AMD XC3S5000-4FGG1156C

Overview

XC3S5000-4FGG1156C from Xilinx is a high-density, cost-optimized Field-Programmable Gate Array (FPGA) with 74,880 equivalent logic cells, 1,872 Kbits of block RAM, and four Digital Clock Managers (DCMs). It features 633 user I/O pins in an 1156-ball Fine-Pitch Ball Grid Array (FBGA) package and supports DDR/DDR2 SDRAM interfaces up to 333 Mb/s - deployed in broadband access and digital television equipment.

For engineers reviewing the XC3S5000-4FGG1156C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count and voltage flexibility (1.14V–3.465V), DCM-based clock synthesis, SelectIO™ interface support for LVDS/RSDS/SSTL, and compatibility with Xilinx ISE® WebPACK™ design tools.

Technical Context

The XC3S5000-4FGG1156C implements a hierarchical FPGA architecture with Configurable Logic Blocks (CLBs), distributed and block RAM, dedicated 18×18 multipliers, and four fully digital Digital Clock Managers (DCMs). Its IOBs support programmable delay, DDR register pairs, and Digitally Controlled Impedance (DCI) for on-die termination across 18 single-ended and 8 differential I/O standards.

It delivers up to 622+ Mb/s per I/O using SelectIO™ signaling, integrates eight global clock lines with low-skew routing, and uses static CMOS configuration latches loaded via Master/Slave Serial, Parallel, or JTAG modes. The device targets high-volume consumer applications requiring field-upgradable logic without ASIC-level NRE costs or long development cycles.

Key Specifications

Pinout & Package

XC3S5000-4FGG1156C is housed in a 1156-ball Fine-Pitch Ball Grid Array (FBGA) package with 34 mm × 34 mm footprint and 1.0 mm ball pitch. Pin functions are organized into banks with independent VCCO and VREF supplies, supporting mixed-voltage operation and configurable I/O standards.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA logic and I/O interface applications.

Compared with XC3S4000-4FGG676C and XC6SLX150-3FGG484C, the XC3S5000-4FGG1156C offers the highest logic density and I/O count in the Spartan-3 family, making it optimal for legacy-compatible, high-throughput consumer electronics where board space is less constrained than in newer platforms.

Availability

XC3S5000-4FGG1156C is available at Aetrix Electronics and suitable for broadband access gateways, digital television decoder boards, and industrial display controllers requiring stable component supply across extended production lifecycles.

Supply support for XC3S5000-4FGG1156C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGAs, adaptive SoCs, and software-defined platforms for aerospace, industrial, and communications markets.

The Spartan-3 family - including XC3S5000-4FGG1156C - was engineered for high-volume, cost-sensitive consumer electronics, balancing logic density, I/O flexibility, and power efficiency without sacrificing design tool accessibility.

FAQ

What is the maximum operating temperature range for XC3S5000-4FGG1156C?

The 'C' suffix in XC3S5000-4FGG1156C denotes Commercial temperature grade: junction temperature range is 0°C to +85°C. This rating applies under recommended operating conditions with proper thermal management and decoupling. The device is not rated for industrial (–40°C to +100°C) or automotive environments.

Does XC3S5000-4FGG1156C support DDR2 SDRAM interfaces?

Yes, XC3S5000-4FGG1156C supports DDR2 SDRAM interfaces up to 333 Mb/s using its SelectIO™ I/O standards and built-in DDR register primitives. Implementation requires proper timing constraints in Xilinx ISE® and careful PCB layout for matched trace lengths and controlled impedance.

How many Digital Clock Managers (DCMs) does XC3S5000-4FGG1156C contain?

XC3S5000-4FGG1156C contains four fully functional Digital Clock Managers (DCMs). Each DCM provides clock multiplication, division, phase shifting, and duty cycle correction - enabling independent clock domain generation for complex multi-clock systems.

Is XC3S5000-4FGG1156C pin-compatible with other Spartan-3 devices in the FGG1156 package?

No - XC3S5000-4FGG1156C is the only Spartan-3 device offered in the FGG1156 package. While all Spartan-3 FPGAs share consistent I/O bank architecture, pin assignments are device-specific and not interchangeable across densities. Migration requires full pinout validation and constraint file updates.

What configuration modes are supported by XC3S5000-4FGG1156C?

XC3S5000-4FGG1156C supports five configuration modes: Master Serial, Slave Serial, Master Parallel (SelectMAP), Slave Parallel (SelectMAP), and JTAG (IEEE 1149.1). Configuration bitstream loading is performed via dedicated pins (CCLK, DIN, PROGRAM_B, INIT_B, DONE) and requires external PROM or processor-controlled initialization.