My Inquiry
My Account
AMD XC3S400AN-4FG400C
- Part No.:
- XC3S400AN-4FG400C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 400-BGA
- Datasheet:
-
XC3S400AN-4FG400C.pdf
- Description:
- IC FPGA 311 I/O 400FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,142
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC3S400AN-4FG400C from AMD (formerly Xilinx) is a Spartan-3A FPGA with 400,000 system gates, 8,064 logic cells, and 216 I/O pins in a 400-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at -4 speed grade (tPD = 4.5 ns), supports SelectIO™ standards up to 622 Mbps, and targets cost-sensitive embedded control and interface bridging applications.
For engineers reviewing the XC3S400AN-4FG400C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage flexibility (1.2 V to 3.3 V), embedded block RAM (360 kbits), and support for DDR/DDR2 SDRAM interfaces in industrial automation and communications infrastructure designs.
Technical Context
The XC3S400AN-4FG400C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated multipliers. It integrates eight Digital Clock Managers (DCMs) for phase-matched clock synthesis, jitter reduction, and frequency multiplication/division across multiple domains.
It supports IEEE 1149.1 JTAG boundary-scan testing and includes internal configuration memory with fallback capability. Configuration is performed via Master Serial, Slave Serial, or Boundary Scan modes using external PROM or processor-controlled interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 8,064 - provides combinational and sequential logic capacity for medium-complexity digital controllers |
| System Gates | 400,000 - indicates total equivalent gate count for ASIC comparison and resource estimation |
| Block RAM | 360 kbits - enables on-chip data buffering, FIFOs, and small lookup tables without external memory |
| I/O Pins | 216 - supports high-density peripheral interfacing with bank-wise voltage isolation |
| DCM Units | 8 - delivers clock deskew, duty-cycle correction, and frequency synthesis for multi-clock domain systems |
| Speed Grade | -4 - guarantees maximum propagation delay of 4.5 ns for critical path timing closure |
| Configuration Mode | Master/Slave Serial, JTAG - enables flexible boot sources including SPI PROM or host processor initialization |
Pinout & Package
XC3S400AN-4FG400C is housed in a 400-pin Fine-Pitch Ball Grid Array (FBGA) package with 27 × 27 mm body size, 0.8 mm ball pitch, and Pb-free (RoHS-compliant) finish. The package supports thermal dissipation up to 1.8 W under typical operating conditions.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.2 V core supply input - must be filtered and decoupled locally to meet noise tolerance |
| P2 | VCCAUX | 2.5 V auxiliary supply for configuration and DCM circuitry |
| A1 | TCK | JTAG test clock input - synchronizes boundary-scan operations during programming and debug |
| B1 | TMS | JTAG test mode select - controls state transitions in the TAP controller |
| C1 | TDI | JTAG test data input - serially loads instruction and configuration data |
| D1 | TDO | JTAG test data output - serially outputs status and readback data |
| E1 | INIT_B | Open-drain initialization status - asserts low during configuration and releases upon successful load |
| F1 | CCLK | Configuration clock output - generated by FPGA during Master Serial mode to drive external PROM |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated Multipliers | Four 18 × 18-bit two's complement multipliers enable real-time DSP filtering without LUT resource overhead |
| SelectIO™ Technology | Supports LVCMOS, LVTTL, SSTL, HSTL, and differential standards - simplifies interface to FPGAs, microprocessors, and memory devices |
| Embedded DCMs | Eight fully independent DCMs allow simultaneous clock management for video, data, and control domains |
| Configurable I/O Banks | Eight banks with independent VCCO supplies - permits mixed-voltage I/O (1.2 V to 3.3 V) on single device |
| MultiBoot Support | Enables dual-image configuration with fallback to backup bitstream upon CRC failure - improves field reliability |
Applications
| Industrial PLC I/O Module | Video Interface Bridge |
|---|---|
Use Scenario: Real-time digital I/O expansion and protocol translation between fieldbus (PROFIBUS, CANopen) and backplane Ethernet. IC Role / Device Role / Timing Role: FPGA acts as programmable logic controller core, managing deterministic I/O scanning and fieldbus timing with sub-microsecond jitter. Use Value: XC3S400AN-4FG400C provides sufficient logic density and 216 I/Os to replace multiple ASICs while supporting custom timing constraints for cyclic communication. | Use Scenario: Converting parallel RGB/YUV video streams to serialized formats (LVDS, FPD-Link) for display panels in medical imaging equipment. IC Role / Device Role / Timing Role: XC3S400AN-4FG400C serves as pixel-rate timing controller and format converter, leveraging DCMs for precise pixel clock generation and synchronization. Use Value: Embedded block RAM and SelectIO™ support enable frame buffering and high-speed differential signaling without external PHYs or glue logic. |
| Communications Backplane Controller | Test Equipment Pattern Generator |
Use Scenario: Managing slot-level arbitration, packet routing, and status monitoring in modular telecom chassis with hot-swap capability. IC Role / Device Role / Timing Role: XC3S400AN-4FG400C functions as backplane interface controller, implementing PCIe Gen1 endpoint logic and interrupt aggregation with deterministic latency. Use Value: Eight DCMs and 400k gate capacity allow concurrent implementation of PCIe hard IP wrapper, SERDES clock recovery, and diagnostic state machines. | Use Scenario: Generating high-fidelity digital stimulus waveforms for semiconductor ATE systems requiring synchronized multi-channel pattern output. IC Role / Device Role / Timing Role: XC3S400AN-4FG400C operates as programmable pattern sequencer, using distributed RAM for waveform storage and CLBs for cycle-accurate timing control. Use Value: 8,064 logic cells and 360 kbits block RAM support >1 M-sample deep patterns with per-pin programmable drive strength and slew rate. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S500AN-4FG400C | 500K system gates, 9,120 logic cells, same package and pinout | Higher logic density supports larger state machines and additional protocol stacks | Choose when design requires >8,064 CLBs but retains identical PCB layout and power delivery |
| XC3S200AN-4FT256C | 200K gates, 4,320 logic cells, 256-pin FTBGA package | Lower I/O count (173) and reduced block RAM (216 kbits) | Select for space-constrained or lower-cost implementations where full XC3S400AN-4FG400C resources are unused |
Compared with XC3S400AN-4FG400C, the XC3S500AN-4FG400C offers headroom for future feature expansion without board changes, while the XC3S200AN-4FT256C reduces BOM cost and footprint at the expense of logic and memory resources - both require separate timing analysis and I/O constraint validation.
Availability
XC3S400AN-4FG400C is available at Aetrix Electronics and suitable for industrial automation, medical imaging subsystems, and telecom backplane designs requiring stable component supply and long-term manufacturing continuity.
Supply support for XC3S400AN-4FG400C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.
The Spartan-3A family was designed for cost-optimized, high-volume applications requiring reliable programmable logic with integrated clock management and flexible I/O - targeting industrial control, video processing, and communications infrastructure.
FAQ
What is the maximum supported I/O standard voltage for XC3S400AN-4FG400C?
XC3S400AN-4FG400C supports I/O voltages from 1.2 V to 3.3 V across eight independently powered banks. Each bank's VCCO must be set to a single voltage level, and the device does not support mixed-voltage signaling within the same bank. This allows direct interfacing with legacy 3.3 V peripherals and modern 1.2 V processors without level shifters.
Does XC3S400AN-4FG400C include built-in configuration memory?
No, XC3S400AN-4FG400C does not include non-volatile configuration memory. It loads its bitstream from external sources such as SPI PROM, parallel NOR flash, or a host processor. Configuration occurs on power-up or reset, and the device retains configuration only while powered. Persistent storage requires an external memory device compatible with Master Serial or Slave Parallel modes.
How many Digital Clock Managers (DCMs) are available in XC3S400AN-4FG400C?
XC3S400AN-4FG400C integrates eight Digital Clock Managers (DCMs). Each DCM provides independent clock synthesis, phase shifting, duty-cycle correction, and frequency multiplication or division. These DCMs operate without external components and support input frequencies from 1 MHz to 200 MHz, enabling precise clock domain management for multi-standard interface designs.
Can XC3S400AN-4FG400C be used in automotive applications?
XC3S400AN-4FG400C is rated for commercial and industrial temperature ranges (0 °C to 85 °C and –40 °C to 100 °C), but it is not qualified to AEC-Q100 standards. Its use in automotive applications requires full system-level qualification by the end customer, including thermal, vibration, and EMI validation. AMD does not guarantee automotive-grade reliability or extended lifecycle support for this part.
What configuration modes does XC3S400AN-4FG400C support?
XC3S400AN-4FG400C supports Master Serial, Slave Serial, Slave Parallel, and JTAG (IEEE 1149.1) configuration modes. Master Serial uses the FPGA to generate CCLK and drive an external SPI PROM; Slave modes rely on an external controller to provide clock and data. JTAG is used for programming, debugging, and boundary-scan testing during development and production.
XC3S400AN-4FG400C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3AN
- Package/Case:
- 400-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 896
- Number of Logic Elements/Cells:
- 8064
- Total RAM Bits:
- 368640
- Number of I/O:
- 311
- Number of Gates:
- 400000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 400-FBGA (21x21)
XC3S400AN-4FG400C FAQ
1.How can I place an order for XC3S400AN-4FG400C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S400AN-4FG400C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S400AN-4FG400C reliable?
The price and inventory of XC3S400AN-4FG400C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S400AN-4FG400C is usually 5 days.
3.What payment methods are accepted for XC3S400AN-4FG400C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S400AN-4FG400C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S400AN-4FG400C?
XC3S400AN-4FG400C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S400AN-4FG400C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S400AN-4FG400C?
For technical support, including XC3S400AN-4FG400C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S400AN-4FG400C requirements.
6.How does Aetrix verify that XC3S400AN-4FG400C is sourced from the original manufacturer or authorized distributors?
All XC3S400AN-4FG400C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S400AN-4FG400C meets industry standards.
7.What is the process for return or replacement of XC3S400AN-4FG400C?
All XC3S400AN-4FG400C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S400AN-4FG400C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S400AN-4FG400C part is unused and in its original packaging.
Return procedure for XC3S400AN-4FG400C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC3S400AN-4FG400C Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
