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AMD XC3S400-4TQ144C
- Part No.:
- XC3S400-4TQ144C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 144-LQFP
- Datasheet:
-
XC3S400-4TQ144C.pdf
- Description:
- IC FPGA 97 I/O 144TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,119
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Product details
Overview
XC3S400-4TQ144C from AMD (formerly Xilinx) is a Spartan-3 FPGA with 400,000 system gates, 144-pin TQFP package, -4 speed grade, and commercial temperature range (0°C to 85°C). It integrates 8,064 logic cells, 288 Kbits of block RAM, and supports LVCMOS25/LVCMOS33 I/O standards for embedded control and interface bridging applications.
For engineers reviewing the XC3S400-4TQ144C datasheet, pinout, applications, or equivalent options, key selection factors include logic density, I/O voltage compatibility, configuration mode support (Master Serial, Slave Parallel), and availability of dedicated DSP slices for low-latency arithmetic.
Technical Context
The XC3S400-4TQ144C implements a configurable logic fabric based on 4-input LUTs and distributed RAM, with eight global clock networks and digital clock managers (DCMs) supporting frequency synthesis, phase shifting, and duty-cycle correction. It supports JTAG boundary-scan testing and in-system configuration via SPI flash or microprocessor.
Configuration is performed through SelectMAP, Master Serial, or Slave Parallel modes using internal startup sequences. The device includes 24 multipliers (18×18-bit), 128 user I/O pins, and supports differential signaling standards including LVDS and RSDS at up to 622 Mbps.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 8,064 - provides combinational and sequential logic capacity for medium-complexity digital controllers |
| System Gates | 400,000 - indicates total equivalent ASIC gate count for architectural sizing |
| Block RAM | 288 Kbits - supports FIFOs, buffers, and small lookup tables without external memory |
| I/O Pins | 128 - enables high-channel-count peripheral interfacing with programmable drive strength |
| Speed Grade | -4 - guarantees timing closure up to 333 MHz for critical paths in synchronous designs |
| Operating Temp | 0°C to 85°C - validated for commercial-grade industrial control and test equipment environments |
| Configuration Mode | Master Serial / Slave Parallel / SelectMAP - allows flexible boot sources including SPI flash or host processor |
Pinout & Package
144-pin Thin Quad Flat Pack (TQFP), 20 mm × 20 mm, 0.5 mm pitch, thermally enhanced with exposed pad (non-electrical).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P1 | PROGRAM_B | Active-low asynchronous reset that reloads configuration from external source |
| P2 | TCK | JTAG test clock input for boundary-scan and debug access |
| P3 | TMS | JTAG test mode select controlling state machine transitions |
| P4 | TDI | JTAG test data input for instruction and configuration data loading |
| P5 | TDO | JTAG test data output for readback and verification |
| P6–P133 | IO_Lxx | Configurable bidirectional I/O banks supporting multiple voltage standards |
| P134–P144 | VCCO / GND / VCCAUX | Power supply terminals per bank and auxiliary 2.5 V core logic rail |
Key Features
| Feature | Design Value |
|---|---|
| Digital Clock Managers (DCMs) | Two DCMs provide jitter reduction, frequency synthesis, and phase alignment without external PLL components |
| Embedded Multipliers | 24 dedicated 18×18-bit two's complement multipliers enable real-time filtering and motor control math |
| SelectIO Technology | Programmable I/O standards including LVCMOS, LVTTL, PCI, and differential LVDS reduce level-shifting circuitry |
| Configuration Security | Bitstream encryption option prevents reverse engineering of programmed logic functionality |
| Partial Reconfiguration Support | Enables dynamic logic module swapping during operation for adaptive system behavior |
Applications
| Industrial PLC I/O Module | Video Interface Bridge |
|---|---|
Use Scenario: Real-time digital signal conditioning and protocol translation between fieldbus sensors and HMI controllers. IC Role / Device Role / Timing Role: FPGA acts as deterministic logic engine with sub-microsecond I/O response and synchronized DCM-controlled timing domains. Use Value: Eliminates need for discrete glue logic and custom ASICs while supporting field-upgradable firmware-defined I/O mapping. | Use Scenario: Converting parallel RGB video streams to serialized LVDS or FPD-Link for display panels in medical imaging systems. IC Role / Device Role / Timing Role: Timing-critical pixel data serializer with DCM-synchronized clock domain crossing and embedded frame buffering. Use Value: Enables compact, low-power video interface design with no external timing ICs or FIFOs required. |
| Test Equipment Pattern Generator | Communications Protocol Converter |
Use Scenario: Generating precise digital stimulus waveforms for semiconductor ATE and board-level functional test. IC Role / Device Role / Timing Role: High-speed pattern sequencer with deterministic timing control via DCM outputs and internal block RAM waveform storage. Use Value: Delivers repeatable nanosecond-accurate edge placement without external delay generators or clock synthesizers. | Use Scenario: Translating Modbus RTU over RS-485 to TCP/IP Ethernet in smart grid gateway devices. IC Role / Device Role / Timing Role: Dual-protocol state machine executor with UART-to-MAC layer bridging and packet buffering in block RAM. Use Value: Reduces BOM cost by consolidating protocol handling into single reconfigurable logic fabric instead of dual MCU + PHY solution. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S500E-4TQ144C | Higher logic density (12,288 LCs), same package and speed grade, enhanced DCM features | Better suited for designs requiring larger state machines or additional embedded peripherals | Choose when future scalability or added block RAM (360 Kbits) is needed without PCB change |
| XC6SLX45-2CSG324C | Next-generation Spartan-6 architecture, 43,661 logic cells, 2.5 V core, smaller 19×19 mm CSBGA324 package | Requires layout revision but offers lower static power and integrated PCIe endpoint blocks | Prefer for new designs targeting longer lifecycle, higher integration, or PCIe connectivity |
Compared with XC3S400-4TQ144C, XC3S500E-4TQ144C delivers immediate density headroom in identical footprint, while XC6SLX45-2CSG324C enables architectural upgrades including hardened memory controllers and lower-power operation-both require evaluation against timing closure, toolchain support, and legacy IP reuse constraints.
Availability
XC3S400-4TQ144C is available at Aetrix Electronics and suitable for industrial automation, test instrumentation, and video interface bridging requiring stable component supply across extended production cycles.
Supply support for XC3S400-4TQ144C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for heterogeneous acceleration.
The Spartan-3 family was designed for cost-sensitive, high-volume applications requiring reliable programmable logic with predictable timing and broad I/O flexibility.
FAQ
What is the maximum operating frequency supported by XC3S400-4TQ144C?
The XC3S400-4TQ144C has a -4 speed grade, guaranteeing timing closure for critical paths up to 333 MHz under commercial conditions. Actual achievable frequency depends on design topology, routing, and DCM usage. The device includes two Digital Clock Managers capable of generating and stabilizing clocks within this range, and its logic cell delay is characterized to meet this specification across voltage and temperature.
Does XC3S400-4TQ144C support JTAG programming and debugging?
Yes, XC3S400-4TQ144C fully supports IEEE 1149.1 JTAG boundary-scan for programming, debugging, and verification. Pins TCK, TMS, TDI, and TDO are dedicated for this purpose and are accessible in the 144-pin TQFP package. JTAG enables in-system configuration, readback of configuration status, and hardware-level diagnostics without requiring external programming hardware beyond standard debug probes.
Can XC3S400-4TQ144C be configured from SPI flash memory?
Yes, XC3S400-4TQ144C supports Master Serial configuration mode, allowing direct boot from industry-standard SPI serial flash devices. This eliminates the need for an external microcontroller or configuration controller. The FPGA initiates the read sequence automatically after power-up or PROGRAM_B assertion, loading bitstream data through the DIN pin using the internal oscillator as clock source.
What I/O standards are supported by XC3S400-4TQ144C?
XC3S400-4TQ144C supports LVCMOS18, LVCMOS25, LVCMOS33, LVTTL, PCI, and differential standards including LVDS and RSDS across its 128 user I/O pins. Each I/O bank is independently powered, enabling mixed-voltage operation. Drive strength, slew rate, and pull-up/pull-down resistors are programmable per pin, allowing optimization for noise immunity and signal integrity in diverse interface scenarios.
Is XC3S400-4TQ144C still in active production?
No, XC3S400-4TQ144C is discontinued by AMD (formerly Xilinx) and no longer in active production. However, Aetrix Electronics maintains verified legacy inventory with full traceability and supports long-term supply through controlled allocation, obsolescence mitigation planning, and cross-reference guidance for migration paths such as Spartan-6 or Artix-7 families where appropriate.
XC3S400-4TQ144C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3
- Package/Case:
- 144-LQFP
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 896
- Number of Logic Elements/Cells:
- 8064
- Total RAM Bits:
- 294912
- Number of I/O:
- 97
- Number of Gates:
- 400000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 144-TQFP (20x20)
XC3S400-4TQ144C FAQ
1.How can I place an order for XC3S400-4TQ144C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S400-4TQ144C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S400-4TQ144C reliable?
The price and inventory of XC3S400-4TQ144C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S400-4TQ144C is usually 5 days.
3.What payment methods are accepted for XC3S400-4TQ144C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S400-4TQ144C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S400-4TQ144C?
XC3S400-4TQ144C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S400-4TQ144C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S400-4TQ144C?
For technical support, including XC3S400-4TQ144C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S400-4TQ144C requirements.
6.How does Aetrix verify that XC3S400-4TQ144C is sourced from the original manufacturer or authorized distributors?
All XC3S400-4TQ144C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S400-4TQ144C meets industry standards.
7.What is the process for return or replacement of XC3S400-4TQ144C?
All XC3S400-4TQ144C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S400-4TQ144C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S400-4TQ144C part is unused and in its original packaging.
Return procedure for XC3S400-4TQ144C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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