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AMD XC3S400AN-4FT256I

Part No.:
XC3S400AN-4FT256I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
256-LBGA
Datasheet:
AetrixXC3S400AN-4FT256I.pdf
Description:
IC FPGA 195 I/O 256FTBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,129

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Product details

Overview

XC3S400AN-4FT256I from AMD (formerly Xilinx) is a Spartan-3AN FPGA with 400,000 system gates, 216 I/O pins, and integrated 9 Mb of on-chip Flash memory. It operates at -4 speed grade (1.13 ns CLB delay), supports 3.3 V/2.5 V/1.2 V I/O standards, and targets reconfigurable embedded control in industrial automation interfaces.

For engineers reviewing the XC3S400AN-4FT256I datasheet, pinout, applications, or equivalent options, key selection criteria include embedded Flash retention, single-chip configuration capability, I/O voltage flexibility, and industrial temperature operation (-40°C to +100°C).

Technical Context

The XC3S400AN-4FT256I integrates Flash-based configuration storage and SRAM-based logic fabric, eliminating external boot PROMs. Its architecture includes 8,064 configurable logic blocks (CLBs), 24 multipliers, and 128 Kbits of distributed RAM.

It supports JTAG boundary-scan, IEEE 1149.1-compliant debug, and in-system programming via SelectMAP or serial mode. Configuration is persistent across power cycles due to non-volatile Flash memory.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Capacity400,000 system gates - defines maximum combinational logic density for control-intensive designs
Configurable Logic Blocks8,064 CLBs - provides granular routing and logic resource allocation for real-time state machines
Embedded Flash9 Mb on-chip Flash - enables single-chip, instant-on configuration without external memory
I/O Pins216 user I/O - supports parallel bus interfaces, sensor arrays, and multi-protocol peripheral bridging
Speed Grade-4 (1.13 ns CLB delay) - specifies worst-case propagation delay for synchronous timing closure
Operating Temperature-40°C to +100°C - qualified for extended industrial environments without derating
I/O StandardsSupports LVCMOS, LVTTL, PCI, SSTL - allows direct interfacing with legacy and modern peripherals

Pinout & Package

XC3S400AN-4FT256I is housed in a 256-pin Fine-Pitch Ball Grid Array (FBGA) package with 1.0 mm ball pitch and 17 × 17 array. The package supports thermal dissipation up to 1.8 W under typical industrial operating conditions.

Pin/TerminalCircuit RoleDesign Meaning
G1VCCINT1.2 V core supply - powers internal logic and CLB fabric; requires low-noise regulation
P2VCCAUX2.5 V auxiliary supply - powers configuration circuitry, JTAG, and clock management
A1PROGRAM_BActive-Low configuration reset - initiates reconfiguration sequence on falling edge
T16DONEOpen-drain status output - signals successful configuration completion when pulled high
R15CCLKConfiguration clock input - controls serial bitstream loading rate during master mode
M14TCKJTAG test clock - synchronizes boundary-scan operations per IEEE 1149.1

Key Features

FeatureDesign Value
Integrated Flash MemoryEliminates external configuration PROM, reducing BOM count and board space by one component
Single-Chip ConfigurationEnables power-up in <100 ms with no external dependencies - critical for fail-safe restarts
Multi-Voltage I/O BanksFour independent I/O banks support mixed-voltage interfaces (e.g., 3.3 V sensors + 1.8 V processors)
Industrial Temperature RangeValidated operation from -40°C to +100°C - avoids thermal throttling in enclosed enclosures
JTAG Boundary-Scan SupportEnables in-circuit verification of PCB interconnects without physical probe access

Applications

Motor Control InterfaceIndustrial PLC I/O Module

Use Scenario: Real-time PWM generation and encoder feedback processing in servo drive systems.

IC Role / Device Role / Timing Role: FPGA fabric implements deterministic timing loops with sub-microsecond jitter for gate driver synchronization.

Use Value: On-chip Flash ensures immediate reinitialization after brownout, maintaining position tracking integrity.

Use Scenario: Digital input/output expansion with isolation and protocol translation in modular PLC backplanes.

IC Role / Device Role / Timing Role: Configurable logic handles opto-isolator interface timing, MODBUS RTU framing, and watchdog supervision.

Use Value: 216 I/O pins enable 32-channel DI/DO + 8-channel analog mux control on a single device.

Factory Floor HMI ControllerLegacy Equipment Bridge

Use Scenario: Touchscreen GUI rendering and serial peripheral coordination in panel-mounted HMIs.

IC Role / Device Role / Timing Role: FPGA manages display refresh timing, button debouncing, and RS-485 command queuing.

Use Value: Multi-voltage I/O banks interface directly with 3.3 V displays and 5 V industrial serial transceivers.

Use Scenario: Protocol conversion between obsolete parallel printer ports and modern USB/Ethernet endpoints.

IC Role / Device Role / Timing Role: Implements parallel-to-serial shift logic and packet encapsulation with CRC generation.

Use Value: Embedded Flash retains bridge firmware across power loss, avoiding reprogramming during maintenance windows.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded control applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC3S500AN-4FT256I500K gates, same package and Flash integration - higher logic density with identical footprintRequired when design exceeds 400K gate utilization or needs additional DSP slicesSelect if future scalability or increased algorithm complexity is anticipated
XC3S200AN-4FT256I200K gates, same Flash, speed grade, and package - reduced logic capacity at lower costSuitable for simpler control tasks with fewer state machines or I/O channelsChoose when gate count is below 60% utilization and BOM cost sensitivity is high

Compared with XC3S500AN-4FT256I and XC3S200AN-4FT256I, the XC3S400AN-4FT256I delivers optimal balance of logic resources, I/O count, and Flash retention for mid-complexity industrial controllers - avoiding overdesign while preserving upgrade path.

Availability

XC3S400AN-4FT256I is available at Aetrix Electronics and suitable for industrial motor drives, programmable logic controller modules, and factory-floor human-machine interfaces requiring stable component supply and long-term lifecycle assurance.

Supply support for XC3S400AN-4FT256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions, including FPGAs acquired through its acquisition of Xilinx in 2022.

The Spartan-3AN family was engineered for cost-sensitive, high-reliability embedded control where instant-on operation and configuration persistence are mandatory.

FAQ

What is the configuration method supported by XC3S400AN-4FT256I?

The XC3S400AN-4FT256I supports multiple configuration methods: Master Serial, Slave Serial, SelectMAP, and JTAG. Its integrated Flash allows autonomous startup without external configuration devices. The XC3S400AN-4FT256I automatically loads configuration data from on-chip Flash upon power-up, enabling true single-chip operation.

Does XC3S400AN-4FT256I require an external configuration PROM?

No, the XC3S400AN-4FT256I does not require an external configuration PROM due to its 9 Mb embedded Flash memory. This Flash stores the bitstream permanently and powers up the FPGA fabric directly. The XC3S400AN-4FT256I eliminates the need for external memory components, simplifying board layout and improving system reliability.

What is the maximum operating junction temperature for XC3S400AN-4FT256I?

The XC3S400AN-4FT256I is rated for industrial temperature operation with a junction temperature range of -40°C to +100°C. Thermal performance is validated under full logic utilization and worst-case I/O switching. The XC3S400AN-4FT256I maintains timing compliance and configuration integrity across this full range without derating.

Can XC3S400AN-4FT256I be reprogrammed in-system?

Yes, the XC3S400AN-4FT256I supports in-system programming (ISP) via JTAG or SelectMAP interface. Its Flash memory can be erased and rewritten while soldered on the target board. The XC3S400AN-4FT256I enables field firmware updates and configuration revisions without device removal or socketing.

What I/O standards are supported by XC3S400AN-4FT256I?

The XC3S400AN-4FT256I supports LVCMOS 3.3/2.5/1.8/1.5 V, LVTTL, PCI, and SSTL18 I/O standards across its 216 user pins. Each of the four I/O banks is independently configurable for voltage level and standard. The XC3S400AN-4FT256I allows mixed-voltage operation essential for interfacing with heterogeneous peripheral ecosystems.

XC3S400AN-4FT256I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Spartan®-3AN
Package/Case:
256-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
896
Number of Logic Elements/Cells:
8064
Total RAM Bits:
368640
Number of I/O:
195
Number of Gates:
400000
Voltage - Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
256-FTBGA (17x17)

XC3S400AN-4FT256I FAQ

1.How can I place an order for XC3S400AN-4FT256I through Aetrix?

Please submit a Request for Quotation (RFQ) for XC3S400AN-4FT256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC3S400AN-4FT256I reliable?

The price and inventory of XC3S400AN-4FT256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S400AN-4FT256I is usually 5 days.

3.What payment methods are accepted for XC3S400AN-4FT256I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S400AN-4FT256I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC3S400AN-4FT256I?

XC3S400AN-4FT256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC3S400AN-4FT256I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC3S400AN-4FT256I?

For technical support, including XC3S400AN-4FT256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S400AN-4FT256I requirements.

6.How does Aetrix verify that XC3S400AN-4FT256I is sourced from the original manufacturer or authorized distributors?

All XC3S400AN-4FT256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S400AN-4FT256I meets industry standards.

7.What is the process for return or replacement of XC3S400AN-4FT256I?

All XC3S400AN-4FT256I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S400AN-4FT256I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC3S400AN-4FT256I part is unused and in its original packaging.

Return procedure for XC3S400AN-4FT256I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC3S400AN-4FT256I Tags

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