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AMD XC3S400-4TQG144I
- Part No.:
- XC3S400-4TQG144I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 144-LQFP
- Datasheet:
-
XC3S400-4TQG144I.pdf
- Description:
- IC FPGA 97 I/O 144TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,624
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Product details
Overview
XC3S400-4TQG144I from AMD (formerly Xilinx) is a Spartan-3 FPGA with 400,000 system gates, 144-pin TQFP package, -4 speed grade, and industrial temperature range (–40°C to +100°C). It integrates up to 8,064 logic cells, 288 Kbits of block RAM, and supports LVCMOS25/LVCMOS33 I/O standards for embedded control and interface bridging.
For engineers reviewing the XC3S400-4TQG144I datasheet, pinout, applications, or equivalent options, key selection factors include logic density, I/O voltage flexibility, internal RAM capacity, and industrial-grade thermal performance in space-constrained PCB layouts.
Technical Context
The XC3S400-4TQG144I implements a configurable logic fabric based on 4-input LUTs and distributed RAM, with dedicated carry logic for arithmetic functions. It includes twelve 18×18 multipliers and supports Digital Clock Managers (DCMs) for clock synthesis, phase shifting, and duty cycle correction.
Configuration is performed via Master Serial mode using external PROM or JTAG boundary-scan. The device supports IEEE 1149.1 compliance and features SelectIO technology enabling mixed-voltage I/O operation across banks with independent VCCO settings.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 8,064 - provides combinational and sequential logic resources for medium-complexity digital control and protocol translation. |
| System Gates | 400,000 - indicates overall logic capacity suitable for replacing ASICs in cost-sensitive industrial interfaces. |
| Block RAM | 288 Kbits - enables local data buffering, FIFOs, or small lookup tables without external memory. |
| I/O Pins | 108 user I/O - supports parallel bus interfacing, sensor aggregation, or multi-peripheral connectivity in compact designs. |
| Speed Grade | -4 - guarantees timing closure up to 280 MHz for critical paths under worst-case industrial conditions. |
| Operating Temp | –40°C to +100°C - ensures reliable operation in factory automation, motor drives, and outdoor embedded systems. |
| VCCINT | 1.2 V ±3% - requires tight regulation; impacts dynamic power and thermal management in dense layouts. |
Pinout & Package
XC3S400-4TQG144I is housed in a 144-lead Thin Quad Flat Pack (TQFP) with 0.5 mm pitch, 20 mm × 20 mm body size, and exposed pad for thermal dissipation. Package conforms to JEDEC MO-153AC.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.2 V core supply input; must be decoupled within 10 mm of pin with ≥10 µF + 0.1 µF ceramic. |
| P2 | VCCO_0 | Bank 0 I/O output voltage reference; sets logic levels for pins A1–D13. |
| T14 | PROGRAM_B | Active-low configuration initiation signal; pulled high internally via 20 kΩ resistor. |
| R13 | DONE | Open-drain status output indicating successful configuration completion. |
| M13 | INIT_B | Open-drain output signaling configuration status or error during startup. |
| U1 | TCK | JTAG test clock input per IEEE 1149.1; requires 10 kΩ pull-up for robust boundary-scan. |
Key Features
| Feature | Design Value |
|---|---|
| Digital Clock Manager (DCM) | Two DCMs provide jitter-reduced clock synthesis, 90° phase shift, and frequency doubling for synchronous peripheral interfacing. |
| SelectIO Technology | Per-bank I/O voltage support (1.2 V to 3.3 V) enables direct connection to legacy and modern peripherals without level shifters. |
| Embedded Multipliers | Twelve 18×18 signed multipliers accelerate DSP tasks like motor control PID loops or sensor linearization. |
| Configurable Logic Blocks | Each CLB contains two slices with four LUTs and eight flip-flops, supporting efficient state machine and pipeline implementation. |
| Boundary-Scan Support | Full IEEE 1149.1 compliance allows in-circuit testing and programming without dedicated debug headers. |
Applications
| Industrial PLC I/O Module | Legacy Bus Bridge |
|---|---|
Use Scenario: Real-time digital input/output expansion in programmable logic controllers with fieldbus isolation. IC Role / Device Role / Timing Role: FPGA acts as glue logic and protocol translator between microcontroller and isolated RS-485/CAN physical layers. Use Value: 108 user I/O and industrial temp rating enable direct integration into DIN-rail mounted enclosures without forced cooling. | Use Scenario: Bridging ISA or PCI bus signals to modern microcontrollers in retrofitted medical imaging subsystems. IC Role / Device Role / Timing Role: Timing-critical address/data multiplexing and handshaking logic with sub-10 ns setup/hold margins. Use Value: -4 speed grade ensures deterministic timing across temperature for legacy timing budgets. |
| Motor Control Encoder Interface | Test Equipment Pattern Generator |
Use Scenario: High-resolution quadrature decoding and PWM generation for servo drives in packaging machinery. IC Role / Device Role / Timing Role: Dedicated counter logic and DCM-based PWM clock synthesis with <1% duty cycle error. Use Value: On-chip block RAM stores encoder lookup tables; 288 Kbits eliminates external SRAM footprint. | Use Scenario: Generating synchronized digital stimulus waveforms for semiconductor ATE systems. IC Role / Device Role / Timing Role: State-machine-driven pattern sequencer with precise edge placement controlled by DCM outputs. Use Value: 8,064 logic cells support 32-bit parallel vectors at 100+ MHz, reducing pattern memory bandwidth requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S500E-4TQG144I | Higher logic density (11,648 LC), same package and speed grade, but 500E family uses different DCM architecture and lacks dedicated multipliers. | Better suited for larger state machines; less optimal for multiplier-heavy motor control. | Choose when additional logic resources are needed without changing PCB layout. |
| XC6SLX9-2TQG144I | Newer Spartan-6 family, lower static power, 9,152 logic cells, -2 speed grade (slower max frequency), and enhanced I/O slew rate control. | Preferred for new designs requiring longer lifecycle support and lower power; not drop-in compatible due to configuration bitstream incompatibility. | Consider for greenfield projects where migration effort is acceptable for long-term supply assurance. |
Compared with XC3S400-4TQG144I, XC3S500E-4TQG144I offers more logic but fewer arithmetic resources, while XC6SLX9-2TQG144I delivers better power efficiency and extended availability at the cost of revalidation and bitstream redesign.
Availability
XC3S400-4TQG144I is available at Aetrix Electronics and suitable for industrial automation, test equipment, and motor control applications requiring stable component supply across extended product lifecycles.
Supply support for XC3S400-4TQG144I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and related software tools.
The Spartan-3 family was designed for cost-optimized, high-volume embedded applications requiring moderate logic density, flexible I/O, and industrial temperature reliability.
FAQ
What is the maximum operating frequency of the XC3S400-4TQG144I?
The XC3S400-4TQG144I has a -4 speed grade, guaranteeing timing closure up to 280 MHz for critical paths under worst-case industrial temperature and voltage conditions. Actual achievable frequency depends on design complexity, routing, and clock domain structure. The device's Digital Clock Managers support output frequencies up to 320 MHz with jitter filtering, but system-level timing must be verified per implementation using Xilinx ISE tools.
Does the XC3S400-4TQG144I support JTAG programming?
Yes, the XC3S400-4TQG144I fully supports IEEE 1149.1 JTAG boundary-scan for programming, debugging, and in-system verification. Pins TCK, TMS, TDI, and TDO are dedicated for this interface, and configuration can be performed in JTAG mode without external PROM. The DONE pin confirms successful configuration, and INIT_B indicates errors during the process.
What voltage levels are supported on the I/O banks of the XC3S400-4TQG144I?
The XC3S400-4TQG144I supports multiple I/O standards per bank via SelectIO technology, including LVCMOS18, LVCMOS25, LVCMOS33, LVTTL, and PCI. Each bank has an independent VCCO supply, allowing mixed-voltage operation-e.g., Bank 0 at 3.3 V for legacy peripherals and Bank 1 at 2.5 V for newer sensors-without external level shifters.
Is the XC3S400-4TQG144I still in production?
The XC3S400-4TQG144I is no longer in active production by AMD/Xilinx but remains available through authorized distributors and Aetrix Electronics' legacy component program. We provide traceable, tested inventory with full lot documentation and support lifecycle management for ongoing manufacturing and repair needs.
Can the XC3S400-4TQG144I replace the XC3S200-4TQG144I in an existing design?
Yes, the XC3S400-4TQG144I is pin-compatible and functionally upward-compatible with the XC3S200-4TQG144I, sharing identical package, pinout, speed grade, and configuration interface. It offers higher logic density (8,064 vs. 4,320 LC) and more block RAM (288 vs. 72 Kbits), enabling feature expansion without PCB revision-provided power delivery and thermal design accommodate the increased resource utilization.
XC3S400-4TQG144I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3
- Package/Case:
- 144-LQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 896
- Number of Logic Elements/Cells:
- 8064
- Total RAM Bits:
- 294912
- Number of I/O:
- 97
- Number of Gates:
- 400000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 144-TQFP (20x20)
XC3S400-4TQG144I FAQ
1.How can I place an order for XC3S400-4TQG144I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S400-4TQG144I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S400-4TQG144I reliable?
The price and inventory of XC3S400-4TQG144I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S400-4TQG144I is usually 5 days.
3.What payment methods are accepted for XC3S400-4TQG144I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S400-4TQG144I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S400-4TQG144I?
XC3S400-4TQG144I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S400-4TQG144I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S400-4TQG144I?
For technical support, including XC3S400-4TQG144I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S400-4TQG144I requirements.
6.How does Aetrix verify that XC3S400-4TQG144I is sourced from the original manufacturer or authorized distributors?
All XC3S400-4TQG144I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S400-4TQG144I meets industry standards.
7.What is the process for return or replacement of XC3S400-4TQG144I?
All XC3S400-4TQG144I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S400-4TQG144I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S400-4TQG144I part is unused and in its original packaging.
Return procedure for XC3S400-4TQG144I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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