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AMD XC3S400A-4FTG256I
- Part No.:
- XC3S400A-4FTG256I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC3S400A-4FTG256I.pdf
- Description:
- IC FPGA 195 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,540
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Product details
Overview
XC3S400A-4FTG256I from AMD (formerly Xilinx) is a Spartan-3A FPGA featuring 400,000 system gates, 216 I/O pins, and embedded block RAM totaling 216 kbits. It operates at -4 speed grade with industrial temperature range (-40°C to +85°C) and uses a 256-pin Fine-Pitch Ball Grid Array (FBGA) package. This device serves as a reconfigurable logic fabric for digital signal processing in industrial motion control systems.
For engineers reviewing the XC3S400A-4FTG256I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, block RAM capacity, speed grade timing compliance, and industrial-grade thermal reliability.
Technical Context
The XC3S400A-4FTG256I implements a fully SRAM-based configurable logic architecture with 8,064 configurable logic blocks (CLBs), each containing two slices with four LUTs and eight flip-flops. It supports SelectIO™ standards including LVCMOS, LVTTL, PCI, and HSTL I/O interfaces up to 333 Mbps.
This FPGA integrates twelve 18×18 multipliers for DSP-intensive tasks and includes dedicated carry logic for high-speed arithmetic. Configuration is performed via master serial mode using external PROM or through JTAG boundary-scan interface compliant with IEEE 1149.1.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 8,064 CLBs - provides scalable combinatorial and sequential logic resources for medium-complexity control and interface bridging |
| Block RAM | 216 kbits - enables on-chip buffering for video frame storage or protocol packet assembly without external memory |
| I/O Pins | 216 user I/O - supports parallel bus interfacing, multi-channel sensor aggregation, or FPGA-to-FPGA communication |
| Speed Grade | -4 - guarantees maximum clock frequency of 450 MHz for internal logic and 333 Mbps for I/O transitions under industrial conditions |
| Operating Temp | -40°C to +85°C - ensures reliable operation in factory automation enclosures and outdoor embedded cabinets |
| Package | 256-pin FTBGA (Fine-Pitch TBGA) - 17×17 mm body with 1.0 mm ball pitch, compatible with standard SMT reflow profiles |
Pinout & Package
XC3S400A-4FTG256I is housed in a 256-ball Fine-Pitch Thin BGA (FTBGA) package with 17×17 array, 1.0 mm ball pitch, and exposed thermal pad. Pin functions follow Xilinx Spartan-3A family conventions with dedicated configuration, clock, JTAG, and I/O banks.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply - must be decoupled locally to support mixed-voltage signaling (1.2V/1.5V/1.8V/2.5V/3.3V) |
| M1 | CLK0 | Dedicated global clock input - low-skew routing to all CLBs and block RAM for synchronous design timing closure |
| T12 | TDO | JTAG test data output - enables boundary-scan verification and in-system programming without external debug hardware |
| R13 | PROGRAM_B | Active-low configuration reset - initiates reconfiguration from external PROM or host processor upon assertion |
| P14 | DONE | Configuration status indicator - goes high when bitstream loading completes and device enters user mode |
Key Features
| Feature | Design Value |
|---|---|
| Multi-Voltage I/O Banks | Eight independent I/O banks support simultaneous 1.2V, 1.5V, 1.8V, 2.5V, and 3.3V signaling - eliminates level-shifter ICs in mixed-voltage systems |
| Dedicated Digital Clock Managers (DCMs) | Four DCMs provide jitter-reduced clock synthesis, phase shifting, and frequency multiplication - enables precise timing alignment across multiple subsystems |
| Embedded Multipliers | Twelve 18×18 signed multipliers - accelerate FIR filtering, motor control PWM generation, and real-time FFT computation |
| Configurable I/O Standards | Supports LVCMOS, LVTTL, PCI, SSTL, and HSTL - allows direct connection to microcontrollers, ADCs, DDR memory, and legacy peripherals |
Applications
| Industrial Motion Control | Automated Test Equipment (ATE) |
|---|---|
Use Scenario: Real-time closed-loop servo positioning with encoder feedback and PWM motor drive signals. IC Role / Device Role / Timing Role: FPGA fabric executes position loop calculation, generates synchronized PWM outputs, and manages encoder quadrature decoding. Use Value: 216 I/O pins enable concurrent connection to multiple axes; -4 speed grade ensures sub-microsecond loop latency. | Use Scenario: High-speed digital pattern generation and response capture for semiconductor device validation. IC Role / Device Role / Timing Role: Configurable logic implements programmable stimulus generators and response comparators with precise timing alignment. Use Value: Block RAM buffers test vectors on-chip; DCMs generate phase-aligned clocks for multi-site parallel testing. |
| Medical Imaging Interface | Communications Baseband Processing |
Use Scenario: Aggregation and preprocessing of ultrasound transducer channel data before transfer to host processor. IC Role / Device Role / Timing Role: FPGA performs channel synchronization, beamforming weighting, and data packing into standardized interfaces (e.g., PCIe or Camera Link). Use Value: Embedded multipliers accelerate real-time beamforming; multi-voltage I/O connects directly to analog front-end ADCs and digital back-end processors. | Use Scenario: Protocol adaptation and physical layer framing between RF transceivers and baseband processors in small-cell infrastructure. IC Role / Device Role / Timing Role: FPGA handles CRC insertion, scrambling, and burst scheduling per LTE/5G NR frame structure. Use Value: 216 kbits block RAM stores frame buffers; SelectIO™ compatibility supports direct interface to RFICs operating at 1.8V or 2.5V. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA logic and I/O resource applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S500A-4FTG256I | 500K-gate capacity, same package and speed grade, higher CLB count (10,464) and block RAM (288 kbits) | Better suited for designs requiring additional logic density or larger on-chip data buffers | Select when future scalability or increased algorithm complexity is anticipated without PCB redesign |
| XC3S200A-4FTG256I | 200K-gate capacity, same package and speed grade, reduced CLBs (4,160) and block RAM (144 kbits) | Optimized for cost-sensitive applications with lower logic utilization and simpler I/O requirements | Choose for fixed-function control tasks where XC3S400A-4FTG256I resources are underutilized |
Compared with XC3S500A-4FTG256I and XC3S200A-4FTG256I, the XC3S400A-4FTG256I delivers balanced logic density, I/O count, and memory resources for mid-tier industrial control and instrumentation-avoiding overdesign while maintaining headroom for firmware updates and feature expansion.
Availability
XC3S400A-4FTG256I is available at Aetrix Electronics and suitable for industrial motion control, automated test equipment, and medical imaging interface applications requiring stable component supply and long-term lifecycle support.
Supply support for XC3S400A-4FTG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.
The Spartan-3A family was designed by Xilinx to deliver cost-optimized, high-performance reconfigurable logic for industrial, automotive, and communications applications with robust I/O flexibility and industrial temperature support.
FAQ
What is the maximum operating frequency supported by XC3S400A-4FTG256I?
The XC3S400A-4FTG256I has a -4 speed grade, guaranteeing a maximum internal clock frequency of 450 MHz and I/O toggle rates up to 333 Mbps under industrial temperature conditions. These values are verified in Xilinx's Spartan-3A data sheet DS312 (v1.5) and apply to properly constrained and routed designs meeting timing closure requirements.
Does XC3S400A-4FTG256I support JTAG programming?
Yes, XC3S400A-4FTG256I supports IEEE 1149.1-compliant JTAG boundary-scan for in-system programming, debugging, and configuration verification. Pins TDI, TDO, TCK, TMS, and TRST are dedicated for this interface, enabling configuration without external PROM or host processor involvement.
What I/O standards are supported by XC3S400A-4FTG256I?
XC3S400A-4FTG256I supports LVCMOS, LVTTL, PCI, SSTL, and HSTL I/O standards across its eight independently powered I/O banks. Each bank can be set to 1.2V, 1.5V, 1.8V, 2.5V, or 3.3V, allowing direct interfacing with diverse peripheral families without external level shifters.
Is XC3S400A-4FTG256I qualified for industrial temperature operation?
Yes, XC3S400A-4FTG256I is specified for industrial temperature range (-40°C to +85°C) and marked with the "I" suffix to indicate industrial qualification. Thermal performance is validated per Xilinx specification DS312, including junction temperature derating and package-level thermal resistance measurements.
How much block RAM does XC3S400A-4FTG256I provide?
XC3S400A-4FTG256I provides 216 kbits of total embedded block RAM, distributed across 24 block RAM primitives (each 18 kbits). This capacity supports dual-port FIFOs, coefficient tables for filtering, or frame buffers in image processing pipelines without external memory access.
XC3S400A-4FTG256I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3A
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 896
- Number of Logic Elements/Cells:
- 8064
- Total RAM Bits:
- 368640
- Number of I/O:
- 195
- Number of Gates:
- 400000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC3S400A-4FTG256I FAQ
1.How can I place an order for XC3S400A-4FTG256I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S400A-4FTG256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S400A-4FTG256I reliable?
The price and inventory of XC3S400A-4FTG256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S400A-4FTG256I is usually 5 days.
3.What payment methods are accepted for XC3S400A-4FTG256I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S400A-4FTG256I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S400A-4FTG256I?
XC3S400A-4FTG256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S400A-4FTG256I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S400A-4FTG256I?
For technical support, including XC3S400A-4FTG256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S400A-4FTG256I requirements.
6.How does Aetrix verify that XC3S400A-4FTG256I is sourced from the original manufacturer or authorized distributors?
All XC3S400A-4FTG256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S400A-4FTG256I meets industry standards.
7.What is the process for return or replacement of XC3S400A-4FTG256I?
All XC3S400A-4FTG256I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S400A-4FTG256I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S400A-4FTG256I part is unused and in its original packaging.
Return procedure for XC3S400A-4FTG256I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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