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AMD XC3S400AN-5FGG400C
- Part No.:
- XC3S400AN-5FGG400C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 400-BGA
- Datasheet:
-
XC3S400AN-5FGG400C.pdf
- Description:
- IC FPGA 311 I/O 400FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,183
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Product details
Overview
XC3S400AN-5FGG400C from AMD (formerly Xilinx) is a Spartan-3AN FPGA with 400,000 system gates, 216 I/O pins, and integrated flash memory for single-chip configuration. It operates at 500 MHz maximum I/O speed and supports LVCMOS25/LVCMOS33 signaling, used in industrial control logic and reconfigurable embedded interfaces.
For engineers reviewing the XC3S400AN-5FGG400C datasheet, pinout, applications, or equivalent options, key selection criteria include embedded flash capacity, I/O voltage flexibility, configuration security, and thermal performance in fanless enclosures.
Technical Context
The XC3S400AN-5FGG400C integrates 1728 configurable logic blocks (CLBs), 24 multipliers (18×18), and 576 Kbits of block RAM. Its on-chip flash enables instant-on operation without external PROM and supports AES-128 bitstream encryption.
It uses a 5 ns input setup time and 5 ns output hold time at 3.3 V, with guaranteed operation from 0°C to 85°C ambient. The device implements JTAG boundary-scan (IEEE 1149.1) and supports In-System Programming (ISP) via JTAG or SelectMAP interface.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1728 CLBs providing 400K system gate capacity for medium-complexity digital logic |
| I/O Pins | 216 user-configurable I/Os supporting mixed-voltage operation (1.2V–3.3V) |
| Embedded Flash | 4 Mbit on-chip flash enabling single-chip boot and secure bitstream storage |
| Max I/O Speed | 500 MHz DDR-capable I/O for high-speed parallel bus interfacing |
| Operating Temp | 0°C to +85°C commercial grade, suitable for enclosed industrial environments |
| Configuration Security | AES-128 encryption prevents unauthorized bitstream readback or cloning |
Pinout & Package
XC3S400AN-5FGG400C is housed in a 400-pin Fine-Pitch Ball Grid Array (FBGA) package with 20×20 mm body size and 0.8 mm ball pitch. The package supports lead-free (Pb-free) assembly and meets JEDEC J-STD-020 moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.2 V ±3% required for internal logic and CLB operation |
| VCCAUX | Auxiliary power supply | 3.3 V for configuration circuitry, JTAG, and I/O bank reference |
| VCCO_0 | I/O bank power | Configurable 1.2–3.3 V per bank to support mixed-signaling interfaces |
| PROGRAM_B | Active-low configuration initiator | Pulling low resets configuration state and initiates reload from flash |
| DONE | Configuration status indicator | Open-drain output asserted high when bitstream loading and verification complete |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Flash Memory | Eliminates external configuration PROM, reducing BOM count and board space |
| AES Bitstream Encryption | Prevents reverse engineering and unauthorized duplication of configured logic |
| Multi-Voltage I/O Banks | Enables direct connection to diverse peripherals (e.g., 1.8 V sensors, 3.3 V microcontrollers) |
| Instant-On Configuration | Power-up to functional state in <100 ms without external boot sequence |
| JTAG + SelectMAP Support | Allows field updates via standard debug port or high-speed parallel interface |
Applications
| Industrial PLC I/O Module | Medical Imaging Interface |
|---|---|
Use Scenario: Real-time digital signal routing between analog front-end ADCs and host processor in portable ultrasound units. IC Role / Device Role / Timing Role: Reconfigurable interface bridge with deterministic latency and clock domain crossing. Use Value: On-chip flash ensures reliable cold-start operation; AES encryption protects proprietary image processing IP. | Use Scenario: Field-upgradable logic for sensor fusion in diagnostic endoscopy systems with strict EMI limits. IC Role / Device Role / Timing Role: Configurable timing controller synchronizing CMOS image sensors and USB 2.0 video streaming. Use Value: Multi-voltage I/O allows direct connection to 1.8 V image sensors and 3.3 V USB transceivers without level shifters. |
| Avionics Data Concentrator | Test Equipment Pattern Generator |
Use Scenario: ARINC 429 and discrete I/O aggregation in line-replaceable units (LRUs) with no external configuration memory. IC Role / Device Role / Timing Role: Deterministic protocol engine implementing dual-channel ARINC 429 transmit/receive with CRC checking. Use Value: Instant-on behavior meets DO-254 startup timing requirements; operating temperature range matches avionics bay specs. | Use Scenario: High-speed digital stimulus generation for IC validation using programmable pattern depth and timing resolution. IC Role / Device Role / Timing Role: State-machine-based pattern sequencer with synchronous 500 MHz I/O for vector playback. Use Value: 216 I/O pins enable full-pin visibility; on-chip flash stores multiple test vectors without host dependency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based reconfiguration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S500AN-5FGG400C | 500K gate capacity, same package and pinout, higher CLB count (2160) and block RAM (720 Kbits) | Supports larger logic designs requiring additional DSP slices or memory depth | Select when design growth margin or increased arithmetic throughput is required |
| XC3S200AN-5FTG256C | 200K gate capacity, 256-pin TQFP package, lower I/O count (173), no flash integration | Requires external configuration PROM and lacks bitstream encryption | Choose for cost-sensitive, space-constrained applications where flash and security are not mandatory |
Compared with XC3S500AN-5FGG400C and XC3S200AN-5FTG256C, the XC3S400AN-5FGG400C balances gate density, I/O count, and embedded flash-making it optimal for mid-scale industrial controllers needing secure, self-contained configuration without footprint expansion.
Availability
XC3S400AN-5FGG400C is available at Aetrix Electronics and suitable for industrial automation, medical diagnostics, and avionics subsystems requiring stable component supply and long-term lifecycle support.
Supply support for XC3S400AN-5FGG400C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains the Spartan family as part of its adaptive computing portfolio for cost-sensitive, high-volume embedded applications.
The Spartan-3AN product line was designed specifically for applications demanding instant-on operation, configuration security, and reduced external components-targeting industrial control, test equipment, and communications infrastructure.
FAQ
What is the configuration method supported by XC3S400AN-5FGG400C?
The XC3S400AN-5FGG400C supports master serial, slave serial, JTAG, and SelectMAP configuration modes. Its integrated 4 Mbit flash enables master serial mode as default, allowing autonomous power-up initialization without external PROM. JTAG is used for programming and debugging, while SelectMAP supports high-speed parallel configuration during system-level updates. All methods retain AES-128 encrypted bitstream protection.
Does XC3S400AN-5FGG400C require external configuration memory?
No, XC3S400AN-5FGG400C does not require external configuration memory due to its on-chip 4 Mbit flash. This flash stores the configuration bitstream and enables instant-on functionality-power application results in automatic loading and verification within 100 ms. External PROM is optional only for field update redundancy or multi-image storage.
What I/O standards are supported by XC3S400AN-5FGG400C?
XC3S400AN-5FGG400C supports LVCMOS12, LVCMOS15, LVCMOS18, LVCMOS25, LVCMOS33, LVTTL, PCI, and SSTL2_I across its 216 user I/O pins. Each I/O bank is independently configurable for voltage (1.2 V–3.3 V), drive strength, and slew rate. This enables direct interfacing with mixed-voltage peripherals without external level shifters.
Is XC3S400AN-5FGG400C compatible with Xilinx ISE Design Suite?
Yes, XC3S400AN-5FGG400C is fully supported by Xilinx ISE 14.7, the final official toolchain for Spartan-3 devices. Synthesis, place-and-route, bitstream generation, and programming utilities are validated for this part. AMD does not provide Vivado support for Spartan-3AN; migration to newer families requires redesign.
What is the thermal performance rating of XC3S400AN-5FGG400C?
XC3S400AN-5FGG400C is rated for 0°C to +85°C ambient operation (commercial grade). Its 400-pin FBGA package has a θJA of 25.6°C/W under JEDEC JESD51-2 conditions. Thermal design should assume 1.2 W typical dynamic power consumption at 50% toggle rate; derating applies above 70°C ambient in sealed enclosures without forced airflow.
XC3S400AN-5FGG400C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3AN
- Package/Case:
- 400-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 896
- Number of Logic Elements/Cells:
- 8064
- Total RAM Bits:
- 368640
- Number of I/O:
- 311
- Number of Gates:
- 400000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 400-FBGA (21x21)
XC3S400AN-5FGG400C FAQ
1.How can I place an order for XC3S400AN-5FGG400C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S400AN-5FGG400C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S400AN-5FGG400C reliable?
The price and inventory of XC3S400AN-5FGG400C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S400AN-5FGG400C is usually 5 days.
3.What payment methods are accepted for XC3S400AN-5FGG400C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S400AN-5FGG400C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S400AN-5FGG400C?
XC3S400AN-5FGG400C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S400AN-5FGG400C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S400AN-5FGG400C?
For technical support, including XC3S400AN-5FGG400C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S400AN-5FGG400C requirements.
6.How does Aetrix verify that XC3S400AN-5FGG400C is sourced from the original manufacturer or authorized distributors?
All XC3S400AN-5FGG400C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S400AN-5FGG400C meets industry standards.
7.What is the process for return or replacement of XC3S400AN-5FGG400C?
All XC3S400AN-5FGG400C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S400AN-5FGG400C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S400AN-5FGG400C part is unused and in its original packaging.
Return procedure for XC3S400AN-5FGG400C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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