AMD XC3S400AN-4FT256I
- Part No.:
- XC3S400AN-4FT256I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC3S400AN-4FT256I.pdf
- Description:
- IC FPGA 195 I/O 256FTBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,129
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Product details
Overview
XC3S400AN-4FT256I from AMD (formerly Xilinx) is a Spartan-3AN FPGA with 400,000 system gates, 216 I/O pins, and integrated 9 Mb of on-chip Flash memory. It operates at -4 speed grade (1.13 ns CLB delay), supports 3.3 V/2.5 V/1.2 V I/O standards, and targets reconfigurable embedded control in industrial automation interfaces.
For engineers reviewing the XC3S400AN-4FT256I datasheet, pinout, applications, or equivalent options, key selection criteria include embedded Flash retention, single-chip configuration capability, I/O voltage flexibility, and industrial temperature operation (-40°C to +100°C).
Technical Context
The XC3S400AN-4FT256I integrates Flash-based configuration storage and SRAM-based logic fabric, eliminating external boot PROMs. Its architecture includes 8,064 configurable logic blocks (CLBs), 24 multipliers, and 128 Kbits of distributed RAM.
It supports JTAG boundary-scan, IEEE 1149.1-compliant debug, and in-system programming via SelectMAP or serial mode. Configuration is persistent across power cycles due to non-volatile Flash memory.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Capacity | 400,000 system gates - defines maximum combinational logic density for control-intensive designs |
| Configurable Logic Blocks | 8,064 CLBs - provides granular routing and logic resource allocation for real-time state machines |
| Embedded Flash | 9 Mb on-chip Flash - enables single-chip, instant-on configuration without external memory |
| I/O Pins | 216 user I/O - supports parallel bus interfaces, sensor arrays, and multi-protocol peripheral bridging |
| Speed Grade | -4 (1.13 ns CLB delay) - specifies worst-case propagation delay for synchronous timing closure |
| Operating Temperature | -40°C to +100°C - qualified for extended industrial environments without derating |
| I/O Standards | Supports LVCMOS, LVTTL, PCI, SSTL - allows direct interfacing with legacy and modern peripherals |
Pinout & Package
XC3S400AN-4FT256I is housed in a 256-pin Fine-Pitch Ball Grid Array (FBGA) package with 1.0 mm ball pitch and 17 × 17 array. The package supports thermal dissipation up to 1.8 W under typical industrial operating conditions.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.2 V core supply - powers internal logic and CLB fabric; requires low-noise regulation |
| P2 | VCCAUX | 2.5 V auxiliary supply - powers configuration circuitry, JTAG, and clock management |
| A1 | PROGRAM_B | Active-Low configuration reset - initiates reconfiguration sequence on falling edge |
| T16 | DONE | Open-drain status output - signals successful configuration completion when pulled high |
| R15 | CCLK | Configuration clock input - controls serial bitstream loading rate during master mode |
| M14 | TCK | JTAG test clock - synchronizes boundary-scan operations per IEEE 1149.1 |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Flash Memory | Eliminates external configuration PROM, reducing BOM count and board space by one component |
| Single-Chip Configuration | Enables power-up in <100 ms with no external dependencies - critical for fail-safe restarts |
| Multi-Voltage I/O Banks | Four independent I/O banks support mixed-voltage interfaces (e.g., 3.3 V sensors + 1.8 V processors) |
| Industrial Temperature Range | Validated operation from -40°C to +100°C - avoids thermal throttling in enclosed enclosures |
| JTAG Boundary-Scan Support | Enables in-circuit verification of PCB interconnects without physical probe access |
Applications
| Motor Control Interface | Industrial PLC I/O Module |
|---|---|
Use Scenario: Real-time PWM generation and encoder feedback processing in servo drive systems. IC Role / Device Role / Timing Role: FPGA fabric implements deterministic timing loops with sub-microsecond jitter for gate driver synchronization. Use Value: On-chip Flash ensures immediate reinitialization after brownout, maintaining position tracking integrity. | Use Scenario: Digital input/output expansion with isolation and protocol translation in modular PLC backplanes. IC Role / Device Role / Timing Role: Configurable logic handles opto-isolator interface timing, MODBUS RTU framing, and watchdog supervision. Use Value: 216 I/O pins enable 32-channel DI/DO + 8-channel analog mux control on a single device. |
| Factory Floor HMI Controller | Legacy Equipment Bridge |
Use Scenario: Touchscreen GUI rendering and serial peripheral coordination in panel-mounted HMIs. IC Role / Device Role / Timing Role: FPGA manages display refresh timing, button debouncing, and RS-485 command queuing. Use Value: Multi-voltage I/O banks interface directly with 3.3 V displays and 5 V industrial serial transceivers. | Use Scenario: Protocol conversion between obsolete parallel printer ports and modern USB/Ethernet endpoints. IC Role / Device Role / Timing Role: Implements parallel-to-serial shift logic and packet encapsulation with CRC generation. Use Value: Embedded Flash retains bridge firmware across power loss, avoiding reprogramming during maintenance windows. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based embedded control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S500AN-4FT256I | 500K gates, same package and Flash integration - higher logic density with identical footprint | Required when design exceeds 400K gate utilization or needs additional DSP slices | Select if future scalability or increased algorithm complexity is anticipated |
| XC3S200AN-4FT256I | 200K gates, same Flash, speed grade, and package - reduced logic capacity at lower cost | Suitable for simpler control tasks with fewer state machines or I/O channels | Choose when gate count is below 60% utilization and BOM cost sensitivity is high |
Compared with XC3S500AN-4FT256I and XC3S200AN-4FT256I, the XC3S400AN-4FT256I delivers optimal balance of logic resources, I/O count, and Flash retention for mid-complexity industrial controllers - avoiding overdesign while preserving upgrade path.
Availability
XC3S400AN-4FT256I is available at Aetrix Electronics and suitable for industrial motor drives, programmable logic controller modules, and factory-floor human-machine interfaces requiring stable component supply and long-term lifecycle assurance.
Supply support for XC3S400AN-4FT256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions, including FPGAs acquired through its acquisition of Xilinx in 2022.
The Spartan-3AN family was engineered for cost-sensitive, high-reliability embedded control where instant-on operation and configuration persistence are mandatory.
FAQ
What is the configuration method supported by XC3S400AN-4FT256I?
The XC3S400AN-4FT256I supports multiple configuration methods: Master Serial, Slave Serial, SelectMAP, and JTAG. Its integrated Flash allows autonomous startup without external configuration devices. The XC3S400AN-4FT256I automatically loads configuration data from on-chip Flash upon power-up, enabling true single-chip operation.
Does XC3S400AN-4FT256I require an external configuration PROM?
No, the XC3S400AN-4FT256I does not require an external configuration PROM due to its 9 Mb embedded Flash memory. This Flash stores the bitstream permanently and powers up the FPGA fabric directly. The XC3S400AN-4FT256I eliminates the need for external memory components, simplifying board layout and improving system reliability.
What is the maximum operating junction temperature for XC3S400AN-4FT256I?
The XC3S400AN-4FT256I is rated for industrial temperature operation with a junction temperature range of -40°C to +100°C. Thermal performance is validated under full logic utilization and worst-case I/O switching. The XC3S400AN-4FT256I maintains timing compliance and configuration integrity across this full range without derating.
Can XC3S400AN-4FT256I be reprogrammed in-system?
Yes, the XC3S400AN-4FT256I supports in-system programming (ISP) via JTAG or SelectMAP interface. Its Flash memory can be erased and rewritten while soldered on the target board. The XC3S400AN-4FT256I enables field firmware updates and configuration revisions without device removal or socketing.
What I/O standards are supported by XC3S400AN-4FT256I?
The XC3S400AN-4FT256I supports LVCMOS 3.3/2.5/1.8/1.5 V, LVTTL, PCI, and SSTL18 I/O standards across its 216 user pins. Each of the four I/O banks is independently configurable for voltage level and standard. The XC3S400AN-4FT256I allows mixed-voltage operation essential for interfacing with heterogeneous peripheral ecosystems.
XC3S400AN-4FT256I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3AN
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 896
- Number of Logic Elements/Cells:
- 8064
- Total RAM Bits:
- 368640
- Number of I/O:
- 195
- Number of Gates:
- 400000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC3S400AN-4FT256I FAQ
1.How can I place an order for XC3S400AN-4FT256I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S400AN-4FT256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S400AN-4FT256I reliable?
The price and inventory of XC3S400AN-4FT256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S400AN-4FT256I is usually 5 days.
3.What payment methods are accepted for XC3S400AN-4FT256I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S400AN-4FT256I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S400AN-4FT256I?
XC3S400AN-4FT256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S400AN-4FT256I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S400AN-4FT256I?
For technical support, including XC3S400AN-4FT256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S400AN-4FT256I requirements.
6.How does Aetrix verify that XC3S400AN-4FT256I is sourced from the original manufacturer or authorized distributors?
All XC3S400AN-4FT256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S400AN-4FT256I meets industry standards.
7.What is the process for return or replacement of XC3S400AN-4FT256I?
All XC3S400AN-4FT256I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S400AN-4FT256I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S400AN-4FT256I part is unused and in its original packaging.
Return procedure for XC3S400AN-4FT256I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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