My Inquiry
My Account
AMD XC3S400A-4FG400I
- Part No.:
- XC3S400A-4FG400I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 400-BGA
- Datasheet:
-
XC3S400A-4FG400I.pdf
- Description:
- IC FPGA 311 I/O 400FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,065
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC3S400A-4FG400I from AMD (formerly Xilinx) is a Spartan-3A FPGA with 400,000 system gates, 216 I/O pins, and configured in a 400-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at -4 speed grade (tPD = 4.8 ns), supports SelectIO™ standards up to 622 Mbps, and targets cost-sensitive embedded control and interface bridging applications.
For engineers reviewing the XC3S400A-4FG400I datasheet, pinout, applications, or equivalent options, key selection factors include I/O voltage flexibility (1.2 V to 3.3 V), embedded block RAM (216 kbits), DLL-based clock management, and industrial temperature range (-40°C to +100°C) operation.
Technical Context
The XC3S400A-4FG400I implements a hierarchical logic fabric composed of configurable logic blocks (CLBs), each containing two slices with four LUTs and eight flip-flops. It integrates eighteen 18×18 multipliers and supports distributed RAM and shift register functionality within CLBs.
Configuration is performed via Master Serial mode using an external PROM or through JTAG boundary-scan. The device includes internal configuration monitoring, brown-out detection, and IEEE 1149.1-compliant boundary-scan support for test and debug.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 8,064 configurable logic cells for combinatorial and sequential logic implementation |
| Block RAM | 216 kbits of embedded dual-port RAM for data buffering and FIFOs |
| I/O Pins | 216 user-configurable I/O pins supporting LVCMOS, LVTTL, PCI, and HSTL |
| Max I/O Speed | 622 Mbps single-ended data rate per I/O bank |
| Speed Grade | -4 grade: 4.8 ns maximum propagation delay for critical path timing closure |
| Operating Temp | Industrial range: -40°C to +100°C ambient, suitable for non-automotive harsh environments |
| VCCINT | 1.2 V core supply enables low-power operation with compatible DC-DC regulation |
Pinout & Package
XC3S400A-4FG400I is housed in a 400-pin Fine-Pitch Ball Grid Array (FBGA) package with 22×22 ball array, 0.8 mm pitch, and 27 mm × 27 mm body size. Thermal pad on underside requires solder paste stencil design for thermal dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply (1.2–3.3 V selectable per bank) |
| A2 | IO_L0N_0 | Differential pair negative input for Bank 0, supports LVDS/BLVDS |
| B2 | IO_L0P_0 | Differential pair positive input for Bank 0, matched length routing required |
| T19 | CCLK | Configuration clock input during Master Serial mode programming |
| R18 | DIN | Serial configuration data input from PROM or microcontroller |
| P17 | PROG_B | Active-low configuration reset; forces re-initialization of FPGA logic and memory |
| M16 | INIT_B | Open-drain status output indicating configuration completion or error |
| J15 | TCK | JTAG test clock input for boundary-scan and debug access |
Key Features
| Feature | Design Value |
|---|---|
| SelectIO Technology | Per-bank I/O voltage control enables mixed-voltage interfacing without level shifters |
| Digital Clock Manager (DCM) | Two DCMs provide jitter-reduced clock synthesis, phase shifting, and frequency multiplication |
| Embedded Multipliers | Eighteen 18×18 signed/unsigned multipliers accelerate arithmetic-intensive functions |
| Configurable Logic Blocks | Each CLB delivers high-density logic with flexible LUT+FF pairing and carry chain optimization |
| Boundary-Scan Support | Full IEEE 1149.1 compliance simplifies board-level test and in-system programming |
Applications
| Industrial PLC I/O Module | Video Interface Bridge |
|---|---|
Use Scenario: Real-time digital I/O expansion and protocol translation in programmable logic controller backplanes. IC Role / Device Role / Timing Role: FPGA acts as configurable glue logic and SERDES bridge between fieldbus controllers and isolated I/O banks. Use Value: Enables field-upgradable logic mapping and deterministic I/O timing with sub-10 ns pin-to-pin skew. | Use Scenario: Converting parallel RGB video signals to serialized FPD-Link or LVDS for display panels. IC Role / Device Role / Timing Role: XC3S400A-4FG400I implements pixel clock domain crossing, color space conversion, and serializer logic. Use Value: Supports 1080p60 video throughput using embedded multipliers and block RAM for line buffering. |
| Medical Imaging Data Acquisition | Test Equipment Pattern Generator |
Use Scenario: High-speed digitized sensor data aggregation from multiple ADC channels in ultrasound front-ends. IC Role / Device Role / Timing Role: XC3S400A-4FG400I serves as time-aligned data concentrator and preprocessing engine before DSP offload. Use Value: Delivers synchronized sampling across 16+ channels using dedicated clock routing and deterministic latency paths. | Use Scenario: Generating precise digital stimulus waveforms for IC functional validation in ATE systems. IC Role / Device Role / Timing Role: XC3S400A-4FG400I configures high-speed pattern memory, timing sequencer, and output driver control logic. Use Value: Achieves <5 ns timing resolution and 200+ MHz vector rates using DLL-controlled I/O timing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S500A-4FG400I | 500K-gate capacity, same package and pinout, higher CLB count (9,120 vs. 8,064) | Supports larger state machines and deeper pipeline stages | Choose when additional logic density or embedded RAM is required without PCB redesign |
| XC6SLX45-3FGG484I | Spartan-6 family, 45K logic cells, 484-pin FBGA, higher performance per watt and enhanced DSP slices | Requires layout change; supports DDR2/3 memory interfaces and PCIe Gen1 endpoints | Prefer for new designs needing lower static power or integrated memory controller support |
Compared with XC3S400A-4FG400I, the XC3S500A-4FG400I offers direct pin-compatible scalability, while the XC6SLX45-3FGG484I provides architectural upgrades including improved clocking, memory interface support, and lower dynamic power-making it suitable for next-generation designs where migration path matters.
Availability
XC3S400A-4FG400I is available at Aetrix Electronics and suitable for industrial automation, medical instrumentation, and test equipment requiring stable component supply across extended product lifecycles.
Supply support for XC3S400A-4FG400I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI engines for heterogeneous compute acceleration.
The Spartan-3A family was designed for cost-optimized, high-volume embedded applications demanding reliable I/O flexibility, moderate logic density, and industrial temperature operation-without requiring advanced process nodes or high-end toolchains.
FAQ
What is the maximum operating junction temperature for XC3S400A-4FG400I?
The XC3S400A-4FG400I has a maximum junction temperature of +125°C under industrial temperature grade conditions. Its specified ambient operating range is -40°C to +100°C, and thermal design must ensure junction temperature remains within limit using appropriate PCB copper area, thermal vias, and optional heatsink attachment to the package's thermal pad.
Does XC3S400A-4FG400I support JTAG configuration?
Yes, XC3S400A-4FG400I supports IEEE 1149.1 JTAG boundary-scan for testing and in-system programming. It uses TCK, TMS, TDI, TDO, and TRST pins for full JTAG functionality, enabling configuration, debugging, and verification without requiring external PROM or serial mode setup.
Can XC3S400A-4FG400I interface directly with 3.3 V logic devices?
Yes, XC3S400A-4FG400I supports 3.3 V I/O standards in designated banks. Each I/O bank has independent VCCO supply, allowing Bank 0 or Bank 1 to be set to 3.3 V while others operate at 1.8 V or 2.5 V-enabling direct connection to legacy 3.3 V peripherals without external level shifters.
What configuration modes does XC3S400A-4FG400I support?
XC3S400A-4FG400I supports Master Serial, Slave Serial, Boundary Scan (JTAG), and Microprocessor Slave Parallel configuration modes. Master Serial is most common, using CCLK and DIN from an external PROM; Slave modes allow host processor control over configuration sequence and timing.
Is XC3S400A-4FG400I RoHS compliant and lead-free?
Yes, XC3S400A-4FG400I is RoHS compliant and manufactured with lead-free (Pb-free) packaging. The FG400 package uses matte tin finish on solder balls, meeting JEDEC J-STD-020 moisture sensitivity level 3 and IPC/JEDEC standard for lead-free assembly processes.
XC3S400A-4FG400I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3A
- Package/Case:
- 400-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 896
- Number of Logic Elements/Cells:
- 8064
- Total RAM Bits:
- 368640
- Number of I/O:
- 311
- Number of Gates:
- 400000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 400-FBGA (21x21)
XC3S400A-4FG400I FAQ
1.How can I place an order for XC3S400A-4FG400I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S400A-4FG400I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S400A-4FG400I reliable?
The price and inventory of XC3S400A-4FG400I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S400A-4FG400I is usually 5 days.
3.What payment methods are accepted for XC3S400A-4FG400I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S400A-4FG400I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S400A-4FG400I?
XC3S400A-4FG400I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S400A-4FG400I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S400A-4FG400I?
For technical support, including XC3S400A-4FG400I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S400A-4FG400I requirements.
6.How does Aetrix verify that XC3S400A-4FG400I is sourced from the original manufacturer or authorized distributors?
All XC3S400A-4FG400I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S400A-4FG400I meets industry standards.
7.What is the process for return or replacement of XC3S400A-4FG400I?
All XC3S400A-4FG400I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S400A-4FG400I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S400A-4FG400I part is unused and in its original packaging.
Return procedure for XC3S400A-4FG400I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC3S400A-4FG400I Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
