AMD XC3S400A-4FT256I
- Part No.:
- XC3S400A-4FT256I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC3S400A-4FT256I.pdf
- Description:
- IC FPGA 195 I/O 256FTBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC3S400A-4FT256I from AMD (formerly Xilinx) is a Spartan-3A FPGA with 400,000 system gates, 8,064 logic cells, and 216 I/O pins in a 256-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at -4 speed grade (1.57 ns CLB delay), supports SelectIO™ standards up to 622 Mbps, and targets cost-sensitive industrial control and communication interface logic.
For engineers reviewing the XC3S400A-4FT256I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage flexibility (1.2 V to 3.3 V), embedded block RAM capacity (216 kbits), and support for DDR/DDR2 SDRAM interfaces in resource-constrained designs.
Technical Context
The XC3S400A-4FT256I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated carry logic. It integrates eight Digital Clock Managers (DCMs) supporting phase shifting, frequency synthesis, and duty cycle correction across multiple clock domains.
Configuration is performed via Master Serial mode using external PROM or JTAG boundary-scan. The device supports IEEE 1149.1 compliance and includes internal configuration monitoring with CRC error detection for bitstream integrity verification.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 8,064 - provides combinational and sequential logic resources for medium-complexity digital functions |
| System Gates | 400,000 - indicates total logic capacity compatible with ASIC gate-count estimation methods |
| Block RAM | 216 kbits - enables local data buffering, FIFOs, or small lookup tables without external memory |
| I/O Pins | 216 - supports high-pin-count peripheral interfacing with bank-wise voltage isolation |
| DCM Units | 8 - allows independent clock domain management including multiplication, division, and phase alignment |
| Speed Grade | -4 - guarantees 1.57 ns CLB propagation delay under worst-case industrial temperature conditions |
| Operating Temp | -40°C to +100°C - qualified for extended industrial environments without derating |
Pinout & Package
XC3S400A-4FT256I is housed in a 256-ball fine-pitch BGA (FT256) package with 1.0 mm ball pitch, 17 mm × 17 mm body size, and thermal pad exposed on underside for enhanced heat dissipation in sustained logic operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core Power Supply | 1.2 V supply for internal logic; requires low-noise regulation and local decoupling |
| VCCO_0–VCCO_5 | I/O Bank Power | Independent 1.2–3.3 V supplies per I/O bank enabling mixed-voltage interface design |
| PROGRAM_B | Configuration Initiate | Active-low signal that resets configuration logic and clears internal SRAM upon assertion |
| DONE | Configuration Status | Open-drain output indicating successful bitstream loading and device readiness |
| TCK/TMS/TDI/TDO | JTAG Boundary-Scan | IEEE 1149.1-compliant test access port for programming and debug verification |
Key Features
| Feature | Design Value |
|---|---|
| SelectIO™ Technology | Supports LVCMOS, LVTTL, PCI, HSTL, SSTL, and differential standards with programmable drive strength and slew rate |
| Digital Clock Manager (DCM) | Eight fully independent DCMs provide jitter-free clock synthesis, phase alignment, and frequency multiplication/division |
| Embedded Multiplier Blocks | Four 18×18-bit multipliers enable efficient arithmetic-intensive functions like FIR filtering or motor control algorithms |
| Configuration Security | Bitstream encryption option prevents unauthorized readback and cloning of programmed logic functionality |
| Power-Down Mode | Reduces static current by >90% during idle periods while retaining configuration state for fast wake-up |
Applications
| Industrial PLC I/O Module | Legacy Bus Bridge Interface |
|---|---|
Use Scenario: Real-time digital I/O expansion in programmable logic controllers with fieldbus connectivity. IC Role / Device Role / Timing Role: FPGA fabric implements custom timing engines, protocol state machines, and parallel-to-serial conversion for Modbus RTU and CANopen physical layer adaptation. Use Value: Enables deterministic sub-millisecond response latency and flexible pin mapping for sensor/actuator aggregation without ASIC redesign. | Use Scenario: Translation between ISA, PCI, and modern microcontroller buses in retro-computing or test equipment upgrades. IC Role / Device Role / Timing Role: Configurable glue logic synchronizes asynchronous bus handshaking, manages address decoding, and buffers data across voltage-domain boundaries. Use Value: Eliminates need for multiple discrete logic ICs while supporting legacy timing specifications (e.g., ISA tAS ≥ 12 ns) via precise CLB delay control. |
| Video Signal Formatter | Motor Control Encoder Interface |
Use Scenario: Pixel clock generation, sync pulse insertion, and RGB-to-YUV format conversion in embedded display subsystems. IC Role / Device Role / Timing Role: DCM-based pixel clock synthesis and dual-edge capture logic for parallel video data sampling at up to 65 MHz. Use Value: Achieves stable 720p60 timing compliance using internal PLL resources without external clock synthesizers or delay lines. | Use Scenario: Quadrature encoder signal conditioning and position calculation in servo drives and CNC motion controllers. IC Role / Device Role / Timing Role: High-speed counter logic with direction detection, index pulse filtering, and 32-bit accumulator implemented in distributed RAM and carry chains. Use Value: Delivers 100 kHz quadrature input handling with <1 µs jitter tolerance, exceeding typical resolver-to-digital converter performance at lower BOM cost. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S500E-4FT256C | Higher logic density (12,480 LCs), same FT256 package, but commercial temp range (0°C to +85°C) and no encryption support | Better suited for non-industrial, higher-gate-count designs where security and extended temperature are not required | Select when additional logic resources are needed and environmental qualification is relaxed |
| XC6SLX9-2TQG144C | Lower density (9,152 LUTs), smaller 144-pin TQFP package, Spartan-6 architecture with improved power efficiency and DDR3 support | Preferred for new designs requiring lower static power, DDR3 memory interface, or simplified PCB layout | Choose for migration paths where footprint reduction and modern memory support outweigh legacy toolchain compatibility |
Compared with XC3S400A-4FT256I, the XC3S500E-4FT256C offers more logic but sacrifices industrial temperature rating and bitstream security, while the XC6SLX9-2TQG144C provides better power efficiency and DDR3 capability in a smaller footprint-making it suitable for next-generation cost-optimized embedded systems where Spartan-3A toolchain dependency is not mandatory.
Availability
XC3S400A-4FT256I is available at Aetrix Electronics and suitable for industrial automation, legacy system upgrades, and embedded video processing requiring stable component supply over extended production lifecycles.
Supply support for XC3S400A-4FT256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains the Spartan FPGA product family for cost-optimized, high-volume programmable logic applications.
The Spartan-3A series was designed specifically for industrial control, communications infrastructure, and video interface applications where predictable timing, I/O flexibility, and long-term availability are critical.
FAQ
What is the maximum supported I/O standard voltage for XC3S400A-4FT256I?
XC3S400A-4FT256I supports I/O voltages from 1.2 V to 3.3 V across six independently powered I/O banks. Each bank's VCCO setting determines compatible standards-e.g., 3.3 V enables LVTTL and LVCMOS33, while 1.8 V supports SSTL18. This allows mixed-voltage interface design without level shifters. The XC3S400A-4FT256I datasheet specifies absolute maximum ratings and recommended operating conditions per bank.
Does XC3S400A-4FT256I support JTAG boundary-scan testing?
Yes, XC3S400A-4FT256I fully complies with IEEE 1149.1 (JTAG) for boundary-scan testing and in-system programming. Its TCK, TMS, TDI, and TDO pins implement standard test access port functionality, enabling automated PCB test, configuration verification, and debug access. The XC3S400A-4FT256I also supports JTAG-based partial reconfiguration in supported toolchains.
How many Digital Clock Managers (DCMs) does XC3S400A-4FT256I include?
XC3S400A-4FT256I integrates eight Digital Clock Managers (DCMs), each capable of frequency synthesis, phase shifting, and duty cycle correction. These DCMs operate independently and support clock inputs up to 248 MHz. The XC3S400A-4FT256I uses them for generating multiple synchronized clocks required in video timing, communication protocols, and motor control loops.
Is XC3S400A-4FT256I pin-compatible with other Spartan-3A devices in FT256 packaging?
XC3S400A-4FT256I shares the same 256-ball FT256 footprint with XC3S200A-4FT256I and XC3S1000A-4FT256I, but pin functions differ due to varying I/O counts and internal routing. While mechanical mounting is identical, direct substitution requires verification of I/O bank assignments, power pin locations, and configuration pin placement. The XC3S400A-4FT256I pinout must be validated against its specific package drawing before board reuse.
What configuration modes are supported by XC3S400A-4FT256I?
XC3S400A-4FT256I supports Master Serial, Slave Serial, Slave Parallel, and JTAG configuration modes. Master Serial is most common, using an external SPI PROM to load the bitstream automatically on power-up. The XC3S400A-4FT256I also permits fallback to JTAG for development and field updates, with configuration status monitored via the DONE pin.
XC3S400A-4FT256I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3A
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 896
- Number of Logic Elements/Cells:
- 8064
- Total RAM Bits:
- 368640
- Number of I/O:
- 195
- Number of Gates:
- 400000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC3S400A-4FT256I FAQ
1.How can I place an order for XC3S400A-4FT256I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S400A-4FT256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S400A-4FT256I reliable?
The price and inventory of XC3S400A-4FT256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S400A-4FT256I is usually 5 days.
3.What payment methods are accepted for XC3S400A-4FT256I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S400A-4FT256I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S400A-4FT256I?
XC3S400A-4FT256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S400A-4FT256I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S400A-4FT256I?
For technical support, including XC3S400A-4FT256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S400A-4FT256I requirements.
6.How does Aetrix verify that XC3S400A-4FT256I is sourced from the original manufacturer or authorized distributors?
All XC3S400A-4FT256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S400A-4FT256I meets industry standards.
7.What is the process for return or replacement of XC3S400A-4FT256I?
All XC3S400A-4FT256I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S400A-4FT256I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S400A-4FT256I part is unused and in its original packaging.
Return procedure for XC3S400A-4FT256I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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