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AMD XC3S400-4TQG144C

Part No.:
XC3S400-4TQG144C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
144-LQFP
Datasheet:
AetrixXC3S400-4TQG144C.pdf
Description:
IC FPGA 97 I/O 144TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:5,041

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Product details

Overview

XC3S400-4TQG144C from AMD is an FPGA orderable option positioned for configurable logic, memory-side control, and digital interface concentration in embedded systems. By pairing the Spartan-3 architecture with the 144-LQFP package, which keeps assembly and board escape more familiar in legacy FPGA designs, the device helps preserve programmable logic flexibility in systems that continue to rely on a proven AMD/Xilinx FPGA path.

Spartan-3 devices extend cost-sensitive FPGA capability with embedded memory resources, higher logic integration, and broader package flexibility for embedded digital systems. For engineers reviewing the XC3S400-4TQG144C datasheet, XC3S400-4TQG144C pinout, XC3S400-4TQG144C application, or XC3S400-4TQG144C equivalent, this device is widely used in embedded control platforms, industrial boards, communications hardware, digital interface modules, subsystem glue-logic replacements, and long-life programmable hardware programs.

Technical Context

In practical deployments, XC3S400-4TQG144C is chosen for how its exact FPGA density, speed grade 4 orderable option., and package align with the logic partition, routing plan, and board constraints of the target design. For many of these devices, package continuity and qualification suffix are just as important as raw logic resources.

The orderable code matters because 144-LQFP affects assembly style and I/O breakout, while the commercial temperature option indicated by the suffix. determines whether the part fits the intended deployment range. In sustaining or lifecycle-sensitive programs, those details often drive whether a specific orderable option can be released into production or service stock.

Higher Spartan-3 density point for embedded subsystem consolidation and wider programmable logic demands. In practice, this means XC3S400-4TQG144C is typically selected when the hardware still needs FPGA-based control, timing coordination, memory-side logic, or programmable interface support without forcing a platform migration to a newer architecture.

Key Specifications

Parameter Value and Actual Design Meaning
Device Type Spartan-3 FPGA.
Series Spartan-3
Package 144-LQFP package with tray packing.
Speed Grade Speed grade 4 orderable option.
Operating Range Commercial temperature option indicated by the suffix.
Architecture Role FPGA platform for configurable digital logic, subsystem integration, and programmable interface behavior.
System Positioning Used in embedded and sustaining designs that continue to depend on established FPGA footprints and validation paths.
Configuration Model SRAM-based programmable logic device within the referenced AMD/Xilinx FPGA family.

Pinout & Package

The XC3S400-4TQG144C pinout includes programmable user I/O, configuration access, dedicated clocking resources, and the required power and ground rails inside the 144-LQFP package option.

For PCB work, the key concerns are package-compatible routing, configuration method continuity, power-rail integrity, and preserving the validated I/O assignment strategy already used by the target platform.

Pin / Function PCB Design and Circuit Role
User I/O Pins Programmable logic pins used for digital interfaces, control signals, timing functions, and board-level subsystem connectivity.
Clock Inputs Support synchronous FPGA operation and timing distribution across the design.
Configuration Pins Used for initialization, programming, and configuration management.
Power Rails Provide the required supply domains for core logic, auxiliary functions, and I/O banks.
Ground Pins Support return-current integrity and stable programmable logic operation.

Key Features

  • Field-programmable logic supports subsystem updates without redesigning fixed-function hardware.
  • Package and suffix options help align the part with board-level qualification and assembly needs.
  • Useful in long-life and sustaining programs that still depend on established FPGA footprints.
  • Supports digital interface concentration, control logic, and embedded subsystem integration.
  • Preserves programmable behavior in systems where platform migration would add validation cost.
  • Applicable across industrial, embedded, and legacy communications hardware environments.

Applications

Embedded Control Boards Industrial and Service-Life Platforms

Use Scenario: Used in systems that need FPGA-based digital control, sequencing, or board-specific logic behavior.

IC Role: Acts as the programmable logic layer inside an embedded hardware platform.

Use Value: Improves flexibility while preserving an established board architecture.

Use Scenario: Used in long-life industrial hardware and maintenance builds that still depend on validated FPGA footprints.

IC Role: Maintains the configurable logic role inside a sustained product family.

Use Value: Supports lifecycle continuity and serviceability.

Communications and Interface Modules Legacy System Upkeep

Use Scenario: Used in hardware that needs programmable interface handling, timing alignment, or local digital adaptation.

IC Role: Implements adaptable logic around interface and transport functions.

Use Value: Helps keep subsystem behavior programmable without major redesign.

Use Scenario: Used when engineering teams must keep older programmable hardware in production or repair channels.

IC Role: Preserves the logic role originally assigned to the FPGA device.

Use Value: Reduces disruption in sustaining engineering and replacement workflows.

Equivalent & Alternatives

When evaluating a XC3S400-4TQG144C equivalent, engineers should compare FPGA family generation, package continuity, speed grade, operating range, logic density, and the level of redesign the system can accept.

Alternative Part Technical Difference Application Difference Selection Advice
XC3S400-4FTG256C Closely related orderable option in the same or neighboring AMD/Xilinx FPGA family with a comparable system role. Used when the platform should remain close to the same density or package strategy. Compare package, suffix, and timing margin before substitution.
XC3S1000-4FTG256C Alternative programmable logic option that may fit a similar role with a different density or family emphasis. Used when the design can consider a nearby logic class or updated footprint path. Choose according to board fit, platform continuity, and validation scope.

Compared with XC3S400-4FTG256C, XC3S400-4TQG144C selection depends on exact package continuity, speed grade, and environmental suffix. XC3S400-4TQG144C vs XC3S1000-4FTG256C selection depends on whether the system should remain on the same FPGA path or shift to a nearby family or density with different integration tradeoffs.

Quality

XC3S400-4TQG144C should be sourced as original AMD/Xilinx programmable logic inventory through traceable channels. Quality checks may include package inspection, marking validation, configuration-access checks, and board-level replacement verification.

For lifecycle-sensitive programs, validation should include configuration bring-up, timing confirmation, power-sequencing review, and interface checks against the target implementation.

Availability

XC3S400-4TQG144C is relevant to embedded programmable logic, subsystem integration, and lifecycle-sensitive FPGA deployments where configurable digital behavior must be preserved.

Supply support may include volume procurement planning, scheduled delivery arrangements, traceable sourcing management, and long-term supply support for OEM, industrial electronics, automotive electronics, and embedded product programs. Sample and NPI supply support, as well as urgent in-stock supply support, can also be arranged for prototype builds, pilot runs, and time-critical production needs.

For production and service builds, confirming package continuity, lifecycle status, configuration compatibility, and sourcing stability helps reduce programmable-logic supply risk.

Manufacturer

AMD is a semiconductor manufacturer whose adaptive computing and programmable logic portfolio includes FPGA devices, CPLDs, configuration solutions, embedded processing platforms, and related development technologies for industrial, communication, computing, automotive, and embedded electronic systems.

Spartan-3 devices extend cost-sensitive FPGA capability with embedded memory resources, higher logic integration, and broader package flexibility for embedded digital systems. Higher Spartan-3 density point for embedded subsystem consolidation and wider programmable logic demands.

FAQ

What is XC3S400-4TQG144C used for?

XC3S400-4TQG144C is used for programmable digital logic, interface handling, timing coordination, and subsystem integration in embedded FPGA-based hardware.

Where can I find the XC3S400-4TQG144C datasheet download?

The XC3S400-4TQG144C datasheet is available through the confirmed source used for this AMD/Xilinx FPGA family and orderable option.

What should be considered in XC3S400-4TQG144C pinout design?

Designers should preserve package compatibility, power domains, configuration access, and validated I/O assignment when integrating or replacing the device.

Is XC3S400-4TQG144C aimed at new designs or sustaining designs?

XC3S400-4TQG144C can serve both, but many orderable options in this range are especially relevant to sustaining, compatibility-driven, or lifecycle-sensitive FPGA programs.

What are common XC3S400-4TQG144C equivalent solutions?

Common candidates include XC3S400-4FTG256C and XC3S1000-4FTG256C depending on package fit, family generation, logic density, and platform continuity goals.

XC3S400-4TQG144C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Spartan®-3
Package/Case:
144-LQFP
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
896
Number of Logic Elements/Cells:
8064
Total RAM Bits:
294912
Number of I/O:
97
Number of Gates:
400000
Voltage - Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
144-TQFP (20x20)

XC3S400-4TQG144C FAQ

1.How can I place an order for XC3S400-4TQG144C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC3S400-4TQG144C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC3S400-4TQG144C reliable?

The price and inventory of XC3S400-4TQG144C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S400-4TQG144C is usually 5 days.

3.What payment methods are accepted for XC3S400-4TQG144C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S400-4TQG144C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC3S400-4TQG144C?

XC3S400-4TQG144C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC3S400-4TQG144C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC3S400-4TQG144C?

For technical support, including XC3S400-4TQG144C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S400-4TQG144C requirements.

6.How does Aetrix verify that XC3S400-4TQG144C is sourced from the original manufacturer or authorized distributors?

All XC3S400-4TQG144C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S400-4TQG144C meets industry standards.

7.What is the process for return or replacement of XC3S400-4TQG144C?

All XC3S400-4TQG144C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S400-4TQG144C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC3S400-4TQG144C part is unused and in its original packaging.

Return procedure for XC3S400-4TQG144C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC3S400-4TQG144C Tags

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