AMD XC3S400-5FG456C

Overview

XC3S400-5FG456C from AMD (formerly Xilinx) is a Spartan-3 FPGA with 400,000 system gates, 17,280 logic cells, and 216 I/O pins in a 456-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at 500 MHz internal clock speed and supports LVCMOS25/LVCMOS33 I/O standards for industrial control and communication interface applications.

For engineers reviewing the XC3S400-5FG456C datasheet, pinout, applications, or equivalent options, key selection criteria include logic cell count, I/O voltage compatibility, configuration mode support (Master Serial, Slave Parallel), and embedded block RAM capacity.

Technical Context

The XC3S400-5FG456C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and eighteen 18×18 multipliers. It uses SRAM-based configuration memory loaded via JTAG, SPI serial PROM, or microprocessor bus interface.

It supports SelectIO technology with programmable slew rate, drive strength, and on-chip termination for signal integrity across mixed-voltage systems. Configuration occurs at power-up using external PROM or active serial mode with dedicated CCLK and DIN pins.

Key Specifications

Pinout & Package

XC3S400-5FG456C is housed in a 456-pin Fine-Pitch Ball Grid Array (FBGA) package with 216 user I/Os distributed across 12 I/O banks. The package has 2.0 mm ball pitch and 27 × 27 array footprint.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based digital logic implementation applications.

Compared with XC3S500E-4FG456C and XC3S200A-4VQG100C, the XC3S400-5FG456C offers balanced logic density, I/O count, and speed grade for mid-complexity embedded systems where FBGA packaging and 216 I/Os are required.

Availability

XC3S400-5FG456C is available at Aetrix Electronics and suitable for industrial motion control, protocol bridging, video capture, and test equipment applications requiring stable component supply and long-term obsolescence planning.

Supply support for XC3S400-5FG456C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI engines for heterogeneous compute acceleration.

The Spartan-3 family was originally designed by Xilinx for cost-sensitive, high-volume embedded applications requiring flexible logic, moderate performance, and low-power operation.

FAQ

What is the configuration method supported by XC3S400-5FG456C?

The XC3S400-5FG456C supports multiple configuration modes: Master Serial (using external SPI PROM), Slave Parallel (via microprocessor bus), and JTAG boundary-scan. Configuration bitstream is loaded into SRAM-based logic cells at power-up, and the device requires persistent external memory for re-initialization after power loss. XC3S400-5FG456C does not retain configuration without external storage.

Does XC3S400-5FG456C support differential I/O standards like LVDS?

No, XC3S400-5FG456C does not natively support LVDS or other differential I/O standards. It implements single-ended SelectIO standards only - LVCMOS, LVTTL, PCI, and HSTL Class I. Differential signaling requires external termination resistors and careful PCB layout, but no internal differential receiver/transmitter circuitry exists in this Spartan-3 device.

What is the maximum operating temperature range for XC3S400-5FG456C?

The XC3S400-5FG456C is rated for commercial temperature range: 0 °C to +70 °C ambient. It is not qualified for extended or industrial temperature grades. Thermal derating applies above 60 °C ambient, and junction temperature must remain below 85 °C under full static/dynamic loading per Xilinx DS099 documentation.

Can XC3S400-5FG456C be used with modern Xilinx Vivado tools?

No, XC3S400-5FG456C is unsupported in Xilinx Vivado. It requires Xilinx ISE Design Suite 14.7 or earlier for synthesis, place-and-route, and bitstream generation. ISE is no longer updated or officially supported by AMD/Xilinx, and users must rely on archived tool versions and legacy license files to develop for XC3S400-5FG456C.

How many clock regions and global clock buffers does XC3S400-5FG456C provide?

XC3S400-5FG456C contains eight global clock networks driven by dedicated BUFG (global buffer) primitives. These clocks distribute low-skew signals across the entire die. The device has no defined "clock regions" - instead, clock routing follows hierarchical tree structures from BUFG outputs to regional and local clock lines, supporting up to eight independent synchronous domains.