AMD XC3S5000-4FGG676C

Overview

XC3S5000-4FGG676C from AMD (formerly Xilinx) is a Spartan-3 FPGA with 5,093,760 system gates, 11,648 logic cells, and 3,584 Kbits of block RAM, configured in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package for high-density embedded control and interface bridging applications.

For engineers reviewing the XC3S5000-4FGG676C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (484 user I/Os), maximum DCI-supported I/O standard (LVDS, SSTL, HSTL), internal clock speed (up to 333 MHz), and support for JTAG boundary-scan configuration.

Technical Context

The XC3S5000-4FGG676C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, dedicated multipliers, and digital clock managers (DCMs). It supports SelectIO technology for interfacing across multiple voltage domains and signal standards.

Configuration is performed via Master Serial, Slave Serial, or JTAG modes using external PROM or processor-controlled loading. The device includes four DCMs for phase-matched clock synthesis, duty-cycle correction, and frequency synthesis without external components.

Key Specifications

Pinout & Package

XC3S5000-4FGG676C is housed in a 676-ball fine-pitch BGA (FBGA) package with 1.0 mm ball pitch and 27 × 27 array configuration. Thermal and mechanical characteristics comply with JEDEC MO-225 specification.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based digital logic implementation applications.

Compared with XC3S5000-4FGG676C, the XC3S4000-4FGG676C offers cost reduction at the expense of logic and memory headroom, while the XC3S5000-4FGG900C retains full compatibility but improves manufacturability and thermal performance through larger package geometry.

Availability

XC3S5000-4FGG676C is available at Aetrix Electronics and suitable for industrial motion control, medical imaging interface, avionics data concentration, and automated test equipment requiring stable component supply and long-term lifecycle support.

Supply support for XC3S5000-4FGG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI engines for heterogeneous compute acceleration.

The Spartan-3 family, including XC3S5000-4FGG676C, was designed for cost-sensitive, high-volume embedded applications requiring balanced logic density, I/O flexibility, and low-power operation.

FAQ

What is the maximum operating frequency of the XC3S5000-4FGG676C?

The XC3S5000-4FGG676C supports internal clock speeds up to 333 MHz under typical conditions. This figure reflects the maximum guaranteed performance for synchronous logic paths after place-and-route timing closure, assuming proper PCB layout, power delivery, and thermal management. The actual achievable frequency depends on design complexity, routing congestion, and I/O standard selection. XC3S5000-4FGG676C does not guarantee 333 MHz across all logic paths without static timing analysis verification.

Does the XC3S5000-4FGG676C support configuration via SPI flash memory?

No, the XC3S5000-4FGG676C does not support native SPI flash configuration. It requires Master Serial mode using XCFxx Platform Flash PROMs with dedicated configuration interface pins (e.g., CCLK, DIN, INIT_B), or JTAG-based programming. XC3S5000-4FGG676C lacks internal SPI controller hardware for direct flash boot, unlike later Spartan-6 or Artix-7 devices.

How many Digital Clock Managers (DCMs) are integrated in the XC3S5000-4FGG676C?

The XC3S5000-4FGG676C integrates exactly four Digital Clock Managers (DCMs). Each DCM provides independent clock synthesis, phase shifting, duty-cycle correction, and frequency multiplication/division. These DCMs operate without external components and support input frequencies from 12 MHz to 240 MHz. XC3S5000-4FGG676C uses DCMs-not PLLs-for clock management, distinguishing it from higher-end Virtex families.

What I/O standards are supported by the XC3S5000-4FGG676C?

The XC3S5000-4FGG676C supports LVDS, LVPECL, SSTL-2/3, HSTL-I/II, LVTTL, and PCI I/O standards across its 484 user I/O pins. Voltage levels per I/O bank are configurable from 1.2 V to 3.3 V. XC3S5000-4FGG676C does not support differential standards beyond LVDS and LVPECL, nor does it support newer standards like MIPI or Sub-LVDS.

Is the XC3S5000-4FGG676C RoHS compliant?

Yes, the XC3S5000-4FGG676C is RoHS compliant and lead-free, meeting Directive 2011/65/EU requirements. The FBGA package uses matte tin finish on solder balls and halogen-free molding compound. XC3S5000-4FGG676C shipped after 2006 conforms to RoHS-6 (excluding exemption 7a for lead in high-melting-temperature solder), and documentation confirms full compliance for this speed grade and package variant.