My Inquiry
My Account
AMD XC3S400A-4FTG256C
- Part No.:
- XC3S400A-4FTG256C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC3S400A-4FTG256C.pdf
- Description:
- IC FPGA 195 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,873
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC3S400A-4FTG256C from AMD (formerly Xilinx) is a Spartan-3A FPGA with 400,000 system gates, 216 I/O pins, and a 4 ns input-to-output delay in the FTG256 package. It integrates 8,064 logic cells, 720 Kbits of block RAM, and supports LVCMOS25/LVCMOS33 I/O standards for embedded control and interface bridging applications.
For engineers reviewing the XC3S400A-4FTG256C datasheet, pinout, applications, or equivalent options, key selection factors include I/O voltage flexibility, distributed RAM depth, global clock routing resources, and configuration mode support (Master Serial, Slave SelectMAP).
Technical Context
The XC3S400A-4FTG256C implements a fully static, 90 nm CMOS process FPGA architecture with configurable logic blocks (CLBs), dedicated multipliers, and digital clock managers (DCMs). It supports up to four DCMs per device for phase alignment, frequency synthesis, and duty cycle correction.
Configuration is performed via serial PROM, JTAG, or microprocessor bus interface using 1.2 V core voltage and programmable I/O banks operating at 1.2 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V levels - enabling mixed-voltage system integration without level shifters.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 8,064 - provides combinational and sequential logic capacity for medium-complexity control state machines and data path logic |
| System Gates | 400,000 - indicates total equivalent ASIC gate count for architectural sizing and resource estimation |
| Block RAM | 720 Kbits - enables on-chip FIFOs, buffers, and lookup tables without external memory |
| I/O Pins | 216 - supports high-pin-count peripheral interfacing including parallel buses and multi-channel ADC/DAC links |
| DCMs | 4 - allows independent clock domain management for video timing, data sampling, and synchronous bus handshaking |
| Max I/O Speed | 333 MHz - supports DDR2 SDRAM interfaces and high-speed serial link bridging |
| Core Voltage | 1.2 V - defines power delivery requirements and thermal budget for PCB layout and regulator selection |
Pinout & Package
XC3S400A-4FTG256C is housed in a 256-pin Fine-Pitch Thin Quad Flatpack (FTG) package with 0.5 mm pitch, 17 mm × 17 mm body size, and exposed thermal pad for enhanced thermal dissipation in industrial environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK3 | Global Clock Input | Dedicated low-skew routing to all CLBs and I/Os; essential for synchronous design timing closure |
| M0–M2 | Configuration Mode Select | Defines startup configuration method (e.g., Master Serial, Slave Parallel) |
| CCLK | Configuration Clock | Drives internal configuration logic during bitstream loading; externally driven in Master mode |
| DIN / INIT_B / PROGRAM_B | Configuration Data / Status / Reset | Serial bitstream input, configuration status flag, and hardware reset trigger for safe reconfiguration |
| VCCO_0–VCCO_5 | I/O Bank Supply | Independent voltage rails per I/O bank enable mixed-signal interface compatibility (e.g., 3.3 V MCU + 1.8 V sensor) |
Key Features
| Feature | Design Value |
|---|---|
| Digital Clock Managers (DCMs) | Four integrated DCMs provide jitter-reduced clock outputs, phase shifting, and frequency multiplication without external PLL ICs |
| SelectIO Technology | Programmable I/O standards per bank allow direct connection to diverse peripherals (LVDS, LVTTL, PCI, SSTL) without external level translators |
| Embedded Multipliers | 18 × 18-bit hard multipliers accelerate DSP functions like FIR filtering and motor control algorithms |
| Configurable Logic Blocks (CLBs) | Each CLB contains two slices with four LUTs and eight flip-flops, supporting efficient implementation of arithmetic and control logic |
| Power-Down Mode | Reduces dynamic power by disabling unused CLBs and I/O banks during idle cycles - critical for thermally constrained industrial enclosures |
Applications
| Industrial PLC I/O Module | Video Interface Bridge |
|---|---|
Use Scenario: Real-time digital I/O expansion for programmable logic controllers handling discrete sensors and actuators. IC Role / Device Role / Timing Role: FPGA acts as parallel-to-serial converter and protocol translator between fieldbus (e.g., Profibus DP) and backplane bus (e.g., PCI). Use Value: 216 I/O pins and 4 DCMs enable simultaneous timing-critical control of 32+ digital channels with deterministic response under 1 µs jitter. | Use Scenario: Converting legacy analog video signals (CVBS, S-Video) to digital HDMI output in media converters. IC Role / Device Role / Timing Role: FPGA performs pixel clock domain crossing, color space conversion (YUV to RGB), and HDMI TMDS encoding. Use Value: Block RAM and embedded multipliers support real-time line buffering and gamma correction, while 333 MHz I/O speed meets HDMI 1.3 pixel clock requirements. |
| Motor Control Encoder Interface | Communications Protocol Gateway |
Use Scenario: High-resolution quadrature encoder signal processing for servo drives and CNC motion controllers. IC Role / Device Role / Timing Role: FPGA implements dual 32-bit up/down counters with index pulse capture and direction validation logic. Use Value: Dedicated carry chains and 4 ns propagation delay ensure sub-microsecond position update latency across 4+ encoder channels. | Use Scenario: Translating between CAN 2.0B and RS-485 Modbus RTU in building automation gateways. IC Role / Device Role / Timing Role: FPGA manages dual-protocol state machines, CRC calculation, and baud rate adaptation. Use Value: Configurable I/O banks support both 5 V RS-485 transceivers and 3.3 V CAN controllers on same device, eliminating external voltage translation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S500A-4FTG256C | 500K system gates, 9,120 logic cells, 960 Kbits block RAM - higher density and memory capacity | Better suited for designs requiring larger state machines or deeper FIFOs (e.g., multi-axis motion profiling) | Select when additional logic or memory is needed beyond XC3S400A-4FTG256C's 400K gate capacity |
| XC3S200A-4FTG256C | 200K system gates, 4,160 logic cells, 360 Kbits block RAM - reduced logic and memory resources | Appropriate for cost-sensitive, lower-complexity control tasks (e.g., single-loop PID controller) | Choose for simpler designs where XC3S400A-4FTG256C resources are underutilized |
Compared with XC3S400A-4FTG256C, the XC3S500A-4FTG256C offers headroom for future feature expansion, while the XC3S200A-4FTG256C reduces BOM cost and power consumption where full 400K-gate capability is unnecessary.
Availability
XC3S400A-4FTG256C is available at Aetrix Electronics and suitable for industrial automation, video processing, and motor control applications requiring stable component supply and long-term manufacturability.
Supply support for XC3S400A-4FTG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Spartan FPGA family for cost-sensitive, high-volume embedded applications.
The Spartan-3A product line was designed for non-volatile, low-power, high-I/O-count control and interface applications in industrial, automotive, and communications equipment.
FAQ
What configuration modes does the XC3S400A-4FTG256C support?
The XC3S400A-4FTG256C supports Master Serial, Slave Serial, Slave SelectMAP, and JTAG configuration modes. M0–M2 pins determine the active mode at power-up. JTAG is used for debugging and in-system programming, while Master Serial enables standalone boot from SPI flash without external controller intervention - a key advantage in remote industrial deployments where XC3S400A-4FTG256C serves as the primary configuration host.
Does the XC3S400A-4FTG256C include on-chip memory for data buffering?
Yes, the XC3S400A-4FTG256C integrates 720 Kbits of block RAM distributed across 20 RAM blocks, each configurable as 18 Kbits. This enables implementation of dual-port FIFOs, coefficient tables, and frame buffers without external SRAM. In video bridge applications, XC3S400A-4FTG256C uses this RAM for line-based pixel storage during format conversion, reducing system latency and board space.
Can the XC3S400A-4FTG256C operate with mixed I/O voltages on the same device?
Yes, the XC3S400A-4FTG256C features six independently powered I/O banks (VCCO_0 through VCCO_5), each supporting selectable standards including LVCMOS25, LVCMOS33, LVTTL, and PCI. This allows direct interfacing with 3.3 V microcontrollers and 1.8 V ADCs on the same XC3S400A-4FTG256C device, eliminating level-shifter components and simplifying PCB routing in mixed-signal industrial modules.
What is the maximum operating temperature range for the XC3S400A-4FTG256C?
The XC3S400A-4FTG256C is rated for commercial (0°C to +70°C) and industrial (–40°C to +85°C) temperature grades. The 'C' suffix in XC3S400A-4FTG256C denotes the commercial grade. For extended-temperature operation, the industrial-grade variant XC3S400A-4FTG256I must be selected - critical for outdoor or enclosed industrial environments where XC3S400A-4FTG256C may exceed junction limits.
How many global clock networks does the XC3S400A-4FTG256C provide?
The XC3S400A-4FTG256C provides four dedicated global clock input pins (GCLK0–GCLK3), each feeding a low-skew clock distribution network spanning the entire die. These networks drive all CLBs, I/Os, and block RAM, ensuring timing predictability in multi-clock-domain designs such as motor control systems where XC3S400A-4FTG256C synchronizes PWM generation, encoder capture, and communication interfaces.
XC3S400A-4FTG256C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3A
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 896
- Number of Logic Elements/Cells:
- 8064
- Total RAM Bits:
- 368640
- Number of I/O:
- 195
- Number of Gates:
- 400000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC3S400A-4FTG256C FAQ
1.How can I place an order for XC3S400A-4FTG256C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S400A-4FTG256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S400A-4FTG256C reliable?
The price and inventory of XC3S400A-4FTG256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S400A-4FTG256C is usually 5 days.
3.What payment methods are accepted for XC3S400A-4FTG256C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S400A-4FTG256C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S400A-4FTG256C?
XC3S400A-4FTG256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S400A-4FTG256C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S400A-4FTG256C?
For technical support, including XC3S400A-4FTG256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S400A-4FTG256C requirements.
6.How does Aetrix verify that XC3S400A-4FTG256C is sourced from the original manufacturer or authorized distributors?
All XC3S400A-4FTG256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S400A-4FTG256C meets industry standards.
7.What is the process for return or replacement of XC3S400A-4FTG256C?
All XC3S400A-4FTG256C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S400A-4FTG256C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S400A-4FTG256C part is unused and in its original packaging.
Return procedure for XC3S400A-4FTG256C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC3S400A-4FTG256C Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
