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AMD XC3S400A-4FT256C
- Part No.:
- XC3S400A-4FT256C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC3S400A-4FT256C.pdf
- Description:
- IC FPGA 195 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,373
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Product details
Overview
XC3S400A-4FT256C from AMD (formerly Xilinx) is a Spartan-3A FPGA with 400,000 system gates, 8,064 logic cells, and 216 I/O pins in a 256-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at -4 speed grade (tPD = 4.8 ns), supports SelectIO standards up to 622 Mbps, and targets cost-sensitive embedded control and interface bridging applications.
For engineers reviewing the XC3S400A-4FT256C datasheet, pinout, applications, or equivalent options, key selection factors include I/O voltage support (1.2V/2.5V/3.3V), configuration mode compatibility (Master Serial, Slave Parallel), and internal block RAM capacity (288 Kbits).
Technical Context
The XC3S400A-4FT256C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated multipliers. It integrates eight Digital Clock Managers (DCMs) supporting frequency synthesis, phase shifting, and duty cycle correction across multiple clock domains.
Configuration is performed via external PROM or processor-controlled slave parallel mode. The device supports JTAG boundary-scan testing per IEEE 1149.1 and includes internal startup circuitry with programmable configuration timeout and power-on reset behavior.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 8,064 - provides combinational and sequential logic resources for custom digital functions |
| System Gates | 400,000 - indicates total equivalent gate count for logic density estimation |
| I/O Pins | 216 - supports high-pin-count interface bridging and multi-protocol connectivity |
| Block RAM | 288 Kbits - enables on-chip data buffering, FIFOs, and small lookup tables without external memory |
| DCMs | 8 - delivers clock synthesis, skew management, and jitter reduction for synchronous subsystems |
| Speed Grade | -4 - guarantees maximum propagation delay of 4.8 ns for CLB-to-CLB paths |
| I/O Standards | LVTTL, LVCMOS, PCI, HSTL, SSTL - allows direct interfacing with legacy and modern peripherals |
Pinout & Package
XC3S400A-4FT256C is housed in a 256-ball Fine-Pitch Ball Grid Array (FT256) package with 1.0 mm ball pitch, 17 mm × 17 mm body size, and standard JEDEC MO-251 footprint. Thermal pad is not present; package is RoHS-compliant and lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.2 V core supply input for logic and CLB operation |
| P2 | VCCAUX | 2.5 V auxiliary supply for configuration circuitry and DCMs |
| A1 | VCCO_0 | 3.3 V I/O bank supply for Bank 0 (pins A1–D12) |
| T14 | PROGRAM_B | Active-low asynchronous reset that clears configuration memory and initiates reload |
| R15 | INIT_B | Open-drain status output indicating configuration progress and CRC error detection |
| T15 | DONE | Open-drain output signaling successful configuration completion and enabling I/O release |
Key Features
| Feature | Design Value |
|---|---|
| Multi-Voltage I/O Banks | Four independent I/O banks support mixed-voltage operation (1.2V/2.5V/3.3V) simultaneously |
| Dedicated Digital Clock Managers (DCMs) | Eight DCMs provide jitter-free clock multiplication, division, and phase alignment without external PLLs |
| Configurable Logic Blocks (CLBs) | Each CLB contains four 3-input LUTs and eight flip-flops, enabling efficient arithmetic and state-machine implementation |
| Embedded Block RAM | 288 Kbits distributed across 36 × 8 Kbit blocks, usable as dual-port RAM or shift registers |
| Boundary-Scan Support | IEEE 1149.1-compliant TAP controller enables in-system test and debug without physical probe access |
Applications
| Industrial PLC I/O Expansion | Video Interface Bridge |
|---|---|
Use Scenario: Adding isolated digital I/O and analog signal conditioning to legacy PLC backplanes. IC Role / Device Role / Timing Role: FPGA fabric implements protocol translation between Modbus RTU and proprietary sensor bus, with DCMs synchronizing ADC sampling clocks. Use Value: Enables field-upgradable logic without redesigning PCB layout or replacing controller CPU. | Use Scenario: Converting HDMI 1.3a video streams to LVDS for industrial panel displays. IC Role / Device Role / Timing Role: XC3S400A-4FT256C performs pixel re-timing, color space conversion, and embedded clock recovery using I/O SERDES capability. Use Value: Eliminates need for separate timing ICs and reduces BOM count by integrating serializer/deserializer logic. |
| Medical Imaging Data Aggregation | Automotive Diagnostic Gateway |
Use Scenario: Consolidating raw sensor data from ultrasound transducer arrays into a unified PCIe stream. IC Role / Device Role / Timing Role: XC3S400A-4FT256C manages time-aligned DMA transfers from multiple ADC interfaces and applies real-time beamforming coefficients. Use Value: Achieves deterministic latency under 200 ns for critical imaging pipeline stages. | Use Scenario: Translating UDS (ISO 14229) commands between CAN FD and LIN networks in vehicle ECUs. IC Role / Device Role / Timing Role: XC3S400A-4FT256C implements dual-CAN controller logic with message filtering, buffering, and protocol arbitration. Use Value: Supports concurrent diagnostic sessions across multiple vehicle subsystems without host CPU intervention. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Xilinx XC3S500E-4FT256C | Higher logic density (11,648 CLBs), same FT256 package, but requires higher VCCINT current and larger thermal margin | Better suited for designs requiring additional DSP slices or deeper FIFOs | Select when XC3S400A-4FT256C resource utilization exceeds 85% in place-and-route |
| Lattice LFXP2-8E-6FTN256C | FPGA with 7.5K LUTs, integrated flash, single-chip configuration, but lacks DCMs and has lower I/O drive strength | Preferred for ultra-low-power, fast-startup applications where clock management is handled externally | Choose when eliminating external configuration PROM and reducing boot time are primary requirements |
Compared with XC3S400A-4FT256C, the XC3S500E-4FT256C offers headroom for logic growth but increases power and thermal design complexity, while the LFXP2-8E-6FTN256C simplifies system boot architecture at the expense of on-die clock synthesis capability.
Availability
XC3S400A-4FT256C is available at Aetrix Electronics and suitable for industrial automation, medical instrumentation, and automotive diagnostics requiring stable component supply and long-term lifecycle support.
Supply support for XC3S400A-4FT256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and related software tools for heterogeneous compute acceleration.
The Spartan-3A family was designed for cost-optimized, high-volume embedded applications requiring reliable I/O flexibility, moderate logic density, and low static power consumption.
FAQ
What configuration modes does the XC3S400A-4FT256C support?
The XC3S400A-4FT256C supports Master Serial (via on-board PROM), Slave Parallel (controlled by external microprocessor), and JTAG boundary-scan configuration. It does not support Master SelectMAP or BPI modes. Configuration bitstream is loaded into SRAM-based fabric, requiring re-initialization after power cycle. XC3S400A-4FT256C uses standard Xilinx .bit files generated by ISE Design Suite 14.7 or earlier.
Does the XC3S400A-4FT256C include internal oscillators for startup clocking?
No, the XC3S400A-4FT256C does not contain internal RC oscillators. It relies on external clock sources for DCM operation and configuration clocking. During power-up, the device uses an internal oscillator only for the configuration state machine's timing - this is not user-accessible or configurable. XC3S400A-4FT256C requires an external clock or crystal for functional operation post-configuration.
What is the maximum supported I/O standard speed for XC3S400A-4FT256C?
The XC3S400A-4FT256C supports data rates up to 622 Mbps for differential standards like LVDS and RSDS, and up to 220 MHz for single-ended standards such as LVTTL and LVCMOS. These values are guaranteed at -4 speed grade under specified voltage and temperature conditions. XC3S400A-4FT256C achieves this using dedicated I/O logic with programmable slew rate and drive strength controls.
Can XC3S400A-4FT256C be used in automotive AEC-Q100 qualified systems?
No, the XC3S400A-4FT256C is rated for commercial and industrial temperature ranges (0°C to 85°C), not automotive-grade qualification. It lacks AEC-Q100 stress testing, extended temperature screening (-40°C to 125°C), and automotive-specific reliability reporting. XC3S400A-4FT256C may be used in non-safety-critical aftermarket automotive equipment, but not in OEM powertrain or ADAS modules requiring formal qualification.
How many global clock networks does XC3S400A-4FT256C provide?
The XC3S400A-4FT256C provides eight global clock networks driven by its eight Digital Clock Managers (DCMs). Each DCM connects to two dedicated global clock buffers (BUFG), allowing up to 16 simultaneous low-skew clock domains. These networks distribute clocks with < ±150 ps skew across the die. XC3S400A-4FT256C does not support regional or I/O clock routing outside these global networks.
XC3S400A-4FT256C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3A
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 896
- Number of Logic Elements/Cells:
- 8064
- Total RAM Bits:
- 368640
- Number of I/O:
- 195
- Number of Gates:
- 400000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC3S400A-4FT256C FAQ
1.How can I place an order for XC3S400A-4FT256C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S400A-4FT256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S400A-4FT256C reliable?
The price and inventory of XC3S400A-4FT256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S400A-4FT256C is usually 5 days.
3.What payment methods are accepted for XC3S400A-4FT256C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S400A-4FT256C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S400A-4FT256C?
XC3S400A-4FT256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S400A-4FT256C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S400A-4FT256C?
For technical support, including XC3S400A-4FT256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S400A-4FT256C requirements.
6.How does Aetrix verify that XC3S400A-4FT256C is sourced from the original manufacturer or authorized distributors?
All XC3S400A-4FT256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S400A-4FT256C meets industry standards.
7.What is the process for return or replacement of XC3S400A-4FT256C?
All XC3S400A-4FT256C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S400A-4FT256C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S400A-4FT256C part is unused and in its original packaging.
Return procedure for XC3S400A-4FT256C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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