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AMD XC3S400-4FTG256C
- Part No.:
- XC3S400-4FTG256C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC3S400-4FTG256C.pdf
- Description:
- IC FPGA 173 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,584
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Product details
Overview
XC3S400-4FTG256C from AMD (formerly Xilinx) is a Spartan-3 FPGA with 400,000 system gates, 241 I/O pins, and configured in a 256-pin Fine-Pitch Thin Quad Flatpack (FTBGA) package. It integrates up to 8,064 logic cells, 720 Kbits of block RAM, and supports LVCMOS25/LVCMOS33 I/O standards for embedded control and interface bridging applications.
For engineers reviewing the XC3S400-4FTG256C datasheet, pinout, applications, or equivalent options, key selection factors include logic density, I/O voltage flexibility, internal RAM capacity, and supported configuration modes (JTAG, Master Serial, Slave SelectMAP).
Technical Context
The XC3S400-4FTG256C implements a hierarchical architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated multipliers. It supports clock management via Digital Clock Managers (DCMs) with phase shifting and frequency synthesis capabilities up to 280 MHz input and 320 MHz output.
Configuration is performed through boundary-scan (JTAG), serial PROM (Master Serial), or parallel slave mode. The device uses 1.2 V core voltage and supports 3.3 V or 2.5 V I/O banks with programmable drive strength and slew rate control.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 8,064 - provides combinational and sequential logic resources for medium-complexity digital control and protocol implementation |
| System Gates | 400,000 - indicates total equivalent gate count for logic synthesis and resource estimation |
| I/O Pins | 241 - supports high-pin-count peripheral interfacing with bank-wise voltage and standard assignment |
| Block RAM | 720 Kbits - enables on-chip data buffering, FIFOs, and small lookup tables without external memory |
| DCM Frequency Range | 24–280 MHz input / up to 320 MHz output - allows precise clock deskew, multiplication, and phase alignment |
| Core Voltage | 1.2 V ±3% - defines power delivery requirements and thermal design constraints |
| I/O Standards | LVCMOS25, LVCMOS33, LVTTL, PCI - enables direct interfacing with common microcontrollers, memories, and buses |
Pinout & Package
XC3S400-4FTG256C is housed in a 256-ball Fine-Pitch Thin Ball Grid Array (FTBGA) package with 1.0 mm ball pitch and 17 × 17 array layout. Thermal pad exposed on underside requires solder paste stencil design per Xilinx DS099.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 supply - must be decoupled locally for signal integrity in 3.3 V or 2.5 V operation |
| D2 | IO_L1P_0 | Programmable I/O - supports differential pair when paired with D1 (IO_L1N_0) |
| E3 | CLK0 | Primary global clock input - routed to all DCMs and global clock networks |
| J15 | M0 | Configuration mode select - sets Master Serial mode when pulled High during power-up |
| T14 | TCK | JTAG test clock - required for boundary-scan programming and debug access |
| R15 | INIT_B | Open-drain status output - asserts Low during configuration failure or CRC error |
Key Features
| Feature | Design Value |
|---|---|
| Digital Clock Manager (DCM) | Two DCMs per device - provide jitter-free clock synthesis, phase shift, and duty cycle correction without external PLLs |
| SelectIO Technology | Per-bank I/O voltage support - allows mixed-voltage interfaces (e.g., 3.3 V CPU + 2.5 V memory) on same device |
| Configurable Logic Blocks | Each CLB contains two slices with four LUTs and eight flip-flops - enables efficient mapping of synchronous state machines and arithmetic pipelines |
| Embedded Multipliers | 18 × 18 signed multipliers - accelerate DSP functions such as FIR filtering and motor control algorithms |
| Boundary-Scan Support | IEEE 1149.1 compliant - enables PCB-level interconnect testing and in-system programming |
Applications
| Industrial PLC I/O Module | Video Interface Bridge |
|---|---|
Use Scenario: Real-time digital I/O expansion with fieldbus communication (Profibus, CANopen) and safety monitoring logic. IC Role / Device Role / Timing Role: FPGA acts as protocol translator and deterministic logic sequencer, synchronizing sensor inputs and actuator outputs using DCM-derived clocks. Use Value: Enables deterministic <1 µs I/O response latency and concurrent handling of 64+ discrete channels without host CPU intervention. | Use Scenario: Converting RGB parallel video from image sensors to MIPI CSI-2 serial stream for SoC ingestion. IC Role / Device Role / Timing Role: FPGA serves as pixel-clock domain adapter and packetizer, managing timing skew between asynchronous sensor clock and MIPI reference clock. Use Value: Provides 720p@60fps bridging with sub-pixel alignment accuracy using internal block RAM for line buffering and DCM-based clock recovery. |
| Medical Imaging Data Acquisition | Test Equipment Pattern Generator |
Use Scenario: Digitizing analog signals from ultrasound transducer arrays with time-gated sampling and beamforming preprocessing. IC Role / Device Role / Timing Role: FPGA performs real-time FIR filtering, delay compensation, and channel multiplexing prior to ADC data streaming to host. Use Value: Delivers 12-bit, 40 MSPS per-channel acquisition with <±0.5 LSB integral nonlinearity using distributed RAM-based coefficient storage. | Use Scenario: Generating high-speed, programmable digital stimulus waveforms for IC functional validation and ATE systems. IC Role / Device Role / Timing Role: FPGA operates as deterministic pattern engine with synchronized multi-channel output and precise edge placement. Use Value: Supports 100+ MHz vector rates with <100 ps channel-to-channel skew using dedicated routing and DCM-aligned output registers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic and interface bridging applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S500E-4FG320C | Higher logic density (11,648 CLBs), 320-pin FBGA, 1.2 V core, same architecture | Supports larger state machines and deeper pipeline stages; requires PCB redesign due to different footprint | Choose when additional logic resources or more I/Os are needed beyond XC3S400-4FTG256C capacity |
| XC6SLX45-3CSG324C | Spartan-6 family; 43,661 logic cells, 2.5 V core, enhanced DSP slices, lower static power | Better suited for low-power portable instrumentation; not pin-compatible and requires HDL re-synthesis | Choose for new designs requiring higher performance per watt and integrated PCIe endpoint capability |
Compared with XC3S400-4FTG256C, XC3S500E-4FG320C offers scalable logic headroom within the same generation, while XC6SLX45-3CSG324C delivers architectural improvements including hardened memory controllers and lower dynamic power - both require board and firmware adaptation.
Availability
XC3S400-4FTG256C is available at Aetrix Electronics and suitable for industrial automation, medical instrumentation, and test equipment requiring stable component supply across extended product lifecycles.
Supply support for XC3S400-4FTG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, embedded, and edge applications.
The Spartan-3 family was designed for cost-sensitive, high-volume applications requiring reliable logic density, flexible I/O, and mature toolchain support - particularly in industrial control and legacy interface consolidation.
FAQ
What is the maximum operating frequency of the XC3S400-4FTG256C?
The XC3S400-4FTG256C supports internal logic operation up to 280 MHz, with Digital Clock Managers (DCMs) capable of generating output clocks up to 320 MHz. Actual achievable frequency depends on design complexity, routing, and timing closure. The -4 speed grade guarantees timing compliance for designs meeting specified path delays under worst-case voltage and temperature conditions. XC3S400-4FTG256C timing reports are generated using Xilinx ISE 14.7 tools with default PVT corners.
Does the XC3S400-4FTG256C support JTAG programming?
Yes, the XC3S400-4FTG256C fully supports IEEE 1149.1 JTAG boundary-scan for configuration, debugging, and verification. Pins TCK, TMS, TDI, and TDO are dedicated for this interface and operate at 3.3 V. JTAG mode is enabled by default at power-up unless overridden by M[2:0] configuration pins. XC3S400-4FTG256C configuration bitstreams can be loaded via iMPACT or Vivado Hardware Manager using standard JTAG cables.
What I/O standards are supported by the XC3S400-4FTG256C?
The XC3S400-4FTG256C supports LVCMOS33, LVCMOS25, LVTTL, PCI, and HSTL Class I across its 241 user I/O pins. Each I/O bank is independently configurable for voltage level and standard. Drive strength (2 mA to 24 mA) and slew rate (slow/fast) are programmable per pin. XC3S400-4FTG256C does not support SSTL or differential standards beyond LVDS (via SelectIO emulation).
Is the XC3S400-4FTG256C RoHS compliant?
Yes, the XC3S400-4FTG256C is RoHS-6 compliant and lead-free, with matte tin finish on all package balls. It meets EU Directive 2011/65/EU and is marked with the RoHS symbol on the top-side laser marking. The FTBGA256 package uses halogen-free molding compound. XC3S400-4FTG256C conforms to IPC/JEDEC J-STD-020D moisture sensitivity level 3 (MSL3) handling requirements.
Can the XC3S400-4FTG256C be used in new designs today?
While the XC3S400-4FTG256C is a mature, discontinued Spartan-3 device, it remains available through authorized distributors and Aetrix Electronics for legacy system maintenance and long-lifecycle industrial deployments. New designs should consider Spartan-6 or Artix-7 alternatives for extended support and enhanced features. XC3S400-4FTG256C continues to be supported by Xilinx ISE 14.7 toolchain and verified IP cores.
XC3S400-4FTG256C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 896
- Number of Logic Elements/Cells:
- 8064
- Total RAM Bits:
- 294912
- Number of I/O:
- 173
- Number of Gates:
- 400000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC3S400-4FTG256C FAQ
1.How can I place an order for XC3S400-4FTG256C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S400-4FTG256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S400-4FTG256C reliable?
The price and inventory of XC3S400-4FTG256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S400-4FTG256C is usually 5 days.
3.What payment methods are accepted for XC3S400-4FTG256C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S400-4FTG256C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S400-4FTG256C?
XC3S400-4FTG256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S400-4FTG256C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S400-4FTG256C?
For technical support, including XC3S400-4FTG256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S400-4FTG256C requirements.
6.How does Aetrix verify that XC3S400-4FTG256C is sourced from the original manufacturer or authorized distributors?
All XC3S400-4FTG256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S400-4FTG256C meets industry standards.
7.What is the process for return or replacement of XC3S400-4FTG256C?
All XC3S400-4FTG256C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S400-4FTG256C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S400-4FTG256C part is unused and in its original packaging.
Return procedure for XC3S400-4FTG256C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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