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AMD XC3S400AN-4FG400I
- Part No.:
- XC3S400AN-4FG400I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 400-BGA
- Datasheet:
-
XC3S400AN-4FG400I.pdf
- Description:
- IC FPGA 311 I/O 400FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,159
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Product details
Overview
XC3S400AN-4FG400I from AMD (formerly Xilinx) is a Spartan-3AN FPGA with 400,000 system gates, 241 I/O pins, and integrated flash memory for single-chip configuration. It operates at -4 speed grade (tPD = 4.5 ns), uses 1.2 V core voltage, and supports 3.3 V/2.5 V/1.8 V I/O standards. It is used in industrial control logic and reconfigurable embedded interfaces.
For engineers reviewing the XC3S400AN-4FG400I datasheet, pinout, applications, or equivalent options, key selection factors include integrated flash capacity, I/O voltage flexibility, speed-grade timing closure, and single-chip boot capability without external PROM.
Technical Context
The XC3S400AN-4FG400I integrates 232 Configurable Logic Blocks (CLBs), 1728 Kbits of block RAM, and 24 dedicated multipliers. Its on-chip flash stores configuration bitstream and enables instant-on operation after power-up.
It supports JTAG boundary-scan (IEEE 1149.1), SelectMAP, and serial mode configuration. The device implements Digital Clock Managers (DCMs) for clock synthesis, phase shifting, and duty-cycle correction across up to four independent clock domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Capacity | 400,000 system gates - determines maximum combinational/sequential logic density for embedded control functions |
| I/O Pins | 241 user I/Os - supports high-pin-count peripheral interfacing with bank-wise voltage assignment |
| Speed Grade | -4 (tPD = 4.5 ns) - defines worst-case propagation delay for timing-critical synchronous paths |
| Core Voltage | 1.2 V ± 3% - sets power delivery requirements and impacts dynamic power consumption |
| Integrated Flash | 4 Mbits on-chip flash - eliminates external configuration PROM and enables secure, fast boot |
| Block RAM | 1728 Kbits - provides local data storage for FIFOs, buffers, or lookup tables without external memory |
| DCMs | 4 Digital Clock Managers - enable internal clock multiplication, phase alignment, and jitter reduction |
Pinout & Package
XC3S400AN-4FG400I is housed in a 400-pin Fine-Pitch Ball Grid Array (FBGA) package with 241 user I/Os distributed across 12 I/O banks. Each bank supports independent VCCO voltage selection (1.8 V, 2.5 V, or 3.3 V).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | CONFIG_DONE | Open-drain output signaling successful configuration completion and readiness for user logic |
| H2 | INIT_B | Active-low open-drain status signal indicating FPGA initialization state and bitstream validity |
| J1 | PROGRAM_B | Active-low input that triggers full reconfiguration and clears configuration memory |
| K2 | TCK | JTAG test clock input for boundary-scan and debug access per IEEE 1149.1 |
| L1 | TMS | JTAG test mode select controlling TAP controller state transitions |
| M2 | TDO | JTAG test data output carrying boundary-scan or debug register contents |
| N1 | TDI | JTAG test data input loading instructions and test data into scan chains |
Key Features
| Feature | Design Value |
|---|---|
| On-chip flash memory | Enables single-chip, instant-on configuration without external PROM or microcontroller boot loader |
| Multi-voltage I/O banks | Allows mixed-interface designs (e.g., 3.3 V sensors + 1.8 V processors) without level shifters |
| Digital Clock Managers (DCMs) | Provide deterministic clock deskew, frequency synthesis, and duty-cycle correction within the FPGA fabric |
| System Monitor | Integrates on-die temperature and supply voltage monitoring with ADC-based readback capability |
| SelectMAP interface | Supports high-speed parallel configuration via microprocessor or host controller for field updates |
Applications
| Industrial PLC Logic | Automotive Body Control Module |
|---|---|
Use Scenario: Real-time sequencing of I/O modules, safety interlocks, and analog sensor conditioning in factory automation cabinets. IC Role / Device Role / Timing Role: Reconfigurable logic fabric implementing custom state machines and protocol bridges (e.g., Modbus RTU to CAN). Use Value: Integrated flash ensures deterministic boot time (<5 ms) and eliminates external configuration components, reducing BOM count by one IC. | Use Scenario: Centralized control of door locks, lighting, window lifts, and mirror adjustment in mid-tier vehicles. IC Role / Device Role / Timing Role: Programmable interface hub managing discrete inputs, PWM outputs, and LIN bus communication. Use Value: Multi-voltage I/O banks directly interface 5 V sensors, 12 V actuators (via external drivers), and 3.3 V microcontrollers without level-shifting circuitry. |
| Medical Diagnostic Interface | Test & Measurement Equipment |
Use Scenario: Signal routing and real-time preprocessing between ultrasound transducer arrays and ADC/DAC subsystems. IC Role / Device Role / Timing Role: High-speed digital front-end handling LVDS data capture, channel multiplexing, and packet framing. Use Value: DCMs align sampling clocks across multiple ADC channels with sub-nanosecond skew, enabling coherent beamforming. | Use Scenario: Flexible pattern generation, protocol analysis, and stimulus-response verification in automated test systems. IC Role / Device Role / Timing Role: Reconfigurable logic engine implementing custom waveform generators and digital protocol analyzers (e.g., SPI, I²C, UART). Use Value: 241 I/O pins support simultaneous connection to DUT, reference clock sources, and trigger lines without multiplexing or switching overhead. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S500AN-4FG400I | 500K-gate capacity, same package and pinout, higher CLB count (280 vs. 232) and block RAM (2160 Kbits vs. 1728 Kbits) | Better suited for designs requiring larger logic footprint or deeper on-chip buffering | Select when additional LUTs or RAM blocks are needed without changing PCB layout |
| XC3S200AN-4FT256I | 200K-gate capacity, 256-pin FTBGA package, 173 I/Os, lower power and cost | Targeted at space-constrained or cost-sensitive applications with reduced logic complexity | Choose for simplified control logic where 241 I/Os and 400K gates are unnecessary |
Compared with XC3S400AN-4FG400I, the XC3S500AN-4FG400I offers headroom for future feature expansion within identical mechanical and thermal constraints, while the XC3S200AN-4FT256I reduces bill-of-materials cost and board area at the expense of gate count and I/O count.
Availability
XC3S400AN-4FG400I is available at Aetrix Electronics and suitable for industrial automation, automotive body electronics, and medical diagnostic equipment requiring stable component supply and long-term design-in support.
Supply support for XC3S400AN-4FG400I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Spartan FPGA family. Xilinx pioneered programmable logic architecture and system-on-chip integration for embedded reconfigurable computing.
The Spartan-3AN product line was designed for cost-sensitive, high-volume applications requiring non-volatile configuration, instant-on operation, and flexible I/O interfacing in industrial and automotive environments.
FAQ
What is the configuration method supported by XC3S400AN-4FG400I?
XC3S400AN-4FG400I supports three configuration modes: Master Serial (using external PROM), Slave Serial (host-controlled), and SelectMAP (parallel interface). Its integrated flash enables Master Serial mode without external memory, delivering single-chip boot capability. JTAG is used for programming and debugging. The XC3S400AN-4FG400I does not require external configuration devices unless custom update workflows are implemented.
Does XC3S400AN-4FG400I require external configuration memory?
No, XC3S400AN-4FG400I contains 4 Mbits of on-chip flash memory sufficient to store the full configuration bitstream. This allows autonomous, instant-on startup without external PROM or microcontroller intervention. External memory is optional only for field updates or dual-image redundancy schemes. The XC3S400AN-4FG400I's flash is reprogrammable over JTAG or SelectMAP.
What I/O standards are supported by XC3S400AN-4FG400I?
XC3S400AN-4FG400I supports LVCMOS, LVTTL, PCI, and SSTL18 I/O standards across its 12 configurable I/O banks. Each bank accepts independent VCCO voltages of 1.8 V, 2.5 V, or 3.3 V, enabling direct interfacing with mixed-voltage peripherals. The XC3S400AN-4FG400I does not support differential standards like LVDS or RSDS natively without external termination.
How many Digital Clock Managers (DCMs) does XC3S400AN-4FG400I include?
XC3S400AN-4FG400I includes four Digital Clock Managers (DCMs). Each DCM provides clock doubling, frequency synthesis, phase shifting (±180° in 1/256 steps), and duty-cycle correction. These are used to generate and stabilize internal clocks for timing-critical logic, ADC sampling, or high-speed I/O interfaces. The XC3S400AN-4FG400I's DCMs operate independently and do not share resources.
Is XC3S400AN-4FG400I RoHS compliant and lead-free?
Yes, XC3S400AN-4FG400I is RoHS-compliant and manufactured with lead-free packaging. The FG400 package uses matte tin finish on solder balls and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) requirements. The XC3S400AN-4FG400I is qualified for industrial temperature range (–40°C to +85°C) and supports reflow soldering per IPC/JEDEC J-STD-020.
XC3S400AN-4FG400I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3AN
- Package/Case:
- 400-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 896
- Number of Logic Elements/Cells:
- 8064
- Total RAM Bits:
- 368640
- Number of I/O:
- 311
- Number of Gates:
- 400000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 400-FBGA (21x21)
XC3S400AN-4FG400I FAQ
1.How can I place an order for XC3S400AN-4FG400I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S400AN-4FG400I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S400AN-4FG400I reliable?
The price and inventory of XC3S400AN-4FG400I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S400AN-4FG400I is usually 5 days.
3.What payment methods are accepted for XC3S400AN-4FG400I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S400AN-4FG400I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S400AN-4FG400I?
XC3S400AN-4FG400I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S400AN-4FG400I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S400AN-4FG400I?
For technical support, including XC3S400AN-4FG400I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S400AN-4FG400I requirements.
6.How does Aetrix verify that XC3S400AN-4FG400I is sourced from the original manufacturer or authorized distributors?
All XC3S400AN-4FG400I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S400AN-4FG400I meets industry standards.
7.What is the process for return or replacement of XC3S400AN-4FG400I?
All XC3S400AN-4FG400I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S400AN-4FG400I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S400AN-4FG400I part is unused and in its original packaging.
Return procedure for XC3S400AN-4FG400I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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