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AMD XC3S400-5FGG456C
- Part No.:
- XC3S400-5FGG456C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 456-BBGA
- Datasheet:
-
XC3S400-5FGG456C.pdf
- Description:
- IC FPGA 264 I/O 456FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,506
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Product details
Overview
XC3S400-5FGG456C from AMD (formerly Xilinx) is a Spartan-3 FPGA with 400,000 system gates, 17,280 logic cells, and 216 I/O pins in a 456-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at 500 MHz internal clock speed and supports LVCMOS25/LVCMOS33 I/O standards for industrial control and embedded vision interface applications.
For engineers reviewing the XC3S400-5FGG456C datasheet, pinout, applications, or equivalent options, key selection factors include logic cell count, I/O voltage support, configuration mode (Master Serial), and thermal performance in compact PCB layouts.
Technical Context
The XC3S400-5FGG456C implements a configurable logic block (CLB) architecture with distributed RAM and shift registers per slice. It integrates twelve 18×18 multipliers and supports SelectMAP, JTAG, and serial configuration modes.
It features eight global clock networks, DLL-based clock management, and supports I/O standards including LVTTL, LVCMOS25, LVCMOS33, PCI, and SSTL2. Configuration is performed via external PROM or processor-controlled interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 17,280 - provides combinational and sequential logic capacity for medium-complexity digital systems |
| System Gates | 400,000 - indicates total equivalent gate count for ASIC comparison and resource estimation |
| I/O Pins | 216 - supports high-density peripheral interfacing with programmable voltage and slew rate control |
| Package | 456-pin FGG (Fine-Pitch BGA) - 23×23 mm body, 1.0 mm ball pitch, RoHS-compliant |
| Max Clock Frequency | 500 MHz - enables high-speed data path implementation with pipelined logic |
| Configuration Mode | Master Serial - boots from external SPI PROM without host controller intervention |
| DSP Slices | 12 × 18×18 multipliers - accelerates arithmetic-intensive tasks like filtering and FFTs |
Pinout & Package
XC3S400-5FGG456C uses a 456-ball fine-pitch BGA (FGG) package with 216 user I/Os, 8 global clock inputs, dedicated configuration pins (INIT_B, PROGRAM_B, DONE), and power/ground balls arranged in a thermal-enhanced pattern.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PROGRAM_B | Active-Low Configuration Initiate | Resets configuration logic and clears SRAM contents before new bitstream load |
| INIT_B | Open-Drain Status Output | Indicates configuration memory readiness; pulled low during CRC error or erase |
| DONE | Open-Drain Status Output | Signals successful configuration completion; must be externally pulled up to enable operation |
| CCLK | Configuration Clock Input | Drives internal configuration shift register; frequency ≤ 50 MHz in Master Serial mode |
| DIN | Serial Data Input | Accepts configuration bitstream from external PROM or microcontroller |
Key Features
| Feature | Design Value |
|---|---|
| Multi-Voltage I/O Banks | Four independent banks support mixed-voltage operation (1.2 V to 3.3 V) enabling direct interfacing with diverse peripherals |
| Dedicated Digital Clock Manager (DCM) | Provides jitter-reduced clock synthesis, phase shifting, and frequency multiplication without external PLL components |
| Embedded Block RAM | 288 Kbits of distributed and block RAM - sufficient for frame buffers, FIFOs, and lookup tables in real-time systems |
| Configurable I/O Standards | Supports 12 I/O standards including PCI, SSTL2, and LVCMOS - eliminates level-shifter ICs in mixed-signal designs |
| Boundary-Scan Testing | IEEE 1149.1 compliant JTAG TAP enables in-circuit verification and programming without test fixtures |
Applications
| Industrial Motion Control | Medical Imaging Interface |
|---|---|
Use Scenario: Real-time servo loop coordination across multiple axes using encoder feedback and PWM output generation. IC Role / Device Role / Timing Role: FPGA fabric implements deterministic timing engine and custom IP for position interpolation and safety monitoring. Use Value: 500 MHz internal clock and 216 I/Os allow tight-loop latency (<1 µs) and simultaneous interface to analog front-end, CAN bus, and display controllers. | Use Scenario: High-speed parallel data capture from CCD/CMOS sensors and preprocessing before transmission to host CPU. IC Role / Device Role / Timing Role: Configurable logic synchronizes pixel clocks, applies gamma correction, and packs raw image data into burst transfers. Use Value: Embedded block RAM (288 Kbits) serves as line buffers for real-time noise reduction; LVCMOS33 I/O supports sensor interface voltage compliance. |
| Automotive ADAS Prototyping | Test & Measurement Equipment |
Use Scenario: Rapid development of radar signal processing pipelines using fixed-point arithmetic and streaming data paths. IC Role / Device Role / Timing Role: FPGA acts as hardware-accelerated preprocessor between RF front-end and ARM-based application processor. Use Value: Twelve 18×18 multipliers enable real-time FFT and CFAR detection; Master Serial configuration allows field-upgradable algorithms. | Use Scenario: Modular instrument design requiring reconfigurable digital pattern generators and protocol analyzers. IC Role / Device Role / Timing Role: FPGA implements user-defined state machines and high-speed digital I/O timing engines with sub-nanosecond resolution. Use Value: Eight global clock networks support independent timing domains for stimulus generation, acquisition, and analysis subsystems. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based digital logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S500E-5FGG456C | Higher logic capacity (23,040 CLBs), same package and I/O count, enhanced DCM with doubled frequency range | Better suited for designs requiring additional pipeline stages or larger on-chip memory buffers | Select when future scalability or higher arithmetic throughput is required without changing PCB layout |
| XC6SLX45-3CSG324C | Based on Spartan-6 architecture; lower static power, improved I/O drive strength, and integrated PCIe endpoint block | Preferred for new designs targeting lower power consumption or requiring native PCIe connectivity | Choose for green-field projects where migration to newer process node and updated toolchain is acceptable |
Compared with XC3S400-5FGG456C, the XC3S500E-5FGG456C offers headroom for logic expansion within identical mechanical constraints, while the XC6SLX45-3CSG324C delivers architectural improvements at the cost of toolchain and configuration compatibility changes.
Availability
XC3S400-5FGG456C is available at Aetrix Electronics and suitable for industrial motion control, medical imaging interface, and test & measurement equipment requiring stable component supply and long-term obsolescence management.
Supply support for XC3S400-5FGG456C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains legacy Spartan-3 product lines for industrial and aerospace continuity programs.
The Spartan-3 family was designed for cost-sensitive, high-volume embedded applications requiring predictable timing, moderate logic density, and robust configuration reliability.
FAQ
What is the configuration method supported by XC3S400-5FGG456C?
The XC3S400-5FGG456C supports Master Serial, Slave Serial, SelectMAP, and JTAG configuration modes. Master Serial is the default boot method using an external SPI PROM. The XC3S400-5FGG456C requires no external processor for initialization and completes configuration in under 100 ms with a 50 MHz CCLK.
Does XC3S400-5FGG456C support differential I/O standards like LVDS?
No, the XC3S400-5FGG456C does not support LVDS or other differential signaling standards. Its I/O banks support only single-ended standards including LVCMOS25, LVCMOS33, LVTTL, PCI, and SSTL2. For differential I/O, designers must use external serializers or migrate to Spartan-6 or later families.
What is the operating temperature range for XC3S400-5FGG456C?
The XC3S400-5FGG456C is rated for commercial temperature range (0 °C to +70 °C). It is not qualified for extended or industrial temperature grades. Thermal derating applies above 60 °C ambient, and junction temperature must remain below 85 °C under full static and dynamic loading conditions.
Can XC3S400-5FGG456C be reprogrammed in-system?
Yes, the XC3S400-5FGG456C supports in-system programming via JTAG or SelectMAP interfaces. Its configuration memory is SRAM-based and volatile, so the XC3S400-5FGG456C reloads its bitstream on each power cycle from external nonvolatile storage unless held in reset during power-up.
Is there a pin-compatible replacement for XC3S400-5FGG456C in the Spartan-3 family?
No direct pin-compatible replacement exists within the Spartan-3 family. The XC3S400-5FGG456C shares the 456-pin FGG package with XC3S200, XC3S500, and XC3S1000 variants, but I/O bank assignments and configuration pin functions differ. Migration requires logic re-synthesis and board-level validation.
XC3S400-5FGG456C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3
- Package/Case:
- 456-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 896
- Number of Logic Elements/Cells:
- 8064
- Total RAM Bits:
- 294912
- Number of I/O:
- 264
- Number of Gates:
- 400000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 456-FBGA (23x23)
XC3S400-5FGG456C FAQ
1.How can I place an order for XC3S400-5FGG456C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S400-5FGG456C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S400-5FGG456C reliable?
The price and inventory of XC3S400-5FGG456C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S400-5FGG456C is usually 5 days.
3.What payment methods are accepted for XC3S400-5FGG456C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S400-5FGG456C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S400-5FGG456C?
XC3S400-5FGG456C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S400-5FGG456C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S400-5FGG456C?
For technical support, including XC3S400-5FGG456C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S400-5FGG456C requirements.
6.How does Aetrix verify that XC3S400-5FGG456C is sourced from the original manufacturer or authorized distributors?
All XC3S400-5FGG456C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S400-5FGG456C meets industry standards.
7.What is the process for return or replacement of XC3S400-5FGG456C?
All XC3S400-5FGG456C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S400-5FGG456C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S400-5FGG456C part is unused and in its original packaging.
Return procedure for XC3S400-5FGG456C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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