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AMD XC3S400AN-4FGG400I
- Part No.:
- XC3S400AN-4FGG400I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 400-BGA
- Datasheet:
-
XC3S400AN-4FGG400I.pdf
- Description:
- IC FPGA 311 I/O 400FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,013
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Product details
Overview
XC3S400AN-4FGG400I from AMD (formerly Xilinx) is a Spartan-3AN FPGA with 400,000 system gates, 216 I/O pins, and integrated flash memory for single-chip configuration. It operates at -4 speed grade (1.57 ns CLB delay), supports 3.3 V/2.5 V/1.2 V I/O standards, and targets industrial control logic and reconfigurable digital signal processing.
For engineers reviewing the XC3S400AN-4FGG400I datasheet, pinout, applications, or equivalent options, key selection factors include embedded flash retention (20 years), I/O voltage flexibility, configuration security via bitstream encryption, and compatibility with Xilinx ISE 14.7 design tools.
Technical Context
The XC3S400AN-4FGG400I integrates 8,064 configurable logic blocks (CLBs), 24 multipliers (18×18), and 576 Kbits of block RAM. Its on-chip flash enables instant-on operation without external PROM and supports in-system programming via JTAG or SelectMAP interface.
It implements IEEE 1149.1 JTAG boundary-scan testing, supports LVCMOS/LVTTL/SSTL/HSTL I/O standards, and includes digital clock managers (DCMs) with phase-matching and frequency synthesis capabilities up to 320 MHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Capacity | 400,000 system gates - defines maximum combinational logic density for gate-equivalent designs |
| Configurable Logic Blocks | 8,064 CLBs - provides base unit for LUTs, flip-flops, and carry logic |
| Block RAM | 576 Kbits - supports FIFOs, buffers, and small lookup tables without external memory |
| I/O Pins | 216 user I/O - enables high-pin-count interface bridging and parallel bus handling |
| Speed Grade | -4 (1.57 ns CLB delay) - guarantees timing closure for designs targeting 250 MHz system clocks |
| Embedded Flash | 4 Mbits on-chip flash - eliminates external configuration PROM and enables secure bitstream storage |
| DCM Units | 4 Digital Clock Managers - provide jitter reduction, frequency synthesis, and phase alignment for clock domains |
Pinout & Package
XC3S400AN-4FGG400I uses a 400-pin Fine-Pitch Ball Grid Array (FBGA) package with 216 user I/O pins distributed across 12 banks. The package supports 0.8 mm ball pitch and 27 × 27 mm body size.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.2 V core supply input - powers internal logic and CLBs |
| P2 | VCCAUX | 2.5 V auxiliary supply - powers configuration circuitry and DCMs |
| A1 | VCCO_0 | 3.3 V I/O bank 0 supply - sets output voltage level for Bank 0 pins |
| T14 | PROGRAM_B | Active-low configuration reset - initiates reconfiguration sequence on falling edge |
| R15 | DONE | Open-drain status output - signals successful configuration completion |
| T15 | INIT_B | Open-drain initialization indicator - goes low during configuration errors or CRC failure |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Flash Memory | Enables single-chip, instant-on operation without external configuration devices |
| Bitstream Encryption | Prevents reverse engineering and unauthorized cloning of programmed logic |
| Multi-Voltage I/O Banks | Allows mixed-voltage interfacing (1.2 V to 3.3 V) across independent I/O banks |
| Digital Clock Managers (DCMs) | Deliver deterministic clock skew control and frequency multiplication/division without external PLL ICs |
| JTAG Boundary-Scan Support | Provides IEEE 1149.1-compliant test access for board-level validation and debug |
Applications
| Industrial PLC Logic Controller | Medical Imaging Data Preprocessor |
|---|---|
Use Scenario: Real-time ladder logic execution and fieldbus protocol translation in modular automation systems. IC Role / Device Role / Timing Role: Configurable logic fabric implementing deterministic scan-cycle control and dual-port memory buffering. Use Value: On-chip flash ensures reliable cold-start operation after power loss, eliminating boot PROM failure points. | Use Scenario: Pixel data filtering and histogram equalization prior to GPU-based rendering in ultrasound systems. IC Role / Device Role / Timing Role: Reconfigurable datapath accelerator synchronized to 100 MHz imaging clock via DCM phase alignment. Use Value: 216 I/O pins support parallel LVDS sensor interfaces while block RAM handles real-time frame buffering. |
| Avionics Sensor Interface Hub | Test Equipment Pattern Generator |
Use Scenario: Aggregating ARINC 429 and discrete switch inputs in line-replaceable units (LRUs). IC Role / Device Role / Timing Role: Protocol-aware state machine with built-in parity checking and time-stamped event logging. Use Value: Bitstream encryption protects proprietary sensor fusion algorithms from tampering during maintenance cycles. | Use Scenario: Generating high-speed digital stimulus patterns for ASIC validation at 150 MHz. IC Role / Device Role / Timing Role: Deterministic pattern sequencer using DCM-synchronized counters and CLB-based state encoding. Use Value: -4 speed grade guarantees sub-2 ns path delays required for setup/hold compliance on 150 MHz test vectors. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA configuration and logic density applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S500AN-4FGG400I | 500K-gate capacity, same package and pinout, higher CLB count (9,120) and block RAM (720 Kbits) | Suitable for larger state machines and wider datapaths; requires updated place-and-route constraints | Select when additional logic resources are needed without changing PCB layout |
| XC6SLX45-3CSG324I | Spartan-6 architecture, 43,661 logic cells, no integrated flash, requires external SPI flash for configuration | Offers improved DSP slice density and lower static power; lacks instant-on capability | Choose for new designs prioritizing power efficiency and advanced I/O features over configuration simplicity |
Compared with XC3S400AN-4FGG400I, the XC3S500AN-4FGG400I extends logic capacity within identical mechanical and thermal constraints, while the XC6SLX45-3CSG324I trades embedded flash for enhanced routing flexibility and lower dynamic power - making it suitable for next-generation designs where configuration latency is acceptable.
Availability
XC3S400AN-4FGG400I is available at Aetrix Electronics and suitable for industrial control systems, medical imaging subsystems, avionics interface modules, and automated test equipment requiring stable component supply and long-term lifecycle support.
Supply support for XC3S400AN-4FGG400I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Spartan FPGA family for cost-sensitive, high-volume embedded applications.
The Spartan-3AN product line was designed specifically for applications requiring nonvolatile configuration, robust industrial temperature operation (-40°C to +100°C), and reduced bill-of-materials through integrated flash memory.
FAQ
What is the operating temperature range for XC3S400AN-4FGG400I?
The XC3S400AN-4FGG400I is rated for industrial temperature operation from -40°C to +100°C. This range is validated per Xilinx specification DS229 and applies to the full functional performance of the device, including configuration, logic operation, and I/O signaling. The XC3S400AN-4FGG400I maintains timing compliance and flash data retention across this range without derating.
Does XC3S400AN-4FGG400I require an external configuration PROM?
No, the XC3S400AN-4FGG400I does not require an external configuration PROM because it integrates 4 Mbits of on-chip flash memory. Configuration bitstream is stored directly in the device and loaded automatically on power-up. External PROMs are only needed if users implement dual-image fallback or field-upgradable configuration schemes beyond the single-image capability of the XC3S400AN-4FGG400I.
Which software tools support XC3S400AN-4FGG400I design and programming?
Xilinx ISE Design Suite 14.7 is the final officially supported toolchain for XC3S400AN-4FGG400I. It provides full synthesis, implementation, simulation, and bitstream generation. Programming is performed via iMPACT or ChipScope Pro using JTAG or SelectMAP interfaces. AMD does not support Vivado for Spartan-3AN devices due to architectural incompatibility.
Can XC3S400AN-4FGG400I be reprogrammed in-system?
Yes, the XC3S400AN-4FGG400I supports in-system programming (ISP) via JTAG or SelectMAP interface. Its embedded flash allows full bitstream rewrites without removing the device from the board. Reprogramming preserves flash endurance specifications (minimum 20,000 write/erase cycles) and retains data for 20 years at 85°C - verified in Xilinx documentation DS229 Rev 2.0.
What I/O standards are supported by XC3S400AN-4FGG400I?
The XC3S400AN-4FGG400I supports LVCMOS, LVTTL, PCI, SSTL-2, SSTL-3, HSTL-I, and HSTL-II I/O standards across its 12 independently powered I/O banks. Each bank can be set to 1.2 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V, enabling mixed-voltage interface bridging. I/O voltage tolerance and drive strength are configured per bank in the UCF file during implementation.
XC3S400AN-4FGG400I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3AN
- Package/Case:
- 400-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 896
- Number of Logic Elements/Cells:
- 8064
- Total RAM Bits:
- 368640
- Number of I/O:
- 311
- Number of Gates:
- 400000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 400-FBGA (21x21)
XC3S400AN-4FGG400I FAQ
1.How can I place an order for XC3S400AN-4FGG400I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S400AN-4FGG400I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S400AN-4FGG400I reliable?
The price and inventory of XC3S400AN-4FGG400I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S400AN-4FGG400I is usually 5 days.
3.What payment methods are accepted for XC3S400AN-4FGG400I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S400AN-4FGG400I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S400AN-4FGG400I?
XC3S400AN-4FGG400I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S400AN-4FGG400I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S400AN-4FGG400I?
For technical support, including XC3S400AN-4FGG400I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S400AN-4FGG400I requirements.
6.How does Aetrix verify that XC3S400AN-4FGG400I is sourced from the original manufacturer or authorized distributors?
All XC3S400AN-4FGG400I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S400AN-4FGG400I meets industry standards.
7.What is the process for return or replacement of XC3S400AN-4FGG400I?
All XC3S400AN-4FGG400I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S400AN-4FGG400I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S400AN-4FGG400I part is unused and in its original packaging.
Return procedure for XC3S400AN-4FGG400I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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