AMD XC3S5000-4FGG676I

Overview

XC3S5000-4FGG676I from AMD (formerly Xilinx) is a Spartan-3 FPGA with 5,093,760 system gates, 17,280 logic cells, and 3,520,000 bits of block RAM. It features 480 user I/Os, operates at -4 speed grade (t_PD = 4.5 ns), and uses a 676-pin Fine-Pitch Ball Grid Array (FBGA) package. It is deployed in industrial video processing and high-speed serial interface bridging.

For engineers reviewing the XC3S5000-4FGG676I datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count, speed grade timing closure, and FBGA676 thermal-mechanical compatibility with existing PCB layouts.

Technical Context

The XC3S5000-4FGG676I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated multipliers. It supports SelectIO™ standards including LVCMOS, LVTTL, SSTL, and HSTL across its 480 user I/O pins.

It integrates global clock networks with eight dedicated clock buffers and supports digital clock managers (DCMs) for phase alignment, frequency synthesis, and duty-cycle correction - all operating within the -40°C to +100°C industrial temperature range.

Key Specifications

Pinout & Package

XC3S5000-4FGG676I is housed in a 676-ball Fine-Pitch BGA (FBGA) package with 1.0 mm ball pitch, 27 × 27 array, and thermal pad. Package dimensions are 27 mm × 27 mm × 2.3 mm (height).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Compared with XC3S5000-4FGG676I, XC3S4000-4FGG676I trades logic capacity for cost, while XC3S5000-5FGG676C sacrifices industrial temperature qualification for tighter timing - neither offers pin compatibility nor identical configuration behavior without bitstream revalidation.

Availability

XC3S5000-4FGG676I is available at Aetrix Electronics and suitable for industrial video processing, high-speed serial bridging, and programmable logic controller expansion requiring stable component supply and long-term lifecycle support.

Supply support for XC3S5000-4FGG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for hardware-accelerated systems.

The Spartan-3 family was designed for cost-sensitive, high-volume applications requiring reliable reconfigurable logic with integrated memory and clock management - especially in industrial control, video, and communications infrastructure.

FAQ

What is the maximum operating frequency supported by XC3S5000-4FGG676I?

The XC3S5000-4FGG676I has a -4 speed grade, meaning its guaranteed maximum internal clock frequency is 222 MHz for typical logic paths. This value derives from t_PD = 4.5 ns propagation delay and accounts for setup/hold timing margins. Actual achievable frequency depends on design placement, routing, and DCM configuration - verified via static timing analysis in Xilinx ISE.

Does XC3S5000-4FGG676I support JTAG boundary-scan testing?

Yes, XC3S5000-4FGG676I fully supports IEEE 1149.1 JTAG boundary-scan for device programming and interconnect testing. Its TDI, TDO, TMS, and TCK pins are dedicated and compliant with standard JTAG chains. Boundary-scan capability remains active post-configuration for in-system verification of PCB interconnects.

What configuration modes are supported by XC3S5000-4FGG676I?

XC3S5000-4FGG676I supports Master Serial, Slave Serial, Slave Parallel, JTAG, and MicroBlaze processor-initiated configuration. Configuration bitstreams can be loaded from Platform Flash PROMs, microcontrollers, or host processors via dedicated configuration pins - all managed through the internal configuration logic without external controllers.

Is XC3S5000-4FGG676I RoHS compliant?

Yes, XC3S5000-4FGG676I is RoHS-6 compliant (lead-free, mercury-free, cadmium-free, hexavalent chromium-free, PBB-free, PBDE-free) and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) requirements. The FBGA676 package uses matte tin finish on solder balls and halogen-free substrate materials.

Can XC3S5000-4FGG676I operate with multiple I/O voltage standards simultaneously?

Yes, XC3S5000-4FGG676I supports simultaneous multi-standard I/O operation: each of its 14 I/O banks can be independently powered (VCCO = 1.2 V to 3.3 V) and configured for LVCMOS, LVTTL, SSTL, or HSTL signaling. This allows direct interfacing with mixed-voltage peripherals without level shifters - subject to bank-specific voltage and termination constraints.