AMD XC3S5000-5FG900C

Overview

XC3S5000-5FG900C from AMD (formerly Xilinx) is a Spartan-3 FPGA with 5,093,760 system gates, 17,280 logic cells, and 3,964,800 bits of block RAM. It features 633 user I/Os, operates at -5 speed grade (equivalent to 333 MHz system clock), and uses a 900-pin Fine-Pitch Ball Grid Array (FBGA) package. It targets high-bandwidth data acquisition systems requiring reconfigurable logic and embedded memory.

For engineers reviewing the XC3S5000-5FG900C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count, block RAM capacity, speed grade timing closure, and FBGA thermal/mechanical compatibility in industrial control and test equipment designs.

Technical Context

The XC3S5000-5FG900C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated multipliers. It supports SelectIO™ standards including LVCMOS, LVTTL, HSTL, and SSTL interfaces across its 633 user I/O pins.

It integrates twelve Digital Clock Managers (DCMs) for internal clock synthesis, phase shifting, and duty cycle correction-enabling precise timing control without external PLL components. Configuration is performed via Master Serial, Slave Serial, or JTAG modes using external PROM or processor-controlled loading.

Key Specifications

Pinout & Package

XC3S5000-5FG900C is housed in a 900-ball fine-pitch BGA (FBGA) package with 35 × 35 array, 1.0 mm ball pitch, and thermal pad center. Pin functions are defined by configuration mode, bank voltage, and I/O standard assignment.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Compared with XC3S5000-5FG900C, the XC3S4000-5FG900C offers cost savings at the expense of logic and memory headroom, while the XCV50E-8FG900C trades modern timing management and I/O flexibility for backward compatibility in aging platforms.

Availability

XC3S5000-5FG900C is available at Aetrix Electronics and suitable for industrial motion control, high-speed data acquisition, and protocol bridging gateway applications requiring stable component supply and long-term manufacturing support.

Supply support for XC3S5000-5FG900C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing solutions including FPGAs, ACAPs, and related software tools for heterogeneous compute acceleration.

The Spartan-3 family was originally designed by Xilinx for cost-sensitive, high-volume applications demanding substantial logic density and embedded memory-particularly in industrial automation and test instrumentation.

FAQ

What is the maximum operating frequency supported by XC3S5000-5FG900C?

The XC3S5000-5FG900C is rated at speed grade -5, guaranteeing timing closure for system clock frequencies up to 333 MHz under worst-case voltage and temperature conditions. Actual achievable frequency depends on design complexity, routing congestion, and I/O standard selection. The XC3S5000-5FG900C datasheet specifies setup/hold times and clock-to-out delays for all I/O standards used in the implementation.

Does XC3S5000-5FG900C support JTAG boundary-scan testing?

Yes, XC3S5000-5FG900C fully supports IEEE 1149.1 JTAG boundary-scan for device programming, debugging, and interconnect testing. The TAP controller is accessible via dedicated TCK, TMS, TDI, and TDO pins, and supports INTEST, SAMPLE/PRELOAD, and BYPASS instructions. This capability is integral to the XC3S5000-5FG900C configuration architecture.

How many Digital Clock Managers (DCMs) does XC3S5000-5FG900C include?

The XC3S5000-5FG900C integrates twelve Digital Clock Managers (DCMs), each capable of input clock doubling, phase shifting, duty cycle correction, and frequency synthesis. These DCMs operate independently per clock domain and are essential for synchronizing multiple I/O banks and internal logic regions in the XC3S5000-5FG900C.

What configuration modes are supported by XC3S5000-5FG900C?

XC3S5000-5FG900C supports Master Serial, Slave Serial, Slave Parallel, and JTAG configuration modes. Master Serial uses an external SPI PROM; Slave modes allow processor-controlled loading; JTAG enables in-system programming and debugging. All modes are documented in the XC3S5000-5FG900C configuration user guide.

Is XC3S5000-5FG900C RoHS compliant?

Yes, XC3S5000-5FG900C is manufactured in compliance with EU RoHS Directive 2011/65/EU and subsequent amendments. The device carries the RoHS-compliant marking on its top-side laser etch and is listed in AMD's official environmental compliance database with full material declarations. This applies to all production lots of XC3S5000-5FG900C shipped after 2006.