AMD XC3S5000-5FG676C
- Part No.:
- XC3S5000-5FG676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC3S5000-5FG676C.pdf
- Description:
- IC FPGA 489 I/O 676FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC3S5000-5FG676C from AMD (formerly Xilinx) is a Spartan-3 FPGA with 5,093,760 system gates, 11,648 logic cells, and 3,584 Kbits of block RAM. It features 480 user I/Os, operates at -5 speed grade (equivalent to 333 MHz system clock), and uses a 676-pin Fine-Pitch Ball Grid Array (FBGA) package. It is deployed in industrial control systems requiring high-density programmable logic with deterministic timing.
For engineers reviewing the XC3S5000-5FG676C datasheet, pinout, applications, or equivalent options, key selection criteria include logic capacity, I/O count, speed grade, RAM depth, and FBGA676 thermal-mechanical compatibility with existing PCB layouts.
Technical Context
The XC3S5000-5FG676C implements a hierarchical architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated multipliers. It supports SelectIO™ technology for interfacing with LVCMOS, LVTTL, SSTL, and HSTL standards across its 480 user I/Os.
This device integrates global clock networks with eight fully buffered clock lines and supports Digital Clock Managers (DCMs) for phase shifting, duty cycle correction, and frequency synthesis - enabling precise clock domain management in synchronous digital systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 11,648 - determines maximum combinational/sequential logic density per design |
| System Gates | 5,093,760 - industry-standard metric for relative logic capacity vs ASIC implementation |
| Block RAM | 3,584 Kbits - provides on-chip memory for FIFOs, buffers, or lookup tables without external SRAM |
| User I/O Pins | 480 - supports high-pin-count parallel interfaces such as DDR SDRAM, PCI, or custom bus protocols |
| Speed Grade | -5 - guarantees timing closure up to 333 MHz system clock frequency under worst-case conditions |
| Package | 676-pin FBGA (Fine-Pitch BGA) - 27×27 mm body, 1.0 mm ball pitch, JEDEC MO-230 compliant |
| Operating Voltage | 1.2 V core / 3.3 V I/O - enables low-power logic operation while maintaining legacy interface voltage compatibility |
Pinout & Package
XC3S5000-5FG676C is housed in a 676-ball fine-pitch FBGA (package code FG676), with balls arranged in a 27×27 array and 1.0 mm pitch. Thermal and mechanical characteristics comply with JEDEC MO-230 specification.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | Supplies 1.2 V to internal logic; requires low-noise regulation and local decoupling |
| VCCO | I/O bank power | Configurable per bank (1.2–3.3 V); sets voltage standard for associated I/O pins |
| PROGRAM_B | Configuration initiation | Active-Low signal that resets configuration logic and initiates slave-serial or JTAG reload |
| DONE | Configuration status | Open-drain output indicating successful bitstream loading and initialization completion |
| CCLK | Configuration clock | Drives internal configuration shift register during master-serial or boundary-scan programming |
| TCK/TMS/TDI/TDO | JTAG boundary-scan interface | Enables IEEE 1149.1-compliant testing, debugging, and in-system programming |
Key Features
| Feature | Design Value |
|---|---|
| Digital Clock Manager (DCM) | Provides jitter-reduced clock synthesis, 90° phase shift, and 2x/4x frequency multiplication for timing-critical subsystems |
| SelectIO™ Technology | Supports mixed-voltage I/O banks with programmable drive strength, slew rate, and termination for signal integrity optimization |
| Embedded Multipliers | 128 18×18-bit signed/unsigned multipliers enable hardware-accelerated DSP functions without external ICs |
| Configurable Logic Blocks (CLBs) | Each CLB contains four 3-input LUTs and eight flip-flops, enabling efficient mapping of complex state machines and arithmetic logic |
| Boundary-Scan Debug Support | Full IEEE 1149.1 compliance allows board-level test, in-circuit verification, and post-configuration diagnostics |
Applications
| Industrial Motion Control | Medical Imaging Interface |
|---|---|
Use Scenario: Real-time servo loop coordination across multiple axes using encoder feedback and PWM outputs. IC Role / Device Role / Timing Role: FPGA fabric implements closed-loop PID controllers, pulse-width modulation generators, and high-speed serial link bridges. Use Value: Deterministic sub-microsecond latency and 480 I/Os allow direct connection to motor drivers, encoders, and safety monitors without glue logic. | Use Scenario: Aggregation and preprocessing of raw sensor data from CT/MRI detector arrays before transmission to host CPU. IC Role / Device Role / Timing Role: Data path accelerator handling pixel alignment, histogram equalization, and compression pre-processing in pipeline stages. Use Value: On-chip 3,584 Kbits block RAM buffers bursty detector streams; DCMs synchronize ADC sampling clocks with image reconstruction timing. |
| Avionics Data Concentrator | Test & Measurement Equipment |
Use Scenario: Consolidating ARINC 429, MIL-STD-1553, and discrete I/O signals into a unified Ethernet backbone for flight data recorders. IC Role / Device Role / Timing Role: Protocol translation engine with time-stamped packet assembly and deterministic arbitration logic. Use Value: -5 speed grade ensures reliable 333 MHz timing margins for concurrent multi-protocol processing; 676-ball FBGA meets avionics thermal cycling requirements. | Use Scenario: High-resolution waveform generation and acquisition in automated test equipment (ATE) platforms. IC Role / Device Role / Timing Role: Real-time pattern generator and digital capture unit synchronized to precision reference clocks. Use Value: SelectIO™ supports 3.3 V LVTTL and 1.8 V LVDS I/O standards required by instrument front-ends; embedded multipliers accelerate FFT-based signal analysis. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-density FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S4000-5FG676C | 4,321,792 system gates, 10,240 logic cells, 2,816 Kbits block RAM - lower density and memory capacity | Suitable for cost-sensitive designs with reduced logic or memory requirements | Select when design fits within smaller resource budget and maintains identical FG676 footprint and speed grade |
| XC3S5000-4FG676C | Same logic resources but -4 speed grade (285 MHz max system clock) - slower timing performance | Applicable where timing margins are relaxed and lower power consumption is prioritized | Choose only if design meets timing at -4 grade; not interchangeable for 333 MHz-critical paths |
Compared with XC3S5000-5FG676C, the XC3S4000-5FG676C offers identical speed and package but reduced gate count and RAM, while the XC3S5000-4FG676C retains full logic resources at lower clock performance - both require functional validation before substitution.
Availability
XC3S5000-5FG676C is available at Aetrix Electronics and suitable for industrial motion control, medical imaging interface, avionics data concentrators, and test & measurement equipment requiring stable component supply and long-term obsolescence planning.
Supply support for XC3S5000-5FG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI engines for heterogeneous compute acceleration.
The Spartan-3 family was originally designed by Xilinx for cost-effective, high-volume applications demanding substantial logic density and I/O flexibility in industrial and communications infrastructure.
FAQ
What is the maximum operating frequency supported by XC3S5000-5FG676C?
The XC3S5000-5FG676C is rated at speed grade -5, guaranteeing timing closure up to 333 MHz for system clock domains under worst-case voltage and temperature conditions. Actual achievable frequency depends on design placement, routing, and resource utilization - verified via Xilinx ISE timing analysis reports for the specific implemented bitstream.
Does XC3S5000-5FG676C support JTAG boundary-scan testing?
Yes, XC3S5000-5FG676C fully complies with IEEE 1149.1 (JTAG) standards. Its TCK, TMS, TDI, and TDO pins enable in-system programming, configuration verification, and board-level interconnect testing - all accessible without requiring external debug probes beyond standard JTAG adapters.
What power supply voltages does XC3S5000-5FG676C require?
XC3S5000-5FG676C requires two primary supplies: 1.2 V ±3% for the core logic (VCCINT) and configurable I/O bank voltages (VCCO) ranging from 1.2 V to 3.3 V per bank. Each VCCO bank must be independently regulated to match the signaling standard of connected peripherals.
Can XC3S5000-5FG676C be reconfigured in-system after power-up?
Yes, XC3S5000-5FG676C supports multiple in-system configuration modes including JTAG, master serial (via PROM), and slave selectMAP. The PROGRAM_B pin allows hardware-triggered reconfiguration without power cycle, enabling field-upgradable logic functionality during system operation.
Is XC3S5000-5FG676C compatible with Xilinx ISE Design Suite?
Yes, XC3S5000-5FG676C is fully supported by Xilinx ISE 14.7 - the final official release for Spartan-3 devices. Synthesis, place-and-route, bitstream generation, and timing analysis for XC3S5000-5FG676C are validated exclusively in this toolchain; newer Vivado software does not support this family.
XC3S5000-5FG676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3
- Package/Case:
- 676-BGA
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 8320
- Number of Logic Elements/Cells:
- 74880
- Total RAM Bits:
- 1916928
- Number of I/O:
- 489
- Number of Gates:
- 5000000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC3S5000-5FG676C FAQ
1.How can I place an order for XC3S5000-5FG676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S5000-5FG676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S5000-5FG676C reliable?
The price and inventory of XC3S5000-5FG676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S5000-5FG676C is usually 5 days.
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5.How can I obtain technical support or documentation for XC3S5000-5FG676C?
For technical support, including XC3S5000-5FG676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S5000-5FG676C requirements.
6.How does Aetrix verify that XC3S5000-5FG676C is sourced from the original manufacturer or authorized distributors?
All XC3S5000-5FG676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S5000-5FG676C meets industry standards.
7.What is the process for return or replacement of XC3S5000-5FG676C?
All XC3S5000-5FG676C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S5000-5FG676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S5000-5FG676C part is unused and in its original packaging.
Return procedure for XC3S5000-5FG676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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