AMD XC3S400AN-4FGG400C

Overview

XC3S400AN-4FGG400C from AMD (formerly Xilinx) is a Spartan-3AN FPGA with 400,000 system gates, 216 I/O pins, and integrated 9 Mb Flash memory for single-chip configuration. It operates at -4 speed grade (1.11 ns CLB delay), supports 3.3 V/2.5 V/1.2 V I/O standards, and is used in industrial control logic and reconfigurable embedded interfaces.

For engineers reviewing the XC3S400AN-4FGG400C datasheet, pinout, applications, or equivalent options, key selection factors include on-chip Flash retention (20 years), I/O voltage flexibility, configuration security via Flash encryption, and compatibility with Xilinx ISE 14.7 design tools.

Technical Context

The XC3S400AN-4FGG400C integrates SRAM-based FPGA fabric with nonvolatile Flash memory on a single die, eliminating external configuration PROMs. It features 8,064 logic cells, 24 multipliers (18×18), and 520 Kbits of distributed RAM.

Configuration occurs automatically on power-up using internal Flash; JTAG and Master Serial modes support in-system programming. The device uses 0.13 µm CMOS process and supports IEEE 1149.1 boundary-scan testing.

Key Specifications

Pinout & Package

XC3S400AN-4FGG400C is housed in a 400-pin Fine-Pitch Ball Grid Array (FBGA) package with 20×20 mm body size and 0.8 mm ball pitch. The package supports thermal dissipation up to 1.8 W typical and includes dedicated configuration, JTAG, and dual-supply I/O banks.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA configuration and logic implementation applications.

Compared with XC3S500AN-4FGG400C and XC3S200AN-4FGG400C, the XC3S400AN-4FGG400C delivers optimal balance of logic density, I/O count, and Flash capacity for mid-range reconfigurable control applications without requiring PCB redesign.

Availability

XC3S400AN-4FGG400C is available at Aetrix Electronics and suitable for industrial automation, medical device manufacturing, and avionics subsystem integration requiring stable component supply and long-term lifecycle assurance.

Supply support for XC3S400AN-4FGG400C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and continues development and support of the Spartan FPGA family. Xilinx pioneered FPGA technology with scalable, SRAM-based architectures and integrated configuration solutions.

The Spartan-3AN product line was designed specifically for cost-sensitive, high-volume embedded applications requiring instant-on, secure, single-chip reconfigurability - especially where external configuration memory adds cost, board space, or reliability risk.

FAQ

Does XC3S400AN-4FGG400C require an external configuration PROM?

No. XC3S400AN-4FGG400C integrates 9 Mb of on-die Flash memory that stores the full configuration bitstream. Power-on initialization loads the bitstream directly from internal Flash, eliminating the need for external PROMs, microcontrollers, or configuration controllers. This reduces BOM count and improves startup reliability.

What is the maximum operating junction temperature for XC3S400AN-4FGG400C?

The XC3S400AN-4FGG400C is rated for industrial temperature range (–40°C to +85°C). Its maximum allowable junction temperature is +100°C under continuous operation, as specified in the Xilinx DS229 datasheet. Thermal design must ensure junction temperature remains within this limit using appropriate PCB copper area and airflow.

Can XC3S400AN-4FGG400C be reprogrammed in-system?

Yes. XC3S400AN-4FGG400C supports in-system programming (ISP) via JTAG or Master Serial mode. The internal Flash can be erased and reprogrammed multiple times (minimum 20,000 write/erase cycles), enabling field updates and secure configuration changes without removing the device from the board.

Which I/O standards are supported by XC3S400AN-4FGG400C?

XC3S400AN-4FGG400C supports LVCMOS, LVTTL, PCI, GTL, and HSTL I/O standards across its 216 pins. Each of the eight I/O banks can be independently configured for 1.2 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V operation, enabling mixed-voltage interface with legacy and modern peripherals.

Is XC3S400AN-4FGG400C compatible with Xilinx ISE 14.7 software?

Yes. XC3S400AN-4FGG400C is fully supported in Xilinx ISE Design Suite 14.7, including synthesis, simulation, place-and-route, and bitstream generation. Device-specific constraints and timing models are included in the ISE 14.7 installation, and no third-party plugins are required for complete implementation flow.