AMD XC3S5000-4FG1156C

Overview

XC3S5000-4FG1156C from Xilinx is a high-density, cost-optimized Field-Programmable Gate Array (FPGA) with 74,880 equivalent logic cells, 1,872 Kbits of block RAM, and support for up to 633 user I/O pins in an 1156-ball Fine-Pitch Ball Grid Array (FBGA) package. It integrates four Digital Clock Managers (DCMs), 104 dedicated 18×18 multipliers, and SelectIO™ interface logic supporting LVDS, SSTL, HSTL, and DDR/DDR2 SDRAM up to 333 Mb/s - deployed in broadband access and digital television equipment.

For engineers reviewing the XC3S5000-4FG1156C datasheet, pinout, applications, or equivalent options, key selection considerations include its -4 speed grade (guaranteed 333 Mb/s DDR2 interface timing), commercial temperature range (0°C to +85°C), FG1156 package footprint (35 mm × 35 mm), and compatibility with Xilinx ISE WebPACK™ design tools for rapid prototyping and volume production.

Technical Context

The XC3S5000-4FG1156C implements a hierarchical FPGA architecture comprising Configurable Logic Blocks (CLBs), Input/Output Blocks (IOBs), Block RAM columns, dedicated 18×18 multipliers, and Digital Clock Managers (DCMs). Its IOBs support 18 single-ended and 8 differential I/O standards including LVDS and SSTL2_II, with Digitally Controlled Impedance (DCI) for on-die termination.

Each CLB contains dual 4-input LUTs with flip-flops, fast carry logic, and shift register capability; four DCMs provide clock skew elimination, frequency synthesis, and ±90° phase shifting; and the device uses static CMOS configuration latches loaded via Master Serial, Slave Parallel, or JTAG modes - all compliant with IEEE 1149.1/1532.

Key Specifications

Pinout & Package

The XC3S5000-4FG1156C is housed in a 1156-ball Fine-Pitch Ball Grid Array (FBGA) package with 35 mm × 35 mm footprint and 1.0 mm ball pitch. Pin functions are defined per UG331 and DS099 pinout tables; balls are organized in a symmetric grid with dedicated VCCO, VCCAUX, GND, and configuration pins distributed across perimeter and interior rows.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC3S4000-4FG676C and XC6SLX150-3FGG484C, the XC3S5000-4FG1156C uniquely balances maximum I/O count (633 pins) and block RAM capacity (1,872 Kbits) within the Spartan-3 family - making it the only option for high-channel-count, memory-intensive consumer video applications requiring guaranteed -4 timing without migrating to newer architectures.

Availability

XC3S5000-4FG1156C is available at Aetrix Electronics and suitable for broadband access gateways, digital television subsystems, and industrial imaging platforms requiring stable component supply through extended product lifecycles.

Supply support for XC3S5000-4FG1156C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGAs, adaptive SoCs, and software tools for aerospace, automotive, and communications markets since 1984.

The Spartan-3 family was engineered for high-volume, cost-sensitive consumer electronics - emphasizing logic density per dollar, low-power I/O flexibility, and seamless integration with Xilinx ISE design suite for rapid time-to-market.

FAQ

What is the maximum supported DDR2 SDRAM data rate for XC3S5000-4FG1156C?

The XC3S5000-4FG1156C supports DDR2 SDRAM interfaces up to 333 Mb/s, validated under the -4 speed grade at commercial temperature (0°C to +85°C) with proper PCB layout and termination. This rating is specified in DS099 Table 3 and confirmed by DCM timing analysis in UG331 - enabling direct connection to Micron MT47H64M16HR-37E and similar components without external PHYs. The XC3S5000-4FG1156C achieves this using its dedicated DDR-capable IOBs and phase-aligned clocking from integrated DCMs.

Does XC3S5000-4FG1156C support JTAG boundary-scan testing?

Yes, the XC3S5000-4FG1156C fully complies with IEEE 1149.1 and IEEE 1532 standards for JTAG boundary-scan. Its TCK, TMS, TDI, and TDO pins implement mandatory test access port functionality, allowing board-level interconnect verification, in-system programming, and debug visibility without physical probes. This capability is documented in DS099 Module 4 and UG332 - and the XC3S5000-4FG1156C uses the same JTAG instruction set as other Spartan-3 devices for consistent test automation.

What configuration modes are supported by XC3S5000-4FG1156C?

The XC3S5000-4FG1156C supports five configuration modes: Master Serial (using external PROM), Slave Serial, Slave Parallel (SelectMAP), Master Parallel, and Boundary Scan (JTAG). Each mode is electrically and logically defined in DS099 Module 2 and UG332 - with Slave Parallel enabling high-speed loading from microcontrollers and JTAG preferred for lab debugging. The XC3S5000-4FG1156C requires no external configuration controller in Master Serial mode, simplifying system architecture.

Is XC3S5000-4FG1156C pin-compatible with other Spartan-3 FG1156 packages?

No - the XC3S5000-4FG1156C is the only Spartan-3 device offered in the FG1156 package. While DS099 Table 3 lists FG1156 for both XC3S4000 and XC3S5000, Xilinx documentation confirms that XC3S4000 uses FG676 and FG900 packages exclusively; the FG1156 variant is unique to XC3S5000-4FG1156C and XC3S5000-5FG1156C. Therefore, no pin-compatible alternatives exist within the Spartan-3 family for this specific ball grid array layout.

What is the role of Digitally Controlled Impedance (DCI) in XC3S5000-4FG1156C?

Digitally Controlled Impedance (DCI) in the XC3S5000-4FG1156C provides programmable on-die series or parallel termination for differential standards like LVDS and SSTL, eliminating external resistors and reducing PCB routing complexity. DCI is configured per I/O bank via configuration bits and supports 40–60 Ω matching - critical for maintaining signal integrity in high-speed interfaces. This feature is detailed in DS099 Section "SelectIO™ Interface I/O Standards" and applies directly to the XC3S5000-4FG1156C's 633 I/O pins.