AMD XC3S400AN-4FTG256C

Overview

XC3S400AN-4FTG256C from AMD (formerly Xilinx) is a Spartan-3AN FPGA with 400,000 system gates, 216 I/O pins, and integrated flash memory for single-chip configuration. It operates at -4 speed grade (1.11 ns CLB delay), uses 1.2 V core voltage, and is packaged in a 256-pin Fine-Pitch Thin Quad Flatpack (FTBGA). It targets cost-sensitive industrial control and embedded interface logic.

For engineers reviewing the XC3S400AN-4FTG256C datasheet, pinout, applications, or equivalent options, key selection criteria include integrated flash persistence, 216-user I/O count, -4 speed grade timing, 1.2 V core supply compatibility, and FTG256 package thermal and routing constraints.

Technical Context

The XC3S400AN-4FTG256C implements a reconfigurable logic fabric with 8,064 configurable logic blocks (CLBs), each containing two 4-input LUTs and flip-flops. It integrates 1,728 kbits of on-chip flash memory for instant-on configuration without external PROM.

It supports SelectIO standards including LVCMOS, LVTTL, PCI, and SSTL, with programmable drive strength and slew rate per I/O bank. Configuration occurs via JTAG or master serial mode using the internal flash as source.

Key Specifications

Pinout & Package

Package: 256-pin Fine-Pitch Thin Ball Grid Array (FTBGA), 17 mm × 17 mm, 1.0 mm ball pitch, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic integration applications.

Compared with XC3S400AN-4FTG256C, the XC3S500E-4FG320C offers greater logic capacity at the cost of added BOM complexity, while the LFXP2-8E-6FTN256C trades I/O count and DCM capability for compactness and lower static power-making each suitable only for specific trade-off priorities in embedded logic design.

Availability

XC3S400AN-4FTG256C is available at Aetrix Electronics and suitable for industrial control, automotive diagnostics, and medical sensor hub applications requiring stable component supply and long-term lifecycle support.

Supply support for XC3S400AN-4FTG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and continues development and support of the Spartan FPGA family for cost-optimized embedded logic solutions.

The Spartan-3AN product line was designed specifically for applications needing nonvolatile configuration, reduced system complexity, and reliable operation in industrial temperature ranges (0°C to 85°C).

FAQ

Does XC3S400AN-4FTG256C require an external configuration PROM?

No, XC3S400AN-4FTG256C does not require an external configuration PROM because it integrates 1,728 kbits of on-chip flash memory. This enables single-chip, instant-on configuration directly from internal nonvolatile storage upon power-up, eliminating boot dependencies and reducing PCB footprint. The XC3S400AN-4FTG256C supports both JTAG and master serial configuration modes using the internal flash as the source.

What is the maximum operating frequency supported by XC3S400AN-4FTG256C?

The XC3S400AN-4FTG256C is rated at speed grade -4, with a CLB propagation delay of 1.11 ns. When used with its Digital Clock Managers (DCMs), it supports output frequencies up to 240 MHz with jitter reduction and phase alignment. Actual system-level maximum frequency depends on design topology, I/O standard selection, and routing constraints-not just the -4 grade specification alone.

Can XC3S400AN-4FTG256C operate in industrial temperature range?

Yes, XC3S400AN-4FTG256C is specified for the industrial temperature range of 0°C to +85°C. Its FTG256 package and internal flash architecture are qualified for continuous operation across this range. Thermal design must account for 1.2 V core power dissipation under worst-case logic utilization, and proper PCB layout with thermal vias is recommended for sustained ambient conditions.

How many I/O standards does XC3S400AN-4FTG256C support per bank?

XC3S400AN-4FTG256C supports multiple I/O standards-including LVCMOS, LVTTL, PCI, and SSTL-within each of its configurable I/O banks. Each bank can be independently set to a single VCCO voltage (1.2 V to 3.3 V), and drive strength/slew rate are programmable per pin. However, all pins in a given bank must use the same VCCO voltage, limiting mixed-standard usage within one bank.

Is MultiBoot functionality available on XC3S400AN-4FTG256C?

Yes, XC3S400AN-4FTG256C supports MultiBoot, allowing up to four independent configuration bitstreams to be stored in its integrated flash memory. This enables field-upgradable firmware, fail-safe fallback images, and hardware versioning without external memory. The XC3S400AN-4FTG256C uses the PROGRAM_B and INIT_B pins along with internal address pointers to select and validate active images during startup.