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AMD XC3S400-5TQG144C
- Part No.:
- XC3S400-5TQG144C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 144-LQFP
- Datasheet:
-
XC3S400-5TQG144C.pdf
- Description:
- IC FPGA 97 I/O 144TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:4,128
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Product details
Overview
XC3S400-5TQG144C from AMD (formerly Xilinx) is a Spartan-3 FPGA with 400,000 system gates, 144-pin TQFP package, -5 speed grade, and commercial temperature range (0°C to 85°C). It integrates 8,064 logic cells, 288 Kbits of block RAM, and supports LVCMOS/LVTTL I/O standards for embedded control and digital signal processing applications.
For engineers reviewing the XC3S400-5TQG144C datasheet, pinout, applications, or equivalent options, key selection factors include logic density, I/O count (108 user I/Os), distributed RAM capacity, global clock routing resources, and JTAG boundary-scan compliance per IEEE 1149.1.
Technical Context
The XC3S400-5TQG144C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated multipliers, and digital clock managers (DCMs) supporting input frequency multiplication, division, phase shifting, and duty-cycle correction. It uses SRAM-based configuration memory loaded via JTAG or master serial mode.
It supports SelectIO™ technology with programmable drive strength (2–24 mA), slew rate control, and on-chip termination for single-ended standards. Configuration is volatile and requires external PROM or processor-initiated reload at power-up.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 8,064 - provides combinational and sequential logic capacity for medium-complexity digital controllers. |
| System Gates | 400,000 - indicates total equivalent gate count for logic synthesis estimation and RTL sizing. |
| User I/O Pins | 108 - supports parallel bus interfaces, sensor arrays, and multi-channel communication peripherals. |
| Block RAM | 288 Kbits - enables FIFOs, lookup tables, and data buffering without external memory. |
| Speed Grade | -5 - guarantees timing closure up to 333 MHz for internal logic paths under worst-case conditions. |
| Operating Temp | 0°C to +85°C - validated for commercial-grade industrial control and test equipment environments. |
| I/O Standards | LVCMOS, LVTTL, PCI - allows direct interfacing with microcontrollers, ADCs, and legacy peripheral ICs. |
Pinout & Package
XC3S400-5TQG144C is housed in a 144-lead Thin Quad Flat Pack (TQFP) with 0.5 mm pitch, 20 mm × 20 mm body size, and exposed thermal pad (non-electrical). The package supports reflow soldering and meets JEDEC MS-026 standard.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GND | Ground reference | Multiple dedicated pins provide low-impedance return paths for core and I/O domains. |
| VCCINT | Core supply | 1.2 V supply for internal logic; requires tight regulation and local decoupling. |
| VCCO | I/O supply | Configurable per bank (1.2 V to 3.3 V); sets voltage level for associated I/O pins. |
| TCK/TMS/TDI/TDO | JTAG interface | IEEE 1149.1-compliant boundary scan for programming, debugging, and testing. |
| CCLK | Configuration clock | Drives master serial configuration mode; can be driven externally or by internal oscillator. |
| PROGRAM_B | Initiate config | Active-low asynchronous reset that clears configuration memory and restarts load sequence. |
Key Features
| Feature | Design Value |
|---|---|
| Digital Clock Manager (DCM) | Two DCMs per device enable jitter-reduced clock synthesis, phase alignment, and frequency translation without external PLL ICs. |
| SelectIO™ Technology | Per-bank I/O voltage support allows mixed-voltage interfaces on same device, reducing level-shifter count. |
| Distributed RAM | 17,408 bits of fast synchronous RAM distributed across CLBs for register files and state-machine storage. |
| Multiplier Blocks | Four 18×18-bit hard multipliers accelerate arithmetic-intensive functions like FIR filtering and motor control algorithms. |
| Global Clock Networks | Eight low-skew global clock lines ensure timing integrity across large logic partitions and high-speed I/O banks. |
Applications
| Industrial Motion Control | Automated Test Equipment |
|---|---|
Use Scenario: Real-time closed-loop servo positioning using encoder feedback and PWM output generation. IC Role / Device Role / Timing Role: FPGA fabric executes PID computation, pulse-width modulation, and safety monitoring logic with deterministic latency. Use Value: 108 user I/Os support simultaneous encoder inputs, analog monitor channels, and isolated digital outputs without expansion. | Use Scenario: High-speed digital pattern generation and response capture for IC functional validation. IC Role / Device Role / Timing Role: Configurable logic generates stimulus vectors and compares expected vs. actual responses at up to 100 MHz. Use Value: Block RAM buffers test sequences and results; DCMs synchronize capture clocks to eliminate metastability in sampling. |
| Medical Imaging Interface | Communications Baseband Processing |
Use Scenario: Aggregation and preprocessing of ultrasound transducer channel data before DSP offload. IC Role / Device Role / Timing Role: Parallel data acquisition engine with time-aligned channel synchronization and FIR filtering. Use Value: Dedicated 18×18 multipliers accelerate beamforming calculations; LVCMOS33 I/O directly connects to ADCs and FPGAs. | Use Scenario: Channelization, filtering, and symbol mapping in wireless base station front-end modules. IC Role / Device Role / Timing Role: Reconfigurable digital frontend handles multiple air-interface standards (GSM, WCDMA) via partial reconfiguration. Use Value: 288 Kbits block RAM stores filter coefficients and FFT twiddle tables; DCM phase-shift capability aligns local oscillators. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based digital logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S500E-4FTG256C | Higher logic density (11,648 CLBs), 256-pin FTBGA package, enhanced DCM features, and improved I/O drive strength. | Supports larger designs requiring >8K logic cells or more than 173 user I/Os; not pin-compatible. | Select when design scale exceeds XC3S400-5TQG144C capacity or requires BGA thermal/mechanical performance. |
| XC6SLX9-2TQG144C | Spartan-6 architecture, lower static power, integrated PCIe block, and dual-data-rate (DDR) memory controller; 9,152 logic cells. | Targets newer designs needing DDR2/3 memory interface or embedded PCIe endpoint functionality. | Choose for migration paths requiring higher integration or lower power; not drop-in compatible due to different configuration and I/O architecture. |
Compared with XC3S400-5TQG144C, XC3S500E-4FTG256C offers greater scalability but requires PCB redesign, while XC6SLX9-2TQG144C delivers modern features at the cost of architectural discontinuity and toolchain migration effort.
Availability
XC3S400-5TQG144C is available at Aetrix Electronics and suitable for industrial motion control, automated test equipment, and medical imaging interface applications requiring stable component supply and long-term manufacturing continuity.
Supply support for XC3S400-5TQG144C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for hardware-accelerated systems.
The Spartan-3 family was designed for cost-sensitive, high-volume applications requiring predictable performance, low power, and rapid time-to-market - especially in industrial automation and communications infrastructure.
FAQ
What is the configuration method supported by XC3S400-5TQG144C?
XC3S400-5TQG144C supports master serial, slave serial, JTAG, and boundary-scan configuration modes. Configuration bitstream is loaded into on-chip SRAM via dedicated pins (e.g., CCLK, DIN, INIT_B). External PROM or microcontroller typically manages boot-up loading. The XC3S400-5TQG144C does not support passive parallel configuration without additional glue logic.
Does XC3S400-5TQG144C include built-in analog functions such as ADC or DAC?
No, XC3S400-5TQG144C is a digital-only FPGA with no integrated analog-to-digital or digital-to-analog converters. All analog signal conditioning must be handled externally using discrete ADC/DAC ICs or companion chips. The XC3S400-5TQG144C relies on its I/O banks to interface with those external components using standard digital protocols or parallel buses.
What is the maximum operating frequency of the internal DCM in XC3S400-5TQG144C?
The Digital Clock Manager (DCM) in XC3S400-5TQG144C supports input frequencies from 1.5 MHz to 200 MHz and generates output frequencies up to 320 MHz. Output jitter is specified at ±150 ps (peak-to-peak) over process, voltage, and temperature. The XC3S400-5TQG144C DCM does not support fractional-N synthesis or spread-spectrum clocking.
Is XC3S400-5TQG144C RoHS compliant and lead-free?
Yes, XC3S400-5TQG144C is RoHS compliant and manufactured with lead-free terminations per EU Directive 2011/65/EU. The TQG suffix denotes lead-free, green (halogen-free) packaging. The XC3S400-5TQG144C meets IPC/JEDEC J-STD-020 moisture sensitivity level 3 and requires bake conditioning if exposed beyond floor life.
Can XC3S400-5TQG144C be reprogrammed in-system after soldering?
Yes, XC3S400-5TQG144C supports in-system programming (ISP) via its JTAG port (TCK/TMS/TDI/TDO) using standard IEEE 1149.1 boundary-scan infrastructure. Reprogramming requires compatible JTAG cable and iMPACT or Vivado software. The XC3S400-5TQG144C configuration memory is volatile, so reprogramming is required after each power cycle unless paired with nonvolatile configuration memory.
XC3S400-5TQG144C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3
- Package/Case:
- 144-LQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 896
- Number of Logic Elements/Cells:
- 8064
- Total RAM Bits:
- 294912
- Number of I/O:
- 97
- Number of Gates:
- 400000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 144-TQFP (20x20)
XC3S400-5TQG144C FAQ
1.How can I place an order for XC3S400-5TQG144C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S400-5TQG144C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S400-5TQG144C reliable?
The price and inventory of XC3S400-5TQG144C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S400-5TQG144C is usually 5 days.
3.What payment methods are accepted for XC3S400-5TQG144C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S400-5TQG144C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S400-5TQG144C?
XC3S400-5TQG144C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S400-5TQG144C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S400-5TQG144C?
For technical support, including XC3S400-5TQG144C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S400-5TQG144C requirements.
6.How does Aetrix verify that XC3S400-5TQG144C is sourced from the original manufacturer or authorized distributors?
All XC3S400-5TQG144C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S400-5TQG144C meets industry standards.
7.What is the process for return or replacement of XC3S400-5TQG144C?
All XC3S400-5TQG144C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S400-5TQG144C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S400-5TQG144C part is unused and in its original packaging.
Return procedure for XC3S400-5TQG144C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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