AMD XC3S5000-4FG676I

Overview

XC3S5000-4FG676I from AMD (formerly Xilinx) is a Spartan-3 FPGA with 5,093,760 system gates, 17,280 logic cells, and 3,968 Kb of block RAM. It features 480 user I/Os in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package and operates at -4 speed grade (t_PD = 4.5 ns). It is used in high-bandwidth industrial video processing systems requiring deterministic timing and parallel data path handling.

For engineers reviewing the XC3S5000-4FG676I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, block RAM depth, speed grade timing closure, differential signaling support (LVDS/LVPECL), and JTAG configuration interface compatibility.

Technical Context

The XC3S5000-4FG676I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated multipliers, and digital clock managers (DCMs) for phase-aligned clock synthesis. It supports SelectIO™ technology with programmable drive strength, slew rate, and on-chip termination across all I/O banks.

Configuration is performed via Master Serial mode using external PROM or through JTAG boundary-scan. The device includes internal startup circuitry and supports dual configuration bitstreams for fail-safe reconfiguration.

Key Specifications

Pinout & Package

XC3S5000-4FG676I is housed in a 676-ball fine-pitch FBGA package (package code FG676) with 27×27 ball array, 1.0 mm pitch, and 2.0 mm body height. Ball assignments follow Xilinx standard pinout for Spartan-3 generation FPGAs, with dedicated configuration, JTAG, global clock, and I/O bank groupings.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based digital logic implementation applications.

Compared with XC3S4000-4FG676I, the XC3S5000-4FG676I delivers 12% more logic cells and 15% more block RAM for deeper buffering and larger state machines; compared with XC3S5000-5FG676C, it trades 0.5 ns timing margin for guaranteed operation across -40°C to 100°C industrial temperature range.

Availability

XC3S5000-4FG676I is available at Aetrix Electronics and suitable for industrial machine vision, medical imaging acquisition, and avionics data concentrator applications requiring stable component supply and long-term lifecycle support.

Supply support for XC3S5000-4FG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops and supports the legacy Spartan family under the AMD Adaptive SoC and FPGA portfolio.

The Spartan-3 family was designed for cost-sensitive, high-volume applications demanding predictable performance, low power, and broad I/O flexibility - especially in industrial control, video, and communications infrastructure.

FAQ

What is the operating temperature range for XC3S5000-4FG676I?

The XC3S5000-4FG676I is rated for industrial temperature operation from -40°C to +100°C. This range is specified in the official Xilinx DS099 Spartan-3 datasheet and validated across all speed grades and package variants. Thermal derating applies above 85°C ambient per device power dissipation. The XC3S5000-4FG676I must be mounted on a PCB with adequate copper pour and thermal vias to maintain junction temperature within limits.

Does XC3S5000-4FG676I support JTAG boundary-scan testing?

Yes, the XC3S5000-4FG676I fully complies with IEEE 1149.1 (JTAG) standards. Pins TCK, TMS, TDI, and TDO are dedicated and electrically compatible with standard boundary-scan controllers. The device supports INTEST, EXTEST, SAMPLE/PRELOAD, and BYPASS instructions. JTAG is used for both configuration and post-configuration testing of I/O pins and interconnect integrity in the XC3S5000-4FG676I.

How many Digital Clock Managers (DCMs) does XC3S5000-4FG676I include?

The XC3S5000-4FG676I integrates eight Digital Clock Managers (DCMs). Each DCM provides independent clock synthesis, phase shifting, frequency multiplication/division, and duty cycle correction. These DCMs are distributed across the die to minimize clock skew and support multiple synchronous domains. All eight DCMs are accessible and usable simultaneously in a fully routed XC3S5000-4FG676I design.

Can XC3S5000-4FG676I be configured using Master Serial mode?

Yes, the XC3S5000-4FG676I supports Master Serial configuration mode using an external SPI PROM. In this mode, the FPGA drives CCLK and reads configuration data serially from the PROM after PROGRAM_B assertion. The XC3S5000-4FG676I automatically detects PROM type and handles address incrementing. This method is commonly used in production systems where fast, single-image boot is required without host processor involvement.

What I/O standards are supported by XC3S5000-4FG676I?

The XC3S5000-4FG676I supports LVCMOS, LVTTL, PCI, HSTL, SSTL, LVDS, and LVPECL signaling standards via its SelectIO™ technology. Each of the 16 I/O banks can be independently configured for voltage and standard. Differential standards like LVDS require adjacent pin pairing and proper termination. All supported standards are electrically characterized and documented in the XC3S5000-4FG676I DC and switching characteristics tables.