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AMD XC3S5000-5FG676C

Part No.:
XC3S5000-5FG676C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
676-BGA
Datasheet:
AetrixXC3S5000-5FG676C.pdf
Description:
IC FPGA 489 I/O 676FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,867

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Product details

Overview

XC3S5000-5FG676C from AMD (formerly Xilinx) is a Spartan-3 FPGA with 5,093,760 system gates, 11,648 logic cells, and 3,584 Kbits of block RAM. It features 480 user I/Os, operates at -5 speed grade (equivalent to 333 MHz system clock), and uses a 676-pin Fine-Pitch Ball Grid Array (FBGA) package. It is deployed in industrial control systems requiring high-density programmable logic with deterministic timing.

For engineers reviewing the XC3S5000-5FG676C datasheet, pinout, applications, or equivalent options, key selection criteria include logic capacity, I/O count, speed grade, RAM depth, and FBGA676 thermal-mechanical compatibility with existing PCB layouts.

Technical Context

The XC3S5000-5FG676C implements a hierarchical architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated multipliers. It supports SelectIO™ technology for interfacing with LVCMOS, LVTTL, SSTL, and HSTL standards across its 480 user I/Os.

This device integrates global clock networks with eight fully buffered clock lines and supports Digital Clock Managers (DCMs) for phase shifting, duty cycle correction, and frequency synthesis - enabling precise clock domain management in synchronous digital systems.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells11,648 - determines maximum combinational/sequential logic density per design
System Gates5,093,760 - industry-standard metric for relative logic capacity vs ASIC implementation
Block RAM3,584 Kbits - provides on-chip memory for FIFOs, buffers, or lookup tables without external SRAM
User I/O Pins480 - supports high-pin-count parallel interfaces such as DDR SDRAM, PCI, or custom bus protocols
Speed Grade-5 - guarantees timing closure up to 333 MHz system clock frequency under worst-case conditions
Package676-pin FBGA (Fine-Pitch BGA) - 27×27 mm body, 1.0 mm ball pitch, JEDEC MO-230 compliant
Operating Voltage1.2 V core / 3.3 V I/O - enables low-power logic operation while maintaining legacy interface voltage compatibility

Pinout & Package

XC3S5000-5FG676C is housed in a 676-ball fine-pitch FBGA (package code FG676), with balls arranged in a 27×27 array and 1.0 mm pitch. Thermal and mechanical characteristics comply with JEDEC MO-230 specification.

Pin/TerminalCircuit RoleDesign Meaning
VCCINTCore power supplySupplies 1.2 V to internal logic; requires low-noise regulation and local decoupling
VCCOI/O bank powerConfigurable per bank (1.2–3.3 V); sets voltage standard for associated I/O pins
PROGRAM_BConfiguration initiationActive-Low signal that resets configuration logic and initiates slave-serial or JTAG reload
DONEConfiguration statusOpen-drain output indicating successful bitstream loading and initialization completion
CCLKConfiguration clockDrives internal configuration shift register during master-serial or boundary-scan programming
TCK/TMS/TDI/TDOJTAG boundary-scan interfaceEnables IEEE 1149.1-compliant testing, debugging, and in-system programming

Key Features

FeatureDesign Value
Digital Clock Manager (DCM)Provides jitter-reduced clock synthesis, 90° phase shift, and 2x/4x frequency multiplication for timing-critical subsystems
SelectIO™ TechnologySupports mixed-voltage I/O banks with programmable drive strength, slew rate, and termination for signal integrity optimization
Embedded Multipliers128 18×18-bit signed/unsigned multipliers enable hardware-accelerated DSP functions without external ICs
Configurable Logic Blocks (CLBs)Each CLB contains four 3-input LUTs and eight flip-flops, enabling efficient mapping of complex state machines and arithmetic logic
Boundary-Scan Debug SupportFull IEEE 1149.1 compliance allows board-level test, in-circuit verification, and post-configuration diagnostics

Applications

Industrial Motion ControlMedical Imaging Interface

Use Scenario: Real-time servo loop coordination across multiple axes using encoder feedback and PWM outputs.

IC Role / Device Role / Timing Role: FPGA fabric implements closed-loop PID controllers, pulse-width modulation generators, and high-speed serial link bridges.

Use Value: Deterministic sub-microsecond latency and 480 I/Os allow direct connection to motor drivers, encoders, and safety monitors without glue logic.

Use Scenario: Aggregation and preprocessing of raw sensor data from CT/MRI detector arrays before transmission to host CPU.

IC Role / Device Role / Timing Role: Data path accelerator handling pixel alignment, histogram equalization, and compression pre-processing in pipeline stages.

Use Value: On-chip 3,584 Kbits block RAM buffers bursty detector streams; DCMs synchronize ADC sampling clocks with image reconstruction timing.

Avionics Data ConcentratorTest & Measurement Equipment

Use Scenario: Consolidating ARINC 429, MIL-STD-1553, and discrete I/O signals into a unified Ethernet backbone for flight data recorders.

IC Role / Device Role / Timing Role: Protocol translation engine with time-stamped packet assembly and deterministic arbitration logic.

Use Value: -5 speed grade ensures reliable 333 MHz timing margins for concurrent multi-protocol processing; 676-ball FBGA meets avionics thermal cycling requirements.

Use Scenario: High-resolution waveform generation and acquisition in automated test equipment (ATE) platforms.

IC Role / Device Role / Timing Role: Real-time pattern generator and digital capture unit synchronized to precision reference clocks.

Use Value: SelectIO™ supports 3.3 V LVTTL and 1.8 V LVDS I/O standards required by instrument front-ends; embedded multipliers accelerate FFT-based signal analysis.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density FPGA applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC3S4000-5FG676C4,321,792 system gates, 10,240 logic cells, 2,816 Kbits block RAM - lower density and memory capacitySuitable for cost-sensitive designs with reduced logic or memory requirementsSelect when design fits within smaller resource budget and maintains identical FG676 footprint and speed grade
XC3S5000-4FG676CSame logic resources but -4 speed grade (285 MHz max system clock) - slower timing performanceApplicable where timing margins are relaxed and lower power consumption is prioritizedChoose only if design meets timing at -4 grade; not interchangeable for 333 MHz-critical paths

Compared with XC3S5000-5FG676C, the XC3S4000-5FG676C offers identical speed and package but reduced gate count and RAM, while the XC3S5000-4FG676C retains full logic resources at lower clock performance - both require functional validation before substitution.

Availability

XC3S5000-5FG676C is available at Aetrix Electronics and suitable for industrial motion control, medical imaging interface, avionics data concentrators, and test & measurement equipment requiring stable component supply and long-term obsolescence planning.

Supply support for XC3S5000-5FG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI engines for heterogeneous compute acceleration.

The Spartan-3 family was originally designed by Xilinx for cost-effective, high-volume applications demanding substantial logic density and I/O flexibility in industrial and communications infrastructure.

FAQ

What is the maximum operating frequency supported by XC3S5000-5FG676C?

The XC3S5000-5FG676C is rated at speed grade -5, guaranteeing timing closure up to 333 MHz for system clock domains under worst-case voltage and temperature conditions. Actual achievable frequency depends on design placement, routing, and resource utilization - verified via Xilinx ISE timing analysis reports for the specific implemented bitstream.

Does XC3S5000-5FG676C support JTAG boundary-scan testing?

Yes, XC3S5000-5FG676C fully complies with IEEE 1149.1 (JTAG) standards. Its TCK, TMS, TDI, and TDO pins enable in-system programming, configuration verification, and board-level interconnect testing - all accessible without requiring external debug probes beyond standard JTAG adapters.

What power supply voltages does XC3S5000-5FG676C require?

XC3S5000-5FG676C requires two primary supplies: 1.2 V ±3% for the core logic (VCCINT) and configurable I/O bank voltages (VCCO) ranging from 1.2 V to 3.3 V per bank. Each VCCO bank must be independently regulated to match the signaling standard of connected peripherals.

Can XC3S5000-5FG676C be reconfigured in-system after power-up?

Yes, XC3S5000-5FG676C supports multiple in-system configuration modes including JTAG, master serial (via PROM), and slave selectMAP. The PROGRAM_B pin allows hardware-triggered reconfiguration without power cycle, enabling field-upgradable logic functionality during system operation.

Is XC3S5000-5FG676C compatible with Xilinx ISE Design Suite?

Yes, XC3S5000-5FG676C is fully supported by Xilinx ISE 14.7 - the final official release for Spartan-3 devices. Synthesis, place-and-route, bitstream generation, and timing analysis for XC3S5000-5FG676C are validated exclusively in this toolchain; newer Vivado software does not support this family.

XC3S5000-5FG676C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Spartan®-3
Package/Case:
676-BGA
Packaging:
Bulk
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
8320
Number of Logic Elements/Cells:
74880
Total RAM Bits:
1916928
Number of I/O:
489
Number of Gates:
5000000
Voltage - Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
676-FBGA (27x27)

XC3S5000-5FG676C FAQ

1.How can I place an order for XC3S5000-5FG676C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC3S5000-5FG676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC3S5000-5FG676C reliable?

The price and inventory of XC3S5000-5FG676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S5000-5FG676C is usually 5 days.

3.What payment methods are accepted for XC3S5000-5FG676C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S5000-5FG676C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC3S5000-5FG676C?

XC3S5000-5FG676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC3S5000-5FG676C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC3S5000-5FG676C?

For technical support, including XC3S5000-5FG676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S5000-5FG676C requirements.

6.How does Aetrix verify that XC3S5000-5FG676C is sourced from the original manufacturer or authorized distributors?

All XC3S5000-5FG676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S5000-5FG676C meets industry standards.

7.What is the process for return or replacement of XC3S5000-5FG676C?

All XC3S5000-5FG676C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S5000-5FG676C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC3S5000-5FG676C part is unused and in its original packaging.

Return procedure for XC3S5000-5FG676C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC3S5000-5FG676C Tags

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