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AMD XC3S400-4TQG144C
- Part No.:
- XC3S400-4TQG144C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 144-LQFP
- Datasheet:
-
XC3S400-4TQG144C.pdf
- Description:
- IC FPGA 97 I/O 144TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:5,041
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Product details
Overview
XC3S400-4TQG144C from AMD (formerly Xilinx) is a Spartan-3 FPGA with 400,000 system gates, 144-pin TQFP package, -4 speed grade, and commercial temperature range (0°C to 85°C). It integrates 8,064 logic cells, 288 Kbits of block RAM, and supports LVCMOS25/LVCMOS33 I/O standards for embedded control and interface bridging applications.
For engineers reviewing the XC3S400-4TQG144C datasheet, pinout, applications, or equivalent options, key selection factors include logic density, I/O voltage compatibility, embedded RAM capacity, and TQFP thermal performance in space-constrained industrial controllers.
Technical Context
The XC3S400-4TQG144C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated multipliers. It supports SelectIO technology with programmable slew rate and drive strength per bank, and includes Digital Clock Managers (DCMs) for clock synthesis and phase alignment.
Configuration is performed via Master Serial mode using external PROM or JTAG boundary-scan. The device requires separate VCCINT (1.2 V) and VCCO (1.2–3.3 V) supplies, with I/O banks independently configurable for mixed-voltage operation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 8,064 - provides combinational and sequential logic resources for medium-complexity digital control functions |
| Block RAM | 288 Kbits - enables on-chip data buffering, FIFOs, and small lookup tables without external memory |
| I/O Pins | 118 user I/O - supports parallel bus interfacing, sensor aggregation, and multi-protocol GPIO expansion |
| Speed Grade | -4 - guarantees timing closure up to 280 MHz for critical paths in synchronous designs |
| Supply Voltages | VCCINT = 1.2 V, VCCO = 1.2–3.3 V - allows direct interfacing with legacy 3.3 V peripherals and modern low-voltage logic |
| Operating Temp | 0°C to +85°C - qualified for commercial-grade industrial automation and test equipment environments |
Pinout & Package
XC3S400-4TQG144C is housed in a 144-lead Thin Quad Flat Package (TQFP) with 0.5 mm pitch, 20 mm × 20 mm body size, and exposed thermal pad for enhanced power dissipation in continuous operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.2 V core supply input for CLB and routing fabric - must be locally decoupled |
| P2 | VCCO_0 | 3.3 V I/O supply for Bank 0 - sets output voltage level and input threshold for pins in that bank |
| T14 | PROGRAM_B | Active-low configuration initiation signal - pulls low to reset and reload bitstream from PROM |
| R13 | DONE | Open-drain status output - goes high when configuration completes and device enters user mode |
| H13 | CCLK | Configuration clock input - driven externally during Master Serial mode or internally by DCM during JTAG |
Key Features
| Feature | Design Value |
|---|---|
| Digital Clock Manager (DCM) | Two DCMs provide jitter-reduced clock synthesis, 90° phase shift, and frequency doubling for precise timing control |
| SelectIO Technology | Per-bank I/O voltage and standard selection enables mixed-signal interfacing without level shifters |
| Embedded Multipliers | Four 18×18-bit multipliers support real-time DSP tasks such as motor control loop computation |
| Boundary-Scan Support | IEEE 1149.1-compliant JTAG TAP enables in-system programming and board-level diagnostics |
Applications
| Industrial PLC I/O Module | Automated Test Equipment (ATE) Interface |
|---|---|
Use Scenario: Real-time digital signal conditioning and protocol translation between field sensors and host controller. IC Role / Device Role / Timing Role: FPGA acts as reconfigurable logic engine handling parallel input sampling, debounce, and RS-485/Modbus framing. Use Value: 118 user I/O and 288 Kbits block RAM enable simultaneous monitoring of 48 discrete inputs with local history buffering. | Use Scenario: High-speed stimulus generation and response capture across multiple DUT interfaces. IC Role / Device Role / Timing Role: Timing-critical pattern generator with sub-cycle precision using DCM-derived clocks and distributed RAM-based waveform storage. Use Value: -4 speed grade ensures deterministic 280 MHz timing for 100+ Mbps digital vector sequencing. |
| Medical Imaging Front-End | Communications Baseband Processing |
Use Scenario: Synchronization and preprocessing of analog-to-digital data streams from ultrasound transducer arrays. IC Role / Device Role / Timing Role: Data path controller managing ADC interface, channel gain correction, and FIR filtering pipeline. Use Value: Four embedded 18×18 multipliers execute real-time beamforming coefficients with single-cycle latency. | Use Scenario: Protocol adaptation between baseband processor and RF front-end ICs in wireless infrastructure. IC Role / Device Role / Timing Role: Reconfigurable bridge implementing CPRI, JESD204B, or custom serial protocols with elastic buffers. Use Value: Independent I/O banks allow concurrent 1.8 V JESD204B receiver and 3.3 V SPI configuration interface. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S500E-4TQG144C | Higher logic density (11,648 CLBs), same package and speed grade, but larger block RAM (360 Kbits) | Better suited for designs requiring deeper FIFOs or more complex state machines | Select when additional logic resources are needed without changing PCB layout |
| XC6SLX45-2CSG324C | Newer Spartan-6 family, 43,661 logic cells, 2.5 V VCCINT, and improved DCM+PLL clocking | Requires updated power delivery and configuration circuitry; not pin-compatible | Choose for new designs needing higher performance, lower static power, or advanced transceivers |
Compared with XC3S400-4TQG144C, the XC3S500E-4TQG144C offers immediate scalability within identical footprint and thermal envelope, while the XC6SLX45-2CSG324C demands board redesign but delivers 5× logic capacity and integrated PCIe endpoints.
Availability
XC3S400-4TQG144C is available at Aetrix Electronics and suitable for industrial control systems, automated test equipment, and medical imaging subsystems requiring stable component supply and long-term obsolescence management.
Supply support for XC3S400-4TQG144C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues to support the Spartan-3 product family for legacy industrial and aerospace applications.
The Spartan-3 series was designed for cost-sensitive, high-volume embedded systems requiring reconfigurable logic with predictable timing and low-power operation.
FAQ
What is the maximum operating frequency supported by XC3S400-4TQG144C?
The XC3S400-4TQG144C has a -4 speed grade, guaranteeing timing closure for critical paths up to 280 MHz under typical conditions. Actual achievable frequency depends on design topology, placement, and routing; DCM outputs can generate stable clocks up to 320 MHz with jitter below 150 ps RMS.
Does XC3S400-4TQG144C support JTAG programming?
Yes, XC3S400-4TQG144C fully supports IEEE 1149.1 JTAG boundary-scan for in-system programming, debugging, and verification. The TDI, TDO, TMS, and TCK pins are dedicated and accessible in the 144-pin TQFP package, enabling configuration without external PROM.
What power supplies are required for XC3S400-4TQG144C?
XC3S400-4TQG144C requires two independent supplies: VCCINT = 1.2 V ±3% for the core logic fabric, and VCCO = 1.2 V to 3.3 V (per I/O bank) for output drivers and input receivers. Decoupling capacitors must be placed near each supply pin per Xilinx UG331 guidelines.
Can XC3S400-4TQG144C replace XC3S200-4TQG144C in an existing design?
Yes, XC3S400-4TQG144C is pin-compatible and functionally upward-compatible with XC3S200-4TQG144C. Both share identical package, pinout, speed grade, and configuration interface - allowing drop-in replacement to increase logic capacity without PCB modification.
Is XC3S400-4TQG144C RoHS compliant?
Yes, XC3S400-4TQG144C is RoHS compliant and lead-free, meeting EU Directive 2011/65/EU. The "G" in the part number denotes green (halogen-free) packaging, and the device carries full material declarations per AMD's Product Change Notification PCN-2017-001.
XC3S400-4TQG144C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3
- Package/Case:
- 144-LQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 896
- Number of Logic Elements/Cells:
- 8064
- Total RAM Bits:
- 294912
- Number of I/O:
- 97
- Number of Gates:
- 400000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 144-TQFP (20x20)
XC3S400-4TQG144C FAQ
1.How can I place an order for XC3S400-4TQG144C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S400-4TQG144C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S400-4TQG144C reliable?
The price and inventory of XC3S400-4TQG144C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S400-4TQG144C is usually 5 days.
3.What payment methods are accepted for XC3S400-4TQG144C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S400-4TQG144C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S400-4TQG144C?
XC3S400-4TQG144C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S400-4TQG144C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S400-4TQG144C?
For technical support, including XC3S400-4TQG144C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S400-4TQG144C requirements.
6.How does Aetrix verify that XC3S400-4TQG144C is sourced from the original manufacturer or authorized distributors?
All XC3S400-4TQG144C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S400-4TQG144C meets industry standards.
7.What is the process for return or replacement of XC3S400-4TQG144C?
All XC3S400-4TQG144C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S400-4TQG144C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S400-4TQG144C part is unused and in its original packaging.
Return procedure for XC3S400-4TQG144C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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