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AMD XC3S400A-4FGG320I
- Part No.:
- XC3S400A-4FGG320I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 320-BGA
- Datasheet:
-
XC3S400A-4FGG320I.pdf
- Description:
- IC FPGA 251 I/O 320FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:103
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Product details
Overview
XC3S400A-4FGG320I from AMD (formerly Xilinx) is a Spartan-3A FPGA with 400,000 system gates, 216 I/O pins, and a -4 speed grade in a 320-pin Fine-Pitch Ball Grid Array (FBGA) package. It integrates 8,064 logic cells, 288 Kbits of block RAM, and supports LVCMOS25/LVCMOS33 I/O standards for embedded control and interface bridging in industrial automation systems.
For engineers reviewing the XC3S400A-4FGG320I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage compatibility, configuration mode support (Master Serial, Slave SelectMAP), and availability of dedicated clock routing resources for deterministic timing closure.
Technical Context
The XC3S400A-4FGG320I implements a configurable logic fabric based on 4-input LUTs and distributed RAM, with dedicated carry chains for arithmetic functions. It includes twelve 18×18 multipliers and supports Digital Clock Managers (DCMs) for input clock multiplication, division, phase shifting, and duty cycle correction.
Configuration is performed via external SPI PROM or JTAG boundary-scan, with support for fallback configuration and readback capability. The device operates over industrial temperature range (–40°C to +85°C) and requires 1.2 V core supply and 2.5 V or 3.3 V I/O supply depending on bank configuration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 8,064 - provides combinational and sequential logic capacity for medium-complexity control state machines and data path logic |
| System Gates | 400,000 - indicates overall logic density suitable for protocol translation and peripheral interfacing |
| I/O Pins | 216 - supports high-pin-count parallel interfaces such as SRAM, SDRAM, or custom bus protocols |
| Block RAM | 288 Kbits - enables on-chip buffering for FIFOs, lookup tables, or small frame buffers without external memory |
| Speed Grade | -4 - guarantees timing performance up to 450 MHz for internal logic paths under worst-case industrial conditions |
| DCM Units | 4 - allows independent clock domain management for multiple peripherals with jitter tolerance < ±100 ps |
| Operating Temp | –40°C to +85°C - validated for use in factory-floor PLCs and motor drive controllers |
Pinout & Package
XC3S400A-4FGG320I is housed in a 320-ball Fine-Pitch Ball Grid Array (FBGA) package with 1.0 mm ball pitch, 19×19 array, and thermal pad. Package dimensions are 19 mm × 19 mm × 1.55 mm (height).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply - must be set to 2.5 V or 3.3 V matching connected peripheral voltage |
| H2 | GCLK0 | Dedicated global clock input - low-skew routing to all DCMs and logic regions |
| K1 | M0 | Configuration mode select - sets Master Serial mode when pulled High during power-up |
| L2 | TCK | JTAG test clock - required for boundary-scan testing and in-system programming |
| P1 | INIT_B | Open-drain initialization status - asserted Low during configuration, High when complete and valid |
| R1 | CCLK | Configuration clock - generated internally in Master Serial mode or driven externally in Slave modes |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated DCMs | Four independent digital clock managers enable precise clock synthesis without external PLL ICs |
| SelectIO Technology | Supports mixed-voltage I/O banks with programmable drive strength and slew rate per pin |
| Embedded Multipliers | Twelve 18×18 signed/unsigned multipliers accelerate math-intensive control algorithms |
| Configuration Security | Bitstream encryption option prevents reverse engineering of FPGA configuration data |
| Power-Down Mode | Reduces static current by >90% during idle periods while retaining configuration state |
Applications
| Industrial PLC I/O Module | Motor Drive Interface Controller |
|---|---|
Use Scenario: Real-time monitoring and control of discrete sensors and actuators in modular PLC backplanes. IC Role / Device Role / Timing Role: FPGA acts as protocol bridge between fieldbus (e.g., Profibus DP) and local microcontroller, managing timing-critical I/O scanning at 10 ms intervals. Use Value: 216 I/O pins and deterministic DCM-based clocking ensure synchronized sampling across 64+ digital inputs without external timing ICs. | Use Scenario: Isolated gate driver signal conditioning and PWM generation for 3-phase inverter stages. IC Role / Device Role / Timing Role: Configurable logic generates dead-time-controlled complementary PWM pairs with sub-10 ns resolution using carry-chain delay lines. Use Value: On-chip 18×18 multipliers compute space-vector modulation coefficients in real time, reducing MCU computational load. |
| Medical Imaging Data Formatter | Test Equipment Pattern Generator |
Use Scenario: Aggregation and serialization of parallel ADC outputs from ultrasound transducer arrays. IC Role / Device Role / Timing Role: FPGA serves as high-speed data formatter, applying channel gain correction and packing 12-bit samples into LVDS streams for FPGA-to-FPGA transfer. Use Value: 288 Kbits of block RAM buffers one full scan line (1,024 × 12-bit) before transmission, eliminating external FIFOs. | Use Scenario: Generation of programmable digital stimulus patterns for IC functional validation. IC Role / Device Role / Timing Role: FPGA implements pattern sequencer with variable-depth loop nesting and glitch-free pin state transitions. Use Value: -4 speed grade ensures setup/hold margins >1.2 ns at 100 MHz pattern rates, enabling reliable test coverage for 74-series logic devices. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based control and interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S500E-4FG320C | Higher logic density (11,264 LCs), no DCMs, commercial temp range (0°C to +70°C) | Suitable for lab-grade test equipment but not industrial ambient operation | Choose only if higher gate count is needed and thermal environment is controlled |
| XC6SLX45-3CSG324C | 45K logic cells, 6-input LUTs, integrated PCIe block, -3 speed grade | Requires PCB redesign due to different pinout and 324-pin CSBGA package | Consider for new designs needing PCI Express endpoint capability and lower static power |
Compared with XC3S400A-4FGG320I, XC3S500E-4FG320C offers more logic but lacks DCMs and industrial temperature rating, while XC6SLX45-3CSG324C delivers greater scalability and modern features at the cost of migration effort and higher BOM cost.
Availability
XC3S400A-4FGG320I is available at Aetrix Electronics and suitable for industrial automation, motor control, and medical imaging equipment requiring stable component supply and long-term lifecycle support.
Supply support for XC3S400A-4FGG320I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, MPSoCs, and ACAPs for high-performance embedded and datacenter applications.
The Spartan-3A family was designed specifically for cost-sensitive, high-volume industrial and automotive interface applications where predictable timing, low power, and robust configuration security are essential.
FAQ
What is the maximum operating frequency supported by XC3S400A-4FGG320I?
The XC3S400A-4FGG320I has a -4 speed grade, guaranteeing internal logic performance up to 450 MHz under worst-case industrial temperature and voltage conditions. Actual achievable frequency depends on design placement, routing, and clock domain constraints - verified timing analysis must be performed using Xilinx ISE 14.7 or later tools with the XC3S400A-4FGG320I device model.
Does XC3S400A-4FGG320I support JTAG programming and debugging?
Yes, XC3S400A-4FGG320I fully supports IEEE 1149.1 JTAG boundary-scan for in-system programming, configuration verification, and debug access. Pins TCK, TMS, TDI, and TDO are dedicated and electrically compatible with standard JTAG adapters. Configuration bitstream can be loaded directly via JTAG or used alongside Master Serial mode for fallback recovery.
What I/O standards are supported by XC3S400A-4FGG320I?
XC3S400A-4FGG320I supports LVCMOS18, LVCMOS25, LVCMOS33, LVTTL, PCI, and SSTL2 I/O standards across its 12 configurable I/O banks. Each bank operates independently at either 1.8 V, 2.5 V, or 3.3 V, allowing mixed-voltage interfacing with legacy and modern peripherals without level-shifting components.
Is XC3S400A-4FGG320I qualified for industrial temperature operation?
Yes, XC3S400A-4FGG320I is specified for industrial temperature range (–40°C to +85°C) and undergoes extended burn-in and parametric testing per Xilinx qualification standards. The "I" suffix explicitly denotes industrial-grade qualification, making it suitable for deployment in uncontrolled environments such as factory floors and outdoor control cabinets.
Can XC3S400A-4FGG320I be configured using an external SPI PROM?
Yes, XC3S400A-4FGG320I supports Master Serial configuration mode, where the FPGA automatically clocks out CCLK and reads configuration data from a standard 4-wire SPI PROM (e.g., XCF02S or third-party compatible). This method enables single-chip, power-on autonomous configuration without host processor involvement.
XC3S400A-4FGG320I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3A
- Package/Case:
- 320-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 896
- Number of Logic Elements/Cells:
- 8064
- Total RAM Bits:
- 368640
- Number of I/O:
- 251
- Number of Gates:
- 400000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 320-FBGA (19x19)
XC3S400A-4FGG320I FAQ
1.How can I place an order for XC3S400A-4FGG320I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S400A-4FGG320I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S400A-4FGG320I reliable?
The price and inventory of XC3S400A-4FGG320I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S400A-4FGG320I is usually 5 days.
3.What payment methods are accepted for XC3S400A-4FGG320I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S400A-4FGG320I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S400A-4FGG320I?
XC3S400A-4FGG320I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S400A-4FGG320I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S400A-4FGG320I?
For technical support, including XC3S400A-4FGG320I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S400A-4FGG320I requirements.
6.How does Aetrix verify that XC3S400A-4FGG320I is sourced from the original manufacturer or authorized distributors?
All XC3S400A-4FGG320I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S400A-4FGG320I meets industry standards.
7.What is the process for return or replacement of XC3S400A-4FGG320I?
All XC3S400A-4FGG320I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S400A-4FGG320I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S400A-4FGG320I part is unused and in its original packaging.
Return procedure for XC3S400A-4FGG320I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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