details
Overview
XC3S400-4FT256I from AMD (formerly Xilinx) is a Spartan-3 FPGA with 400,000 system gates, 8,064 logic cells, and 216 I/O pins in a 256-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at -4 speed grade (tPD = 4.5 ns), supports SelectIO™ standards up to 333 Mbps, and targets cost-sensitive embedded control and interface bridging applications.
For engineers reviewing the XC3S400-4FT256I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, logic density, speed grade timing closure, and compatibility with legacy Spartan-3 design flows and toolchains.
Technical Context
The XC3S400-4FT256I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, block RAM (176 Kbits), and dedicated multipliers (12 × 18-bit). It integrates digital clock managers (DCMs) for phase alignment, duty-cycle correction, and frequency synthesis without external PLLs.
It supports configuration via Master Serial (XCFxxP PROM), Slave Serial, JTAG, or MicroBlaze™-based processor initialization. Configuration bitstream security is not implemented; bitstream encryption requires external measures or later-generation devices.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 8,064 - defines maximum combinational/sequential logic capacity per design |
| System Gates | 400,000 - industry-standard metric for relative logic density vs. ASIC gates |
| I/O Pins | 216 - usable user-defined bidirectional signal interfaces in FT256 package |
| Block RAM | 176 Kbits - on-chip memory for FIFOs, buffers, or small lookup tables |
| DCM Units | 4 - provide clock deskew, frequency multiplication/division, and phase shift |
| Max I/O Speed | 333 Mbps - achievable data rate using LVDS or SSTL-2 I/O standards |
| Speed Grade | -4 - guarantees worst-case propagation delay ≤4.5 ns for CLB-to-CLB paths |
Pinout & Package
XC3S400-4FT256I is housed in a 256-ball Fine-Pitch BGA (FT256) package with 1.0 mm ball pitch, 17 mm × 17 mm body size, and standard JEDEC MO-205AC footprint. Thermal pad is not present; thermal dissipation relies on PCB copper area and airflow.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.2 V ±3% required for internal logic and CLBs; decoupling critical near balls |
| VCCO | I/O bank power | 1.2–3.3 V selectable per bank; sets voltage level for associated I/O standards |
| PROGRAM_B | Configuration reset | Active-low asynchronous input that clears configuration memory and restarts boot |
| DONE | Configuration status | Open-drain output indicating successful bitstream loading and device readiness |
| TCK/TMS/TDI/TDO | JTAG boundary-scan interface | IEEE 1149.1-compliant test and programming access; no internal pull-ups |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated DCMs | Enable jitter-tolerant clock management without external PLL components or layout complexity |
| SelectIO™ Technology | Supports mixed-voltage I/O banks enabling direct interfacing with 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V peripherals |
| Embedded Multipliers | 12 × 18-bit hardwired multipliers accelerate DSP functions like FIR filtering without consuming LUT resources |
| Configurable Logic Blocks | Each CLB contains two slices with four LUTs and eight flip-flops, optimized for high-speed synchronous logic implementation |
| Block RAM | 16 × 18 Kbit dual-port RAM blocks allow independent read/write access for buffering and data staging |
Applications
| Industrial PLC I/O Expansion | Legacy Bus Interface Bridge |
|---|---|
Use Scenario: Adding isolated digital I/O channels to programmable logic controllers using RS-485 or CAN physical layers. IC Role / Device Role / Timing Role: FPGA acts as protocol translator and real-time I/O controller, managing timing-critical sampling and output update cycles. Use Value: XC3S400-4FT256I provides sufficient logic for custom state machines and 216 I/O pins for parallel sensor/actuator interfacing without external glue logic. | Use Scenario: Bridging ISA or PCI bus signals to modern microcontrollers or FPGAs in equipment upgrade projects. IC Role / Device Role / Timing Role: FPGA implements cycle-accurate address decoding, wait-state insertion, and data-width conversion between mismatched buses. Use Value: XC3S400-4FT256I delivers deterministic timing response and supports multiple I/O voltage standards required for legacy bus signaling levels. |
| Video Signal Formatter | Test Equipment Pattern Generator |
Use Scenario: Converting raw CMOS image sensor output (e.g., 10-bit parallel, 25 MHz pixel clock) into standardized BT.656 or HDMI-compatible streams. IC Role / Device Role / Timing Role: FPGA performs pixel clock domain crossing, line buffering, and protocol packetization with sub-cycle timing precision. Use Value: XC3S400-4FT256I includes 176 Kbits of block RAM for frame-line buffering and DCMs to generate precise video timing clocks. | Use Scenario: Generating synchronized digital stimulus waveforms for IC functional testing or board-level validation. IC Role / Device Role / Timing Role: FPGA serves as high-speed pattern sequencer with deterministic pin toggling and precise edge placement. Use Value: XC3S400-4FT256I supports 333 Mbps I/O rates and offers 8,064 logic cells to implement complex vector memory and state-based test sequences. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S500E-4FT256C | Higher logic density (11,648 CLBs), same package and speed grade; includes enhanced DCM features and larger block RAM (360 Kbits) | Better suited for designs requiring more combinatorial logic or deeper memory buffers | Select when XC3S400-4FT256I resource utilization exceeds 85% or additional block RAM is needed |
| XC3S200-4FT256I | Lower logic density (4,320 CLBs), same package and speed grade; reduced block RAM (128 Kbits) and fewer DCMs (2 units) | Appropriate for simpler control logic with fewer I/O constraints or lower gate count requirements | Choose if design fits within smaller resource budget and cost reduction is prioritized over headroom |
Compared with XC3S500E-4FT256C and XC3S200-4FT256I, the XC3S400-4FT256I offers balanced logic, I/O, and memory resources for mid-complexity bridging and control tasks-avoiding overdesign while maintaining margin for future feature additions.
Availability
XC3S400-4FT256I is available at Aetrix Electronics and suitable for industrial automation, test instrumentation, and legacy system upgrades requiring stable component supply and long-term design continuity.
Supply support for XC3S400-4FT256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now oversees the Spartan family as part of its adaptive computing portfolio. Xilinx originally developed Spartan FPGAs for cost-optimized, high-volume applications.
The Spartan-3 family-including XC3S400-4FT256I-was designed for embedded control, interface bridging, and digital logic replacement where performance-per-dollar and ease of integration outweigh advanced features like built-in processors or high-speed transceivers.
FAQ
What is the operating voltage range for XC3S400-4FT256I core and I/O supplies?
The XC3S400-4FT256I requires VCCINT = 1.2 V ±3% for core logic operation. Each I/O bank supports independent VCCO settings from 1.2 V to 3.3 V, enabling mixed-voltage interface design. Unused I/O banks must still be powered; floating VCCO is not permitted per Xilinx DS099 specification.
Does XC3S400-4FT256I support JTAG boundary-scan testing in-system?
Yes, XC3S400-4FT256I fully complies with IEEE 1149.1 and supports in-system JTAG boundary-scan testing via TCK, TMS, TDI, and TDO pins. No external pull-up resistors are required on these pins, and the TDO pin is three-state controlled by TMS during instruction decoding.
Can XC3S400-4FT256I be reconfigured in the field without power cycling?
Yes, XC3S400-4FT256I supports partial reconfiguration and serial reconfiguration via the SelectMAP or slave serial interface. Full reconfiguration requires asserting PROGRAM_B, but does not mandate full power cycle-only configuration memory reset and reload of the bitstream.
What configuration modes are supported by XC3S400-4FT256I?
XC3S400-4FT256I supports Master Serial (using XCFxxP PROM), Slave Serial, Slave SelectMAP, and JTAG configuration modes. The mode is selected by hardware strapping pins (M0–M2) at power-on; no software control of mode selection is available after startup.
Is XC3S400-4FT256I RoHS compliant and lead-free?
Yes, XC3S400-4FT256I is RoHS compliant and manufactured with lead-free (Pb-free) packaging per Xilinx document DS099 v2.5. The FT256 package uses matte tin finish on solder balls and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) requirements.
XC3S400-4FT256I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3
- Package/Case:
- 256-LBGA
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 896
- Number of Logic Elements/Cells:
- 8064
- Total RAM Bits:
- 294912
- Number of I/O:
- 173
- Number of Gates:
- 400000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC3S400-4FT256I FAQ
1.How can I place an order for XC3S400-4FT256I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S400-4FT256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S400-4FT256I reliable?
The price and inventory of XC3S400-4FT256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S400-4FT256I is usually 5 days.
3.What payment methods are accepted for XC3S400-4FT256I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S400-4FT256I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S400-4FT256I?
XC3S400-4FT256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S400-4FT256I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S400-4FT256I?
For technical support, including XC3S400-4FT256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S400-4FT256I requirements.
6.How does Aetrix verify that XC3S400-4FT256I is sourced from the original manufacturer or authorized distributors?
All XC3S400-4FT256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S400-4FT256I meets industry standards.
7.What is the process for return or replacement of XC3S400-4FT256I?
All XC3S400-4FT256I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S400-4FT256I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S400-4FT256I part is unused and in its original packaging.
Return procedure for XC3S400-4FT256I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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