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AMD XC3S400AN-5FTG256C
- Part No.:
- XC3S400AN-5FTG256C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC3S400AN-5FTG256C.pdf
- Description:
- IC FPGA 195 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,367
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Product details
Overview
XC3S400AN-5FTG256C from AMD (formerly Xilinx) is a Spartan-3AN FPGA with 400,000 system gates, 216 I/O pins, and integrated flash memory for single-chip configuration. It operates at 500 MHz maximum DCI clock frequency and supports LVCMOS25/LVCMOS33 I/O standards in a 256-pin Fine-Pitch Thin Quad Flatpack (FTBGA) package, used in industrial control logic and reconfigurable embedded interfaces.
For engineers reviewing the XC3S400AN-5FTG256C datasheet, pinout, applications, or equivalent options, key selection criteria include on-chip flash capacity, I/O voltage flexibility, DCI termination support, and -5 speed grade timing compliance for deterministic logic deployment.
Technical Context
The XC3S400AN-5FTG256C integrates 400K system gates across 8,064 configurable logic blocks (CLBs), each with dual 4-input LUTs and flip-flops. It embeds 1,728 kbits of on-chip flash for configuration storage and supports JTAG, Master Serial, and Slave SelectMAP configuration modes.
It features Digital Clock Managers (DCMs) with phase shift, duty cycle correction, and frequency synthesis capabilities up to 500 MHz. I/O banks support independent VCCO settings per bank and Digitally Controlled Impedance (DCI) for on-die series termination matching.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Capacity | 400,000 system gates - defines maximum combinational/sequential logic density for gate-equivalent design mapping |
| Configurable Logic Blocks | 8,064 CLBs - provides base unit count for LUT+FF resource allocation in HDL synthesis |
| On-Chip Flash | 1,728 kbits - enables single-chip, instant-on configuration without external PROM or SPI flash |
| I/O Pins | 216 user I/O - supports high-pin-count peripheral interfacing with bank-wise voltage isolation |
| Speed Grade | -5 - guarantees timing closure for designs meeting 5 ns input setup/hold and 5 ns clock-to-out delays |
| DCM Outputs | 2 DCMs - deliver jitter-reduced clocks with programmable phase/duty/frequency for synchronous subsystems |
| VCCINT | 1.2 V ±3% - powers core logic; requires low-noise, tightly regulated supply for stable LUT operation |
Pinout & Package
The XC3S400AN-5FTG256C is housed in a 256-pin Fine-Pitch Thin Ball Grid Array (FTBGA) package with 1.0 mm ball pitch and 17 × 17 array footprint. Thermal pad exposed on underside requires solder paste stencil design per Xilinx packaging guidelines.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.2 V core power supply - must be decoupled locally with 100 nF + 10 µF ceramics |
| P2 | VCCO_0 | IO bank 0 output voltage - sets LVCMOS25/LVCMOS33 swing level for pins in Bank 0 |
| T14 | PROGRAM_B | Active-low configuration reset - pulls low to initiate reconfiguration from flash or external source |
| R15 | DONE | Open-drain status signal - goes high-Z when configuration completes successfully |
| U16 | INIT_B | Active-low initialization flag - indicates internal configuration controller readiness |
| Y16 | TCK | JTAG test clock - synchronizes boundary-scan and debug operations at up to 25 MHz |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Flash Memory | Eliminates external configuration PROM, reduces BOM count, and enables secure bitstream storage |
| Digitally Controlled Impedance (DCI) | Provides on-die series termination (35–75 Ω) without external resistors, improving signal integrity on high-speed traces |
| Dual Digital Clock Managers (DCMs) | Enable zero-delay buffering, 90° phase shift, and frequency multiplication/division for multi-clock domain synchronization |
| SelectIO Technology | Supports mixed-voltage I/O (1.2 V to 3.3 V) across 8 independent banks with programmable drive strength and slew rate |
| Boundary-Scan Debug Support | Enables IEEE 1149.1-compliant testing and real-time logic analyzer integration via JTAG TAP controller |
Applications
| Industrial PLC Logic | Automotive Diagnostic Interface |
|---|---|
Use Scenario: Reconfigurable logic for real-time I/O scanning and ladder logic execution in modular PLC backplanes. IC Role / Device Role / Timing Role: FPGA fabric implements deterministic scan-cycle engine with sub-microsecond I/O response latency. Use Value: On-chip flash enables field-upgradable control firmware without hardware changes or external memory devices. | Use Scenario: Protocol translation between CAN FD and UART-based diagnostic tools in vehicle service equipment. IC Role / Device Role / Timing Role: XC3S400AN-5FTG256C acts as a bridge controller with parallel CAN bus interface and serial host link. Use Value: Dual DCMs generate synchronized 40 MHz CAN clock and 115.2 kHz UART baud rate from single crystal reference. |
| Medical Imaging Data Path | Test Equipment Pattern Generator |
Use Scenario: Pixel data aggregation and preprocessing pipeline in portable ultrasound beamformers. IC Role / Device Role / Timing Role: XC3S400AN-5FTG256C processes parallel ADC streams using distributed RAM and DSP48 slices. Use Value: 216 I/O pins support direct connection to 16-bit × 8-channel ADCs with matched trace lengths and DCI-controlled impedance. | Use Scenario: High-speed digital stimulus generation for ATE systems validating DDR2/DDR3 memory controllers. IC Role / Device Role / Timing Role: XC3S400AN-5FTG256C synthesizes precise timing waveforms with <50 ps jitter via DCM-based clock synthesis. Use Value: -5 speed grade ensures setup/hold timing margins for 400 Mbps DDR data patterns under worst-case voltage/temperature conditions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S500AN-5FTG256C | 500K gates, same package and speed grade; 25% higher logic density with identical I/O and flash architecture | Supports larger state machines and wider datapaths without PCB change | Choose when design requires >400K gates but retains same thermal and layout constraints |
| XC6SLX45-3CSG324C | Spartan-6 family; 43,661 logic cells, no integrated flash, requires external configuration memory | Offers higher DSP slice count and enhanced clocking but increases BOM and boot time | Prefer for new designs needing PCIe endpoint support or higher-speed transceivers, not drop-in replacement |
Compared with XC3S400AN-5FTG256C, the XC3S500AN-5FTG256C offers gate scalability within identical footprint and power envelope, while the XC6SLX45-3CSG324C trades integrated flash for advanced peripherals and higher performance-requiring board-level redesign and revised configuration flow.
Availability
XC3S400AN-5FTG256C is available at Aetrix Electronics and suitable for industrial automation, automotive diagnostics, and medical imaging systems requiring stable component supply and long-term obsolescence management.
Supply support for XC3S400AN-5FTG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Spartan FPGA portfolio for cost-sensitive, high-volume embedded applications.
The Spartan-3AN product line was designed for single-chip, flash-based reconfigurable logic in space-constrained industrial and automotive control systems where fast power-up and configuration security are critical.
FAQ
What is the configuration method supported by XC3S400AN-5FTG256C?
The XC3S400AN-5FTG256C supports three configuration methods: Master Serial (using on-chip flash), Slave SelectMAP (via external processor), and JTAG boundary-scan. Its integrated 1,728 kbits flash enables autonomous startup without external memory, making XC3S400AN-5FTG256C ideal for systems requiring instant-on behavior and reduced component count.
Does XC3S400AN-5FTG256C support LVDS I/O standards?
No, XC3S400AN-5FTG256C does not support true LVDS signaling. It supports LVCMOS, LVTTL, PCI, and SSTL-2 I/O standards across its 8 banks, but lacks differential I/O buffers required for LVDS. For differential signaling, XC3S400AN-5FTG256C users must implement external LVDS translators or select higher-tier Spartan families with dedicated differential pairs.
What is the maximum operating junction temperature for XC3S400AN-5FTG256C?
The XC3S400AN-5FTG256C is rated for a maximum junction temperature of 85°C under continuous operation. This rating applies to the C-grade commercial temperature range (0°C to +85°C ambient), and thermal design must ensure adequate PCB copper area and airflow to maintain junction temperature below this limit during full logic utilization.
Can XC3S400AN-5FTG256C be programmed in-system via JTAG?
Yes, XC3S400AN-5FTG256C supports in-system programming (ISP) via its 4-pin JTAG interface (TCK, TMS, TDI, TDO). The JTAG chain allows configuration bitstream loading, boundary-scan testing, and debug access without removing XC3S400AN-5FTG256C from the PCB, enabling field updates and production test integration.
Is XC3S400AN-5FTG256C pin-compatible with XC3S400-5FTG256C?
No, XC3S400AN-5FTG256C is not pin-compatible with XC3S400-5FTG256C. Although both use the FTG256 package, the AN variant adds flash control signals (e.g., PROGRAM_B, INIT_B, DONE) and reassigns several pins for flash interface, altering the pin function map. Migration requires PCB layout revision and updated constraints files.
XC3S400AN-5FTG256C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3AN
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 896
- Number of Logic Elements/Cells:
- 8064
- Total RAM Bits:
- 368640
- Number of I/O:
- 195
- Number of Gates:
- 400000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC3S400AN-5FTG256C FAQ
1.How can I place an order for XC3S400AN-5FTG256C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S400AN-5FTG256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S400AN-5FTG256C reliable?
The price and inventory of XC3S400AN-5FTG256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S400AN-5FTG256C is usually 5 days.
3.What payment methods are accepted for XC3S400AN-5FTG256C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S400AN-5FTG256C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S400AN-5FTG256C?
XC3S400AN-5FTG256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S400AN-5FTG256C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S400AN-5FTG256C?
For technical support, including XC3S400AN-5FTG256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S400AN-5FTG256C requirements.
6.How does Aetrix verify that XC3S400AN-5FTG256C is sourced from the original manufacturer or authorized distributors?
All XC3S400AN-5FTG256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S400AN-5FTG256C meets industry standards.
7.What is the process for return or replacement of XC3S400AN-5FTG256C?
All XC3S400AN-5FTG256C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S400AN-5FTG256C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S400AN-5FTG256C part is unused and in its original packaging.
Return procedure for XC3S400AN-5FTG256C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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