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AMD XC3S400A-4FG400C
- Part No.:
- XC3S400A-4FG400C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 400-BGA
- Datasheet:
-
XC3S400A-4FG400C.pdf
- Description:
- IC FPGA 311 I/O 400FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,886
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Product details
Overview
XC3S400A-4FG400C from AMD (formerly Xilinx) is a Spartan-3A FPGA with 400,000 system gates, 216 I/O pins, and configured in a 400-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at -4 speed grade (tPD = 4.8 ns), supports SelectIO™ standards up to 622 Mbps, and targets cost-sensitive embedded control and interface bridging applications.
For engineers reviewing the XC3S400A-4FG400C datasheet, pinout, applications, or equivalent options, key selection factors include I/O voltage support (1.2 V to 3.3 V), distributed RAM capacity (288 kbits), and configuration via Master Serial mode using external PROM.
Technical Context
The XC3S400A-4FG400C implements a hierarchical logic fabric built from configurable logic blocks (CLBs), each containing two slices with four LUTs and eight flip-flops. It integrates dedicated digital clock managers (DCMs) for phase-matched clock synthesis and jitter reduction, supporting input frequencies from 12 MHz to 240 MHz.
Configuration is performed through JTAG, Master Serial, or Slave SelectMAP modes. The device uses internal 1.2 V core voltage and supports multi-voltage I/O banks-each bank independently configurable for LVCMOS, LVTTL, PCI, HSTL, or SSTL signaling standards.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 8,064 CLBs (16,128 slices) - defines maximum combinational/sequential logic density |
| Block RAM | 288 kbits distributed RAM - usable as dual-port memory or shift registers without external SRAM |
| I/O Pins | 216 user I/O - supports mixed-voltage operation across 16 I/O banks |
| Speed Grade | -4 (tPD = 4.8 ns) - guarantees timing closure for designs running at ≤208 MHz system clock |
| Configuration Mode | Master Serial via SPI PROM - enables single-chip boot without external controller |
| Core Voltage | 1.2 V ±3% - requires low-noise regulation; impacts dynamic power and thermal design |
Pinout & Package
XC3S400A-4FG400C is housed in a 400-ball fine-pitch BGA (FBGA) package with 1.0 mm ball pitch, 27 × 27 mm body size, and thermal pad on underside for enhanced heat dissipation. Pinout follows Xilinx Spartan-3A family standard layout with dedicated configuration, clock, and JTAG pins.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PROGRAM_B | Active-Low Configuration Initiate | Pulls device into configuration reset state; must be pulled high after power-up for normal operation |
| DONE | Configuration Status Output | Open-drain signal indicating successful bitstream loading; used to enable downstream logic |
| TCK/TMS/TDI/TDO | JTAG Boundary-Scan Interface | Enables IEEE 1149.1-compliant programming, debugging, and interconnect testing |
| CLK0–CLK3 | Dedicated Global Clock Inputs | Low-skew routing to all DCMs and CLBs; supports differential LVDS or single-ended CMOS |
| VCCO_0–VCCO_15 | I/O Bank Voltage Supplies | Each set powers one I/O bank; allows independent 1.2 V/1.5 V/1.8 V/2.5 V/3.3 V signaling per bank |
Key Features
| Feature | Design Value |
|---|---|
| Digital Clock Manager (DCM) | Two DCMs per device provide 0° phase shift, frequency synthesis (×2 to ×32), and duty cycle correction |
| SelectIO™ Technology | Supports 19 I/O standards including LVCMOS, LVTTL, PCI, HSTL Class I/II, and SSTL-2 Class I |
| Multi-Voltage I/O Banks | 16 independent banks enable mixed-signal interfacing (e.g., 3.3 V microcontroller ↔ 1.8 V ADC) |
| Embedded Multipliers | Four 18 × 18-bit signed multipliers - accelerate DSP functions like FIR filtering without external ICs |
Applications
| Industrial PLC I/O Module | Video Interface Bridge |
|---|---|
Use Scenario: Real-time digital I/O expansion and protocol translation in programmable logic controllers. IC Role / Device Role / Timing Role: FPGA acts as field-programmable glue logic and protocol converter between legacy RS-485 fieldbus and modern EtherCAT backplane. Use Value: Enables deterministic sub-100 µs I/O scan cycles using DCM-synchronized internal clocks and registered I/O paths. | Use Scenario: Converting parallel RGB video data from image sensors to MIPI D-PHY output for display modules. IC Role / Device Role / Timing Role: Timing-critical pixel data serializer with embedded clock recovery and lane alignment logic. Use Value: Achieves 622 Mbps per I/O using SelectIO™ SSTL-2 support and DCM-based pixel clock multiplication. |
| Medical Sensor Hub | Test Equipment Pattern Generator |
Use Scenario: Aggregating analog sensor inputs (ECG, SpO₂, temperature) via external ADCs and performing real-time preprocessing. IC Role / Device Role / Timing Role: Configurable digital front-end implementing decimation filters, alarm logic, and USB 2.0 endpoint interface. Use Value: Leverages 288 kbits distributed RAM for coefficient storage and 18 × 18 multipliers for FIR filter execution at 2 MSPS. | Use Scenario: Generating high-speed digital stimulus patterns for ASIC validation and PCB functional test. IC Role / Device Role / Timing Role: Programmable pattern sequencer with precise edge placement controlled by DCM outputs. Use Value: Delivers <100 ps jitter on output edges using dedicated global clock nets and synchronous register outputs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S500E-4FG320C | Higher logic density (10,476 CLBs), smaller 320-ball FBGA, no DCM phase-shift capability | Limited I/O count (195 pins); unsuitable for high-pin-count bridging where XC3S400A-4FG400C's 216 I/O is required | Choose when board space is constrained and logic utilization exceeds XC3S400A-4FG400C capacity |
| XC6SLX45-2CSG324C | Spartan-6 architecture; 43,661 logic cells, integrated PCIe block, 256 kB block RAM, 210 I/O | Requires different toolchain (Vivado vs. ISE), lacks native support for legacy Master Serial PROM boot | Prefer for new designs needing higher performance or PCIe integration; not drop-in compatible with XC3S400A-4FG400C |
Compared with XC3S500E-4FG320C and XC6SLX45-2CSG324C, the XC3S400A-4FG400C offers optimal balance of I/O count, DCM flexibility, and legacy configuration simplicity for cost-driven industrial control upgrades.
Availability
XC3S400A-4FG400C is available at Aetrix Electronics and suitable for industrial automation, medical instrumentation, and test equipment requiring stable component supply over extended production lifecycles.
Supply support for XC3S400A-4FG400C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI engines for data center, embedded, and edge applications.
The Spartan-3A family-including XC3S400A-4FG400C-was designed for cost-sensitive, high-volume applications demanding reliable I/O flexibility, deterministic timing, and simple configuration without external processors.
FAQ
What configuration methods does XC3S400A-4FG400C support?
The XC3S400A-4FG400C supports three configuration modes: JTAG for programming and debugging, Master Serial using an external SPI PROM, and Slave SelectMAP for parallel loading from a microcontroller. Master Serial is most common in production due to its self-boot capability and minimal external components. All modes require proper initialization of PROGRAM_B and DONE signals as defined in the XC3S400A-4FG400C datasheet.
Does XC3S400A-4FG400C support differential I/O standards like LVDS?
No, the XC3S400A-4FG400C does not natively support LVDS or other differential I/O standards. Its SelectIO™ technology covers single-ended standards only-including LVCMOS, LVTTL, PCI, HSTL, and SSTL. For differential signaling, external LVDS line drivers or migration to Spartan-6 or later families is required. This limitation is documented in the XC3S400A-4FG400C DC and switching characteristics specification.
What is the maximum operating junction temperature for XC3S400A-4FG400C?
The XC3S400A-4FG400C has a maximum junction temperature of +85 °C under continuous operation, consistent with its commercial-grade (-4 speed grade, C suffix) rating. Thermal design must ensure that power dissipation-calculated using Xilinx XPower Analyzer with the specific XC3S400A-4FG400C bitstream-keeps Tj below this limit, especially in enclosed industrial enclosures with limited airflow.
Can XC3S400A-4FG400C be reprogrammed in-system?
Yes, the XC3S400A-4FG400C supports in-system programming (ISP) via JTAG or Master Serial mode. When using JTAG, boundary-scan instructions allow full reconfiguration without power cycling. In Master Serial mode, reprogramming requires toggling PROGRAM_B to reload the bitstream from the connected SPI PROM. Both methods preserve configuration integrity and are validated for field updates in deployed XC3S400A-4FG400C systems.
Is there a pin-compatible replacement for XC3S400A-4FG400C in active production?
No pin-compatible replacement exists for XC3S400A-4FG400C in current AMD/Xilinx production. The Spartan-3A family is discontinued, and newer families (Spartan-6, Artix-7) use different pinouts, power requirements, and configuration architectures. Migration requires PCB redesign and toolchain update. Aetrix Electronics maintains legacy inventory and provides obsolescence mitigation support for the XC3S400A-4FG400C.
XC3S400A-4FG400C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3A
- Package/Case:
- 400-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 896
- Number of Logic Elements/Cells:
- 8064
- Total RAM Bits:
- 368640
- Number of I/O:
- 311
- Number of Gates:
- 400000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 400-FBGA (21x21)
XC3S400A-4FG400C FAQ
1.How can I place an order for XC3S400A-4FG400C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S400A-4FG400C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S400A-4FG400C reliable?
The price and inventory of XC3S400A-4FG400C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S400A-4FG400C is usually 5 days.
3.What payment methods are accepted for XC3S400A-4FG400C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S400A-4FG400C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S400A-4FG400C?
XC3S400A-4FG400C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S400A-4FG400C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S400A-4FG400C?
For technical support, including XC3S400A-4FG400C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S400A-4FG400C requirements.
6.How does Aetrix verify that XC3S400A-4FG400C is sourced from the original manufacturer or authorized distributors?
All XC3S400A-4FG400C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S400A-4FG400C meets industry standards.
7.What is the process for return or replacement of XC3S400A-4FG400C?
All XC3S400A-4FG400C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S400A-4FG400C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S400A-4FG400C part is unused and in its original packaging.
Return procedure for XC3S400A-4FG400C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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